• Title/Summary/Keyword: electronic boards

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Power Line Communication Based Public Address System (전력선 통신 기반 전관방송 시스템)

  • Kim, Seok;Kim, Dae-Ik
    • The Journal of the Korea institute of electronic communication sciences
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    • v.12 no.6
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    • pp.1035-1042
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    • 2017
  • In this paper, we implement a public address system using power line communication in order to operate, extend, and expand the complicated public address devices and cables easily. Power line communication based public address system implemented consists of a public address control board and public address speaker boards which are suitable to digital streaming modulation. It can be noticed that we met satisfied results from performance measurement such as maximum audio output, audio channel response time, audio output SNR, and audio output THD+N.

Simulation and Design of Optimized Three-Layer Radiation Shielding to Protect Electronic Boards of Satellite Revolving in Geostationary Earth Orbit (GEO) Orbit against Proton Beams

  • Ali Alizadeh;Gohar Rastegarzadeh
    • Journal of Astronomy and Space Sciences
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    • v.41 no.1
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    • pp.17-23
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    • 2024
  • The safety of electronic components used in aerospace systems against cosmic rays is one of the most important requirements in their design and construction (especially satellites). In this work, by calculating the dose caused by proton beams in geostationary Earth orbit (GEO) orbit using the MCNPX Monte Carlo code and the MULLASSIS code, the effect of different structures in the protection of cosmic rays has been evaluated. A multi-layer radiation shield composed of aluminum, water and polyethylene was designed and its performance was compared with shielding made of aluminum alone. The results show that the absorbed dose by the simulated protective layers has increased by 35.3% and 44.1% for two-layer (aluminum, polyethylene) and three-layer (aluminum, water, polyethylene) protection respectively, and it is effective in the protection of electronic components. In addition to that, by replacing the multi-layer shield instead of the conventional aluminum shield, the mass reduction percentage will be 38.88 and 39.69, respectively, for the two-layer and three-layer shield compared to the aluminum shield.

A Study on the Control System for Piezoelectric Inkjet Head (압전 잉크젯 프린터 헤드 제어에 관한 연구)

  • Lee, Dal-Ho;Han, Hyung-Seok
    • Journal of The Institute of Information and Telecommunication Facilities Engineering
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    • v.8 no.1
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    • pp.30-35
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    • 2009
  • In this paper, the type of inkjet heads and the control of head of inkjet printer are surveyed. The electronic parts of inkjet printer are composed of main- board and sub-board. The inkjet head is controlled by using these boards. The results from silver ink jetting experiment are given. The results show that the implemented inkjet system can give a satisfactory performance.

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Recycling of Separate Glass Fiber from Waste Printed Circuit Boards Using Attrition Mill and DMF (어트리션 밀과 DMF 용매를 이용한 폐 인쇄회로기판에서 분리된 재생 유리섬유의 재활용)

  • Kim, Jong-Seok;Lee, Jae-Cheon;Jeong, Jin-Ki
    • Korean Chemical Engineering Research
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    • v.50 no.5
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    • pp.894-899
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    • 2012
  • In recent years, recycling process has come to be necessary for separating metals, glass fibers and polymer from WPCBs (waste printed circuit boards) due to an increasing amount of electronic device waste. In this study, dimethylformamide (DMF) and attrition mill reactor were used to separate the component such as metals, glass fiber and epoxy resin from WPCBs. Separation of glass fiber from WPCBs was carried out under stirring rates 300~600 revolution per minute (rpm) for 1~2 h as the various agitator. The recycled glass fibers (RGF) were analyzed by thermogravimetric analyzer (TGA) for degree of separation of epoxy resin in the WPCBs. The degree of separation of epoxy resin of WPCBs increased in attrition mill agitator as a mechanochemical process for recycling WPCBs. The RGF separated in the WPCBs was applied as a reinforcement in the RGF/unsaturated polyester composites to reuse as a reinforcement.

DEVELOPMENT OF RPS TRIP LOGIC BASED ON PLD TECHNOLOGY

  • Choi, Jong-Gyun;Lee, Dong-Young
    • Nuclear Engineering and Technology
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    • v.44 no.6
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    • pp.697-708
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    • 2012
  • The majority of instrumentation and control (I&C) systems in today's nuclear power plants (NPPs) are based on analog technology. Thus, most existing I&C systems now face obsolescence problems. Existing NPPs have difficulty in repairing and replacing devices and boards during maintenance because manufacturers no longer produce the analog devices and boards used in the implemented I&C systems. Therefore, existing NPPs are replacing the obsolete analog I&C systems with advanced digital systems. New NPPs are also adopting digital I&C systems because the economic efficiencies and usability of the systems are higher than the analog I&C systems. Digital I&C systems are based on two technologies: a microprocessor based system in which software programs manage the required functions and a programmable logic device (PLD) based system in which programmable logic devices, such as field programmable gate arrays, manage the required functions. PLD based systems provide higher levels of performance compared with microprocessor based systems because PLD systems can process the data in parallel while microprocessor based systems process the data sequentially. In this research, a bistable trip logic in a reactor protection system (RPS) was developed using very high speed integrated circuits hardware description language (VHDL), which is a hardware description language used in electronic design to describe the behavior of the digital system. Functional verifications were also performed in order to verify that the bistable trip logic was designed correctly and satisfied the required specifications. For the functional verification, a random testing technique was adopted to generate test inputs for the bistable trip logic.

Common-Mode Noise Suppression in Switched-Mode Power Supply Boards Using Segmentation Method (구조분할 해석기법 기반 전원보드 공통모드 노이즈 감쇠 설계)

  • Kim, Myunghoi;Roh, Dongkyu;Jeong, Sungseok;Kwak, Kyumin
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.29 no.2
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    • pp.142-145
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    • 2018
  • In this paper, we present a design technique for the suppression of common-mode(CM) noise in switched-mode power supply boards using the segmentation method. By applying the segmentation method, the example structure is decomposed into two segments with decoupling capacitors and a recombination matrix is extracted for the segments. The effects of the decoupling capacitor on CM noise suppression are examined. The simulation time is significantly reduced on using the segmentation method.

Technical Trends in the Patents and Papers for the Recycling of Organic Residues from Waste Printed Circuit Boards (특허(特許)와 논문(論文)으로 본 폐(廢)PCB 유기계(有機界) 잔유물(殘留物) 재활용(再活用) 기술(技術) 동향(動向))

  • Lee, Dai-Soo;Shin, Sera;Cho, Young-Ju;Cho, Bong-Gyoo
    • Resources Recycling
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    • v.22 no.2
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    • pp.71-77
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    • 2013
  • Electronic products such as appliances, computers, and cellular phones have printed circuit boards (PCBs) in common and the PCBs in the waste electronic products contain valuable metals and organic resins. In Korea, recovery and recycling of the organic resins as well as the valuable metallics from the wastes are required indeed as the most of resources are being imported from abroad. In this article, the patents and papers for the recycling of organic residues from the waste PCBs were collected and analyzed. The open patents of USA (US), European Union (EP), Japan (JP), and Korea (KR) and SCI journals from 1979 to 2012 were investigated. The patents and journals were collected using key-words and filtered by the definition of the technology. The patents and journals were analyzed by the years, countries, companies, and technologies and the technical trends were discussed in this paper. It is showed sluggish relatively activity of published papers and patent applications for polymer manufacturing technology in local and abroad.

128duino : An Extension of the Arduino Platform for ATmega128 (128duino : ATmega128을 위한 아두이노 플랫폼의 확장)

  • Choi, Hun;Heo, Gyeongyong
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.24 no.10
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    • pp.1369-1375
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    • 2020
  • Arduino is a microcontroller platform for non-IT major students, and is widely used as a learning tool. Several AVR series microcontrollers are used in Arduino boards, but ATmega128 is not used. ATmega128 is widely used because of its high expandability and competitive price compared to ATmega328 and ATmega2560 used in Arduino boards. Therefore, by allowing ATmega128 to be used in an Arduino environment, the usability of existing hardware and the Arduino platform can be improved. In this paper, proposed are an Arduino-compatible board design based on ATmega128 and ways to use the ATmega128-based board. As the strengthes of the Arduino platform can be used while utilizing existing hardware in the proposed extension, it is expected that the proposed one can be used in various microcontroller-related education and enhance the learning efficiency.

Efficient Object Recognition by Masking Semantic Pixel Difference Region of Vision Snapshot for Lightweight Embedded Systems (경량화된 임베디드 시스템에서 의미론적인 픽셀 분할 마스킹을 이용한 효율적인 영상 객체 인식 기법)

  • Yun, Heuijee;Park, Daejin
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.26 no.6
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    • pp.813-826
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    • 2022
  • AI-based image processing technologies in various fields have been widely studied. However, the lighter the board, the more difficult it is to reduce the weight of image processing algorithm due to a lot of computation. In this paper, we propose a method using deep learning for object recognition algorithm in lightweight embedded boards. We can determine the area using a deep neural network architecture algorithm that processes semantic segmentation with a relatively small amount of computation. After masking the area, by using more accurate deep learning algorithm we could operate object detection with improved accuracy for efficient neural network (ENet) and You Only Look Once (YOLO) toward executing object recognition in real time for lightweighted embedded boards. This research is expected to be used for autonomous driving applications, which have to be much lighter and cheaper than the existing approaches used for object recognition.

Deposition behavior of cyanide-free electroless Au plating solution using thiomalic acid as complexing agent and aminoethanethiol as reducing agent and characteristics of plated Au film (티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성)

  • Han, Jaeho;Kim, DongHyun
    • Journal of the Korean institute of surface engineering
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    • v.55 no.2
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    • pp.102-119
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    • 2022
  • Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.