1 |
Lee, J. K., Kim, S. Y. and Ju, C. S., "Improvement of Tensile Strength of Polyester Resin Using Silica/Chopped Glass Fiber Modified by Coupling Agent," Korean Chem. Eng. Res.(HWAHAK KONGHAK), 50, 30(2012).
DOI
ScienceOn
|
2 |
Feith, S., Boiocchi, E., Mathys, G., Mathys, Z., Gibson, A. G. and Mouriz, A. P., "Mechanical Properties of Thermally-treated and Recycled Glass Fibers," Composites: Part B, 42, 350(2011).
DOI
ScienceOn
|
3 |
Koyanaka, S., Endoh, S. and Ohya, H., "Effect of Impact Velocity Control on Selective Grinding of Waste Printed Circuit Boards," Advan. Powder. Tech., 17, 113(2006).
DOI
ScienceOn
|
4 |
Dang, W., Kubouchi, M., Sembokuyu, H. and Tsuda, K., "Chemical Recycling of Glass Fiber Rein Forced Epoxy Resin Cured with Amine Using Nitric Acid," Polymer., 46, 1905(2005).
DOI
ScienceOn
|
5 |
Park, Y. J. and Fray, D. J., "Recovery of High Purity Precious Metals from Printed Circuit Boards," J. Hazard. Mater., 164, 1152(2009).
DOI
ScienceOn
|
6 |
Goto, M., Sasaki, M. and Hirose, T., "Reaction of Polymers in Supercritical Fluids for Chemical Recycling of Waste Plastics," J. Mater. Sci., 41, 1509(2006).
DOI
ScienceOn
|
7 |
Braun, D., Gentzkow, W. and Rudolf, A. P., "Hydrogenolytic Degradation of Thermosets," Polym. Degrad. Stabil., 74, 25(2001).
DOI
ScienceOn
|
8 |
Cunliffe, A. M., Jones, N. and Williams, P. T., "Pyrolysis of Composites Plastic Waste," Environ. Technol., 24, 653(2003).
DOI
ScienceOn
|
9 |
Giulvezan, G. and Carberry, W., "Composites Recycling and Disposal-an Environmental R&D Issue," Boeing Environ Technotes, 8, 1(2003).
|
10 |
Hwang, T. S., Choi, D. M., Choi, J. R., Lim, J. H. and Park, J. K., "Effect of Coupling Agent (3-metylacryloxyvinyl silane) on the Mechanical Properties of Waste FRP/unsaturated Polyester Composites," Korean J. Mater. Research., 8, 13(1998).
|
11 |
Lee, S. H., Choi, H. O., Kim, J. S., Lee, C. K., Kim, Y. K. and Ju, C. S., "Circulating Flow Reactor for Recycling Carbon Fiber from Fiber Reinforced Epoxy Composites," Korean J. Chem. Eng., 28, 449(2011).
DOI
|
12 |
Zang, S. and Forssberg, E., "Mechanical Separation-oriented Characterization of Electronic Scrap," Resour. Conserv. Recycl., 21, 247(1997).
DOI
ScienceOn
|
13 |
Yoo, J. M., Jeong, J. K., Yoo, K. K., Lee, J. C. and Kim, W. B., "Enrichment of the Metallc Components from Waste Printed Circuit Boards by a Mechanical Separation Precess Using a Stamp Mill," Wast. Manage., 29, 1132(2009).
DOI
ScienceOn
|
14 |
Lee, J. C., Song, H. T. and Yoo, J. M., "Present Status of the Recycling of Waste Electrical and Electronic Equipment in Korea," Resour. Conserv. Recycl., 50, 380(2007).
DOI
ScienceOn
|
15 |
Kelly, E. J., "Base Material Components," in Printed Circuits Handbook, C. F. Coombs, Editor, McGraw-Hill, New York, Vol 1, Chap. 7(2008).
|
16 |
Guo, J., Li, J., Rao, Q. and Xu, Z., "Phenolic Molding Compound Filled with Nonmetals of Waste PCBs," Environ. Sci. Technol., 42, 624(2008).
DOI
ScienceOn
|
17 |
Hall, W. J. and Williams, P. T., "Separation and Recovery of Materials from Scrap Printed Circuit Boards," Resour. Conserv. Recycl., 51, 691(2007).
|
18 |
Guo, J., Guo, Jie. and Xu, Z., "Recycling of Non-metallic Fractions from Waste Printed Circuit Boards: A Review," J. Hazard. Mater., 168, 567(2009).
DOI
ScienceOn
|
19 |
Sato, Y., Kondo, Tsujita, Y. K. and Kawai, N., "Degradation Behaviour and Recovery of Bisphenol-A from Epoxy Resin and Polycarbonate Resin by Liquid-phase Chemical Recycling," Polym. Degrad. Stabil., 89, 317(2005).
DOI
ScienceOn
|