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http://dx.doi.org/10.9713/kcer.2012.50.5.894

Recycling of Separate Glass Fiber from Waste Printed Circuit Boards Using Attrition Mill and DMF  

Kim, Jong-Seok (School of Chemical Engineering, Chonbuk National University)
Lee, Jae-Cheon (Mineral Resource Division, Korea Institute of Geoscience and Mineral Resources)
Jeong, Jin-Ki (Mineral Resource Division, Korea Institute of Geoscience and Mineral Resources)
Publication Information
Korean Chemical Engineering Research / v.50, no.5, 2012 , pp. 894-899 More about this Journal
Abstract
In recent years, recycling process has come to be necessary for separating metals, glass fibers and polymer from WPCBs (waste printed circuit boards) due to an increasing amount of electronic device waste. In this study, dimethylformamide (DMF) and attrition mill reactor were used to separate the component such as metals, glass fiber and epoxy resin from WPCBs. Separation of glass fiber from WPCBs was carried out under stirring rates 300~600 revolution per minute (rpm) for 1~2 h as the various agitator. The recycled glass fibers (RGF) were analyzed by thermogravimetric analyzer (TGA) for degree of separation of epoxy resin in the WPCBs. The degree of separation of epoxy resin of WPCBs increased in attrition mill agitator as a mechanochemical process for recycling WPCBs. The RGF separated in the WPCBs was applied as a reinforcement in the RGF/unsaturated polyester composites to reuse as a reinforcement.
Keywords
WPCBs; Attrition Mill; Glass Fiber; Recycling;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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1 Lee, J. K., Kim, S. Y. and Ju, C. S., "Improvement of Tensile Strength of Polyester Resin Using Silica/Chopped Glass Fiber Modified by Coupling Agent," Korean Chem. Eng. Res.(HWAHAK KONGHAK), 50, 30(2012).   DOI   ScienceOn
2 Feith, S., Boiocchi, E., Mathys, G., Mathys, Z., Gibson, A. G. and Mouriz, A. P., "Mechanical Properties of Thermally-treated and Recycled Glass Fibers," Composites: Part B, 42, 350(2011).   DOI   ScienceOn
3 Koyanaka, S., Endoh, S. and Ohya, H., "Effect of Impact Velocity Control on Selective Grinding of Waste Printed Circuit Boards," Advan. Powder. Tech., 17, 113(2006).   DOI   ScienceOn
4 Dang, W., Kubouchi, M., Sembokuyu, H. and Tsuda, K., "Chemical Recycling of Glass Fiber Rein Forced Epoxy Resin Cured with Amine Using Nitric Acid," Polymer., 46, 1905(2005).   DOI   ScienceOn
5 Park, Y. J. and Fray, D. J., "Recovery of High Purity Precious Metals from Printed Circuit Boards," J. Hazard. Mater., 164, 1152(2009).   DOI   ScienceOn
6 Goto, M., Sasaki, M. and Hirose, T., "Reaction of Polymers in Supercritical Fluids for Chemical Recycling of Waste Plastics," J. Mater. Sci., 41, 1509(2006).   DOI   ScienceOn
7 Braun, D., Gentzkow, W. and Rudolf, A. P., "Hydrogenolytic Degradation of Thermosets," Polym. Degrad. Stabil., 74, 25(2001).   DOI   ScienceOn
8 Cunliffe, A. M., Jones, N. and Williams, P. T., "Pyrolysis of Composites Plastic Waste," Environ. Technol., 24, 653(2003).   DOI   ScienceOn
9 Giulvezan, G. and Carberry, W., "Composites Recycling and Disposal-an Environmental R&D Issue," Boeing Environ Technotes, 8, 1(2003).
10 Hwang, T. S., Choi, D. M., Choi, J. R., Lim, J. H. and Park, J. K., "Effect of Coupling Agent (3-metylacryloxyvinyl silane) on the Mechanical Properties of Waste FRP/unsaturated Polyester Composites," Korean J. Mater. Research., 8, 13(1998).
11 Lee, S. H., Choi, H. O., Kim, J. S., Lee, C. K., Kim, Y. K. and Ju, C. S., "Circulating Flow Reactor for Recycling Carbon Fiber from Fiber Reinforced Epoxy Composites," Korean J. Chem. Eng., 28, 449(2011).   DOI
12 Zang, S. and Forssberg, E., "Mechanical Separation-oriented Characterization of Electronic Scrap," Resour. Conserv. Recycl., 21, 247(1997).   DOI   ScienceOn
13 Yoo, J. M., Jeong, J. K., Yoo, K. K., Lee, J. C. and Kim, W. B., "Enrichment of the Metallc Components from Waste Printed Circuit Boards by a Mechanical Separation Precess Using a Stamp Mill," Wast. Manage., 29, 1132(2009).   DOI   ScienceOn
14 Lee, J. C., Song, H. T. and Yoo, J. M., "Present Status of the Recycling of Waste Electrical and Electronic Equipment in Korea," Resour. Conserv. Recycl., 50, 380(2007).   DOI   ScienceOn
15 Kelly, E. J., "Base Material Components," in Printed Circuits Handbook, C. F. Coombs, Editor, McGraw-Hill, New York, Vol 1, Chap. 7(2008).
16 Guo, J., Li, J., Rao, Q. and Xu, Z., "Phenolic Molding Compound Filled with Nonmetals of Waste PCBs," Environ. Sci. Technol., 42, 624(2008).   DOI   ScienceOn
17 Hall, W. J. and Williams, P. T., "Separation and Recovery of Materials from Scrap Printed Circuit Boards," Resour. Conserv. Recycl., 51, 691(2007).
18 Guo, J., Guo, Jie. and Xu, Z., "Recycling of Non-metallic Fractions from Waste Printed Circuit Boards: A Review," J. Hazard. Mater., 168, 567(2009).   DOI   ScienceOn
19 Sato, Y., Kondo, Tsujita, Y. K. and Kawai, N., "Degradation Behaviour and Recovery of Bisphenol-A from Epoxy Resin and Polycarbonate Resin by Liquid-phase Chemical Recycling," Polym. Degrad. Stabil., 89, 317(2005).   DOI   ScienceOn