• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.1
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• pp.19-25
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• 2003

Electromigration characteristics of eutectic SnPb solder were studied using thin stripe-type test structures. Significant changes in the microstructure were observed after electromigration test, in which the temperature and the current density were varied from 80 to 100 $^{\circ}C$ and from 4.6${\times}$10$^4$A/$\textrm{cm}^2$ to 8.7${\times}$10$^4$A/$\textrm{cm}^2$. While voids or local thinning were found near the cathode end, hillocks were mainly observed near the anode end. From resistance measurements, it was calculated that the activation energy of the eutectic SnPb solder for electromigration was 0.77 eV. The dominant migrating element along the electron flow at 100$^{\circ}C$ was Pb.

• Journal of Welding and Joining
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• v.23 no.5
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• pp.49-54
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• 2005

The effective charge number and the critical current density of electromigration in eutetic SnPb and Pb Free $(SnAg_{3.8}Cu_{0.7)$ flip chip solder bumps are studied. The effective charge number of electromigration in eutectic SnPb solder is obtained as 34 and the critical current density is $j=0.169{\times}({\delta}_{\sigma}/{\delta}_x})\;A/cm^2,\;where\;({\delta}_{\sigma}/{\delta}_x})$ is the electromigration-induced compressive stress gradient along the length of the line. While the effect of electromigration in Pb free solder is much smaller than that in eutectic SnPb, the product of diffusivity and effective charge number $DZ^{\ast}$ has been assumed as $6.62{\times}10^{-11}$. The critical length for electromigration are also discussed.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.43-48
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• 2004

Electromigration of Sn-3.5Ag-0.5Cu solder bumps was investigated with current densities of $3{\~}4{\times}10^4 A/cm^2$ at temperatures of $130{\~}160^{\circ}C$ using flip chip specimens which consisted of upper Si chip and lower Si substrate. Electromigration failure of the Sn-3.5Ag-0.5Cu solder bump occurred with complete consumption of Cu UBM and void formation at cathode side of the solder bump. The activation energies for electromigration of the Sn-3.5Ag-0.5Cu solder bump were measured as 0.61 eV at current density of $3{\times}10^4 A/cm^2$, 0.63 eV at $3.5{\times}10^4 A/cm^2$, and 0.77 eV at $4{\times}10^4 A/cm^2$, respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.63-67
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• 2003

Electromigration characteristics of $SnAg_3Cu_{0.7}$ and eutectic SnPb solder were studied using thin stripe-type test structures. Significant changes in the microstructure of two solders were observed after electromigration test, in which the temperature and the current density were varied from 90 to $110^{\circ}C$ and from $4.0\times10^4\;A/cm^2\;to\;9.2\times10^4\;A/cm^2$. In SnAgCu solders, hillocks were main]y observed near the anode end. From resistance measurements, it was calculated that the activation energy of the SnAgCu solder for electromigration was 1.04 eV And in eutectic SnPb without the effect of pads, while depleted region was found near cathode end, Sn-rich hillocks were observed near the anode end. During eutectic SnPb electromigration, it were observed that electromigration behavior had two migration modes.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.310-314
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• 2008

Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.27-30
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• 2001

Electromigration Phenomena in Al-1%Si thin film interconnections under DC and PDC conditions were investigated. Thin film interconnections with $SiO_2$ and PSG/$SiO_2$ dielectric passivation layer were formed by a standard photolithography process method and test line lengths were 100, 400, 800, 1200, and 1600 $\mu\textrm{m}$. The current density of $1.19\times10^7\textrm{A/cm}^2$ was stressed in Al-1%Si thin film interconnections under DC condition. The current density of $1.19\times10^7\textrm{A/cm}^2$ was also applied under PDC condition at the frequency of 1 Hz with the duty factor of 0.5. The electromigration resistance of PSG/SiO2 dielectric passivation test line was stronger than $SiO_2$ dielectric passivation test line. The lifetime under PDC was 2-4 times longer than DC condition. As the thin film interconnection line increased, the lifetime decreased and saturated over the critical length. Failure patterns by an electromigration were dominated by void-induced electrical open and hillock-induced electrical short.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.40-42
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• 2002

Electromigration is atomic diffusion driven by a momentum transfer from conducting electrons. With every new generation of intergrated circuits, interconnect line widths have been reduced and current densities in the interconnect have become higher. This leads to an increase in the threat to interconnect reliability due to electromigration. In this paper, we simulated stress evolution with changing temperature, duty factor(ratio of on time and pulse time), frequency under pulsed DC condition. As a result, we predict MTF(median time to failure) and found that exponent n is affected by changing temperature, duty factor.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.06a
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• pp.48-49
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• 1995

전자소자의 축소화에 따라 electromigration은 점차 반도체 디바이스의 주요 결함 원 인으로 부각되고 있다. 본 실험은 현재 배선 재료로 널리 사용되고 있는 Al-1%Si 금속박막 배선의 electromigration에 대한 온도 및 배선길이 의존성에 관하여 연구하였다. ppLCC(pplastic Leaded Chipp Carrier) ppackage된 ppSG(8000$\AA$)/SiO2(1000$\AA$)/Al-1%Si(7000 $\AA$)/SiO2(5000$\AA$)/pp-typpe Si(100)의 보호막처리된 시편과 Al-1%Si/SiO2(5000$\AA$)/pp-typpe Si(100)의 보호막처리되지 않은 시편등을 standard pphotolithograpphy 공정을 이용하여 각각 제작하였다. 선폭 3$mu extrm{m}$, 길이 100, 400, 800, 1600$\mu\textrm{m}$의 등의 Al-1%Si 박막배선구조를 사용하 였다. 가속화실험을 위해 인가된 D.C 전류밀도는 4.5$\times$106A/cm2이었고 실온에서 10$0^{\circ}C$까지 의 분위기 온도에서 electromigration를 실행하였다. 박막배선길이에 따른 MTF(Mean Time-to-Failure)는 임계길이 이상에서 포화되는 경향을 보이며 임계길이는 Al-1%Si 박막 배선에서 분위기온도에 따라 길이 400$\mu\textrm{m}$과 800$\mu\textrm{m}$범위에서 나타났다. 각 시편에서 electromigration에 대한 활성화에너지도 MTF의 특성과 유사하게 임계길이 이상에서 포화 되는 특성을 타나내었다.

• Journal of the Korean Vacuum Society
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• v.4 no.3
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• pp.327-333
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• 1995

전자소자의 축소화에 따라 박막배선에서의 electromigration은 점차 극소전자 디바이스의 주요 결함원인으로 부각되고 있다. 본 실험에서는 현재 박막 배선 재료로 가장 널리 사용되고 있는 AI-1%Si 금속박막배선의 electromigration에 대한 온도 및 배선길이의 의존성에 관하여 연구하였다. PSG($8000AA$)/SiO2(1000$\AA$)/AI-1%Si(7000$\AA$)/SiO2(5000$\AA$)/p-Si(100)의 보호막처리되지 않은 시편 등을 standard photolithography 공정을 이용하여 각각 제작하였다. 선폭 3$\mu$m, 길이 100, 400, 800, $\1600mu$m등의 AI-1%Si 배막배선구조를 사용하였다. 가속화실험을 위해 인가된 d.c.전류밀도는 4.5X106A/$ extrm{cm}^2$이었고 실온에서 $100^{\circ}C$까지의 분위기 온도에서 electromigration test를 진행하였다. 박막배선의 길에에 따른 MTF(Mean-Time-to-Failure)는 임계길이 이상에서 포화되는 경향을 보이며 이는 보호막층의 유무에 관계없이 나타난다. 선폭 $3\mu$m인 AI-1%Si 박막배선에서 임계길이는, 보호막처리된 시편은 $800\mu$m, 보호막처리되지 않은 시편은 $400\mu$m 배선길이에서 나타난다. 이러한 포화의 경향은 낮은 온도에서 더욱 명확해지는 특성을 보인다. 각 시편에서 electromigration에 대한 활성화에너지도 MTF의 특성과 유사하게 임계길이 이상에서 포화되는 특성을 보인다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.16.2-16.2
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• 2007