• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.336-343
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• 2009

Nickel oxide thin films exhibit the resistive switching as a function of applied voltages. The switching phenomena involve low and high resistance states after electroforming. The electrical features are believed to be associated with the formation and rupture of filaments. The set and reset behaviors are controlled by the oxidation and reduction of filaments. The indirect evidence of filaments is corroborated by the presence of nanocrystalline nickel oxides found in high-resolution transmission electron microscopy. The insertion of insulating layers seems to control the current-voltage characteristics by preventing the continuous formation of conductive filaments, potentially leading to artificial control of resistive behaviors in NiO-based systems.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.99.1-99.1
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• 2016

The materials for an electronic packaging provide diverse important functions including electrical contact to transfer signals from devices, isolation to protect from the environment and a path for heat conduction away from the devices. The packaging materials composed of metals, ceramics, polymers or combinations are crucial to the device operating properly and reliably. The demand of effective charge and heat transfer continuous to be challenge for the high-speed and high-power devices. Nanomaterials including graphene, carbon nanotube and boron nitride, have been designed for the purpose of exploiting the high thermal, electrical and mechanical properties by combining in the matrix of metal or polymer. In addition, considering the inherent electrical and surface properties of graphene, it is expected that graphene would be a good candidate for the surface layer of a template in the electroforming process. In this talk, I will present recent our on-going works in nanomaterials for microelectronic packaging: 1) porous graphene/Cu for heat dissipations, 2) carbon-metal composites for interconnects and 3) nanomaterials-epoxy composites as a thermal interface materials for electronic packaging.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.04a
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• pp.15-19
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• 2003

Polymeric micro lens arrays with diameters of $13\~96\;{\mu}m$ fabricated using the micro-compression molding with electro formed mold inserts. In the present study, the electro forming process was used to make the metallic micro-mold insert for micro-molding of microlens array. The wettability property of the fabricated mold insert was examined by measuring the contact angle of the polymer melt on the mold insert. Microlenses were compression-molded with the fabricated mold insert. The effects of the molding temperature and wettability property on the replication quality of the molded lenses were analyzed experimentally.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1194-1199
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• 2007

A unique fabrication method for a copper micromesh is proposed and demonstrated. A PDMS mold was fabricated using a microcasting process and then used as a flexible mold in copper electroplating. The fabricated copper micromesh was well formed and connected without any cracks within the entire mold area. The experimental results verified that the fabricated features of the copper micromesh accurately followed the shape of the microstructures of the PDMS mold. This unique fabrication method provides an easy yet precise means of producing three-dimensional metal microstructures.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.60-63
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• 2011

BLU(back light unit) is one of kernel parts of LCD(liquid crystal display) unit. New 3-D micro-lens pattern for LGP(light guide plate), one of the most important parts of LCD-BLU, had been researched. Instead of dot pattern made by chemical etching or laser ablation, SCS(slanted curved surface) micro-lens pattern was designed with optical CAE simulation. This study introduce the method of design using optical CAE simulation for SCS micro-lens, the new fabrication method of micro-mold with SCS micro-lens pattern.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.23-28
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• 2011

For the fabrication of nano patterned products manufacturing a nano patterned mold is needed in advance. The nano patterned stamper was fabricated by electroforming the AAO master with nickel. The surface of nickel-plated stamper had nano-patterned holes with the diameter of 73 nm and the depth of 83 nm. Hot embossing was used for forming P3HT sheet and the process factors of hot embossing were closer as pressure, temperature and time. In the present paper hot embossing experiments were performed to find the main process conditions to affect the replication ratio of nano patterns on surface of P3HT sheet. As a result, main contributing factors for the replication ratio of hot embossed pattern could be sequentially enumerated as pressure, temperature and time.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.34-41
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• 2006

Microlens arrays were fabricated by a modified LIGA process composed of the exposure of a PMMA (Polymethylmethacrylate) sheet to deep x-rays and subsequent thermal treatment. A successful modeling and analyses for microlens formation were presented according to the experimental procedure. A nickel mold insert was fabricated by the nickel electroforming process on the PMMA microlens arrays fabricated by the modified LIGA process. For the replication of microlens arrays having various diameters with different foci on the same substrate, both hot embossing and microinjection molding processes have been successfully utilized with the fabricated mold insert. Replicated microlenses showed very good surface roughness with the order of 1 nm. The focal lengths of the injection molded microlenses were successfully estimated theoretically and also measured experimentally.

• Transactions of Materials Processing
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• v.14 no.7 s.79
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• pp.624-627
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by I-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50nm in diameter, 150nm in pitch, and 50nm in depth.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.468-472
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• 2003

MRE-1 dual thruster module(DTM) which will be installed to the present under development KOMPSAT(Korea Multi-Purpose Satellite) can provide reliable and cost-effective means of propulsive control for attitude and maneuvering control system. Thruster heat shield, one of the main components of DTM, is designed to intercept the radiative heat exchange between thruster and satellite during firing. The inside diameter of the current configuration will be decreased a little compared with that of the previous one due to manufacturing method change. Therefore, the possibility of interference between thruster and heat shield due to configuration change is investigated through structural analysis and their results are described in this paper.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.419-423
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• 2008

A new polymer replication technology using ultrasonic vibration is proposed and demonstrated. A commercial ultrasonic welder has been used in this experiment. Two different types of nickel molds have been fabricated: pillar type and pore type microstructures. Polymethyl methacrlylate (PMMA) has been used as the replication material and the optimal molding time was 2 sec and 2.5 sec for pillar-type and pore-type micromolds, respectively. Compared with the conventional polymer micromolding techniques, the proposed ultrasonic micromolding technique has the shortest processing time. In addition, only contact area between micromold and polymer substrate is melted so that the thermal shrinkage can be minimized. The fabricated PMMA microstructures have been very accurately replicated without vacuum. The proposed ultrasonic molding technique is a good alternative for high volume production.