• 제목/요약/키워드: electrochemical phenomenon

검색결과 71건 처리시간 0.028초

점 전극을 이용한 마이크로 전해현상의 고찰 (A Study on the micro-electrochemical phenomenon using point electrode method)

  • 김봉규;박규열
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.1093-1096
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    • 2001
  • Eletrochemical phenomenon are employed in the manufacturing of micro-electrochemical machining(micro-ECM). The application of controlled electrochemical metal removal in the fabrication of microstructures and microcomponents is refer to as micro-electrochemical machining. In this paper, we introduce a new method named $\ulcorner$point-electrode electro chemical machining method$\lrcorner$ was proposed to establish micro fabrication technology by use of electrochemical machining. And we find effect of the electrochemical phenomenon in several conditions.

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점 전극을 이용한 전해연마법의 제안 (A proposal of the electrochemical polishing method using the point electrode tools)

  • 이승훈
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1998년도 추계학술대회 논문집
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    • pp.48-53
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    • 1998
  • In this paper, the new electrochemical machining method is proposed for the micro unit fabrication by using the point electrode tools. The precision shape control capacity is improved by using the point electrode method. It was observed that an electric discharge phenomenon occurs during the electrochemical machining process by using the spraying and torrent type electrolyte supply method.

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공정조성 SnPb Solder 합금의 부식 및 Electrochemical Migration 특성에 미치는 SO42- 이온의 영향 (Effect of SO42- Ion on Corrosion and Electrochemical Migration Characteristics of Eutectic SnPb Solder Alloy)

  • 정자영;유영란;이신복;김영식;주영창;박영배
    • 한국재료학회지
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    • 제17권1호
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    • pp.43-49
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    • 2007
  • Electrochemical migration phenomenon is correlated with ionization of anode electrode, and ionization of anode metal has similar mechanism with corrosion phenomenon. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in $Na_2SO_4$ solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Sn Ivas primarily ionized in ${SO_4}{^2-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for electrochemical migration resistance of solder alloys.

Fundamentals of Percolation Phenomenon with Emphasis on Its Concept in Disordered Electrochemical Systems

  • Jung Kyu-Nam;Pyun Su-Il
    • 전기화학회지
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    • 제7권3호
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    • pp.155-162
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    • 2004
  • This article covers the fundamentals of percolation phenomenon giving emphasis to the percolation concept involved in disordered electrochemical systems. After a brief discourse on the basic concepts of percolation theory, the geometrical properties and fractality of percolation clusters were presented. Then, anomalous behaviours of diffusion in percolation clusters were explained in terms of the fractal structures of the infinite percolation clusters. Finally, the conductivity-related properties of composite ionic materials were shortly discussed on the basis of percolation theory from practical points of view.

The Electrochemical Migration Phenomenon of the Ni-Cr Seed Layer of Sputtered FCCL

  • Ahn, Woo-Young;Jang, Joong Soon
    • 한국표면공학회지
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    • 제47권2호
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    • pp.63-67
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    • 2014
  • As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.

전자부품의 금속소재에 따른 Electrochemical Migration에 대한 신뢰성 설계기술개발 (Development of Reliability Design Technology about Electrochemical Migration by Metal of Electronic Components)

  • 이신복;정자영;박영배;주영창
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1724-1729
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    • 2007
  • Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature/humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the Electrochemical migration

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PCB 전기적 신뢰성평가를 위한 이온 마이그레이션 가속시험 (Acceleration Test of Ion Migration for PCB Electronic Reliability Evaluation)

  • 이덕보;김정현;강수근;장석원;임재훈;유동수
    • 동력기계공학회지
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    • 제9권1호
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    • pp.64-69
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    • 2005
  • In evaluation of electronic reliability on the PCB(Print Circuit Borad),electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs in the environment of the hight humidity and the hight temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water drop acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity of electrochemical migration depended on electrolyte quantity which included in the various waters.

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텅스텐 미세 전극을 이용한 전해 가공 (Electrochemical Machining Using Tungsten Microelectrode)

  • 류시형;유종선
    • 한국정밀공학회지
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    • 제26권4호
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    • pp.134-140
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    • 2009
  • The feasibility of electrochemical drilling and milling on stainless steel are investigated using tungsten microelectrode with $10{\mu}m$ in diameter. For the development of environmentally friendly and safe electrochemical process, citric acid solution is used as electrolyte. A few hundred nanoseconds duration pulses are applied between the microelectrode and work material for dissolution localization. Tool fracture by Joule heating, micro welding, capillary phenomenon, tool wandering by the generated bubbles are observed and their effects on micro ECM are discussed. Occasionally, complex textures including micro pitting corrosion marks appeared on the hole inner surface. Metal growth is also observed under the weak electric conditions and it hinders further dissolutions for workpiece penetration. By adjusting appropriate pulse and chemical conditions, micro holes of $37{\mu}m$ in diameter with $100{\mu}m$ in depth and 26Jim in diameter with $50{\mu}m$ in depth are drilled on stainless steel 304. Also, micro grooves with $18{\mu}m$ width and complex micro hand pattern are machined by electrochemical milling.

Conduction Mechanism of Charge Carriers in Electrodes and Design Factors for the Improvement of Charge Conduction in Li-ion Batteries

  • Akhtar, Sophia;Lee, Wontae;Kim, Minji;Park, Min-Sik;Yoon, Won-Sub
    • Journal of Electrochemical Science and Technology
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    • 제12권1호
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    • pp.1-20
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    • 2021
  • In-depth knowledge of electrode processes is crucial for determining the electrochemical performance of lithium-ion batteries (LIBs). In particular, the conduction mechanisms of charged species in the electrodes, such as lithium ions (Li+) and electrons, are directly correlated with the performance of the battery because the overall reaction is dependent on the charge transport behavior in the electrodes. Therefore, it is necessary to understand the different electrochemical processes occurring in electrodes in order to elucidate the charge conduction phenomenon. Thus, it is essential to conduct fundamental studies on electrochemical processes to resolve the technical challenges and issues arising during the ionic and electronic conduction. Furthermore, it is also necessary to understand the transport of charged species as well as the predominant factors affecting their transport in electrodes. Based on such in-depth studies, potential approaches can be introduced to enhance the mobility of charged entities, thereby achieving superior battery performances. A clear understanding of the conduction mechanism inside electrodes can help overcome challenges associated with the rapid movement of charged species and provide a practical guideline for the development of advanced materials suitable for high-performance LIBs.

Use of Local Electrochemical Methods (SECM, EC-STM) and AFM to Differentiate Microstructural Effects (EBSD) on Very Pure Copper

  • Martinez-Lombardia, Esther;Lapeire, Linsey;Maurice, Vincent;De Graeve, Iris;Klein, Lorena;Marcus, Philippe;Verbeken, Kim;Kestens, Leo;Gonzalez-Garcia, Yaiza;Mol, Arjan;Terryn, Herman
    • Corrosion Science and Technology
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    • 제16권1호
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    • pp.1-7
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    • 2017
  • When aiming for an increased and more sustainable use of metals a thorough knowledge of the corrosion phenomenon as function of the local metal microstructure is of crucial importance. In this work, we summarize the information presented in our previous publications[1-3] and present an overview of the different local (electrochemical) techniques that have been proven to be effective in studying the relation between different microstructural variables and their different electrochemical behavior. Atomic force microscopy (AFM)[1], scanning electrochemical microscopy (SECM)[2], and electrochemical scanning tunneling microscopy (EC-STM)[3] were used in combination with electron backscatter diffraction (EBSD). Consequently, correlations could be identified between the grain orientation and grain boundary characteristics, on the one hand, and the electrochemical behavior on the other hand. The grain orientation itself has an influence on the corrosion, and the orientation of the neighboring grains also seems to play a decisive role in the dissolution rate. With respect to intergranular corrosion, only coherent twin boundaries seem to be resistant.