• Proceedings of the Korean Society of Marine Engineers Conference
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• 2005.11a
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• pp.196-197
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• 2005

Cathodic protection is one of the successful ways to prevent corrosion of steel structures in marine environments. The unique feature of cathodic protection in seawater is the formation of calcareous deposits on cathodic metal surface. The formation principles of calcareous deposit seawater had been known for a long time. That is, cathodic reduction reactions associated with cathodic protection in seawater generate $OH^-$ at the metal surface in accordance with the formular ; 1/2 $O_2$ + $H_2O$ + $2e^-$ $2OH^-$ and $2H_2O$ + $2e^-$ ${\rightarrow}$ $H_2$ + $2OH^-$. These reactions increase the pH at the metal / seawater interface. The high pH causes precipitation of $Mg(OH)_2$ and $CaCO_3$ in accordance with the formular ; $Mg^{2+}$ + $2(OH)^-$ ${\rightarrow}$ $Mg(OH)_2$ and $Ca^{2+}$ + $HCO_3^-$ + $OH^-$ ${\rightarrow}$ $H_2O$ + $CaCO_3$. These are typically the main compounds in calcareous deposits. It obviously has several advantages compared to the conventional coatings, since the environment-friendly calcareous deposit coating is formed by the elements($Mg^{2+}$, $Ca^{2+}$) naturally present in seawater. In this study, environmental friendly calcareous deposit films were prepared on steel plates by electro plating technic in natural seawater. The influence of current density on composition ratio, structure and morphology of the coated films were investigated by scanning electron microscopy formation process of calcareous deposits films in natural seawater. And we confirmed the properties of all the films can be improved greatly by controlling the material structure and morphology with effective use of the electroplating method in natural seawater.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.4
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• pp.134-139
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• 2008

A spirally arrayed nano-pattern is designed as a model pattern for the next generation optical storage media. The pattern consists off types of embossed rectangular dot, which are 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The height of the dot is designed to be 50nm. The pitch of the spiral track of the pattern is 100nm. A ER(Electron resist) master for this pattern is fabricated by e-beam lithography process. The ER is first spin-coated to be 50nm thick on a Si wafer and then the model pattern is written on the coated ER layer by e-beam. After developing this pattern written wafer in the solution, a ER pattern master is fabricated. The most conventional e-beam machine can write patterns in orthogonal way, so we made our own pattern generator which can write the pattern in circular or spiral way. This program generates the patterns to be compatible with the e-beam machine from Raith(Raith 150). To fabricate 50nm pattern master precisely, a series of experiments were done including the design compensation for the pattern size, optimization of the dose, acceleration voltage, aperture size and developing. Through these experiments, we conclude that the higher accelerating voltages and smaller aperture size are better for mastering the nano pattern which is in order of 50nm. With the optimized e-beam lithography process, a spiral arrayed 50nm pattern master adopting PMMA resist was fabricated to have dimensional accuracy over 95% compared to the designed. Using this pattern master, a metal pattern stamp will be fabricated by Ni electro plating for injection molding of the patterned plastic substrate.

• Journal of the Korean institute of surface engineering
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• v.45 no.6
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• pp.248-256
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• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.98.1-98.1
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• 2018

소듐냉각 고속로 (SFR)는 원자력 발전의 가장 시급한 문제점으로 부각되고 있는 사용 후 핵연료를 재활용 하여 가동하는 원자로 이다. Generation IV로 명명되는 차세대 원자로 중에 하나로 국제 공동연구와 자체 연구를 통해 우리나라 고유의 기술이 축적되고 개발되고 있다. 현재 소듐냉각 고속로의 가장 큰 문제점 중의 하나는 금속핵연료와 피복관의 상호반응이다. 상호반응이 일어나면 공융현상을 일으켜 피복관의 녹는점이 낮아지고 피복관의 두께가 얇아져 원자로의 안전에 치명적인 위협이 된다. 이러한 문제를 해결하기 위해 전해도금 (electro-plating)을 활용하여 HT9 피복관 내면에 크롬을 도금하여 금속핵연료와 피복관의 상호반응을 억제하는 연구가 본 연구팀에서 진행되고 있다. 크롬과 전해도금을 코팅 물질과 코팅 방법으로 선정한 이유는 튜브 내면에 적용하기 용이하고 경제적인 코팅 방법이기 때문이다. 본 연구에서는 여러 가지 전해도금 인자 중 온도와 pulse 전류의 파형이 상호반응 방지 효과에 미치는 영향에 대하여 고찰하였다. 도금액의 온도를 $50{\sim}80^{\circ}C$, 전류 파형 중 on/off time을 1:1, 10:1, 1:10으로 하여 여러 HT9 시편을 도금하였고 모의 금속 핵연료 합금인 Ce-Nd와 확산 반응 실험을 수행하여 상호반응 방지 효과를 분석하였다. 광학현미경과 전자현미경을 이용한 미세구조 분석 결과 도금액의 온도가 $65^{\circ}C$ 이하인 시편에서는 미세균열이 심하게 발생하였고 그 균열을 통해서 물질이 확산하고 상호반응을 한다는 것이 관찰되었다. $65^{\circ}C$보다 높은 도금액의 온도에서 형성된 크롬막은 균열이 없고 상호반응 방지 효과가 좋은 것이 확인되었다. 특히 전류 파형의 on/off time이 1:1일 때 상호반응 방지 효과가 가장 좋은 것을 확인하였다. 이러한 결과는 크롬 전해도금의 코팅 조건이 상호반응 방지 효과에 매우 중요한 요인으로 작용한다는 것을 말해주고 있다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.903-906
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• 2011

The electroplating and electro-less plating methods have been applied for the high density chip interconnect of the Copper Pillar Tin Bump (CPTB) preparation. The CPTB was prepared, which had been electroplated about $100{\mu}m$ pitch of copper layer firstly, and then the Tin layer was deposited on the copper pillar surface to protect the oxidation of it. It was also very important to get uniform thickness of electroplated copper layer, though it was difficult and sensitive. In order to control the thickness distribution, it was examined that the current separating disk of Insulating Gate with a hole in the center was installed between electrodes. The current flows through the center hole of the Insulating Gate in the cylindrical electroplating bath and the other parts were blocked to protect current flowing. The main current flowed through the center hole of the Insulating Gate directly to the opposite electrode of wafer disk. As the results, it was verified that the copper layer was thick in the center part of wafer disk with distribution of thinner to the outer part toward edge.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Journal of the Korean Magnetics Society
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• v.16 no.5
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• pp.249-254
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• 2006

CoFeNi alloys are some of the most studied soft magnetic materials because of their superial properties over FeNi alloys as write head core materials in HDD and MEMS. We studied the effect of magnetic property according to size and orientation of crystal for electroplated Co-Fe-Ni alleys. In case of heat treated ternary alloy, it affect the change of crystal size and structure. In this study, it intends to improve the magnetic properties of CoFeNi thin film by heat treatment. Minimized coercivity and increased magnetization are due to heat treatment from $300^{\circ}C\;to\;400^{\circ}C$. As a bcc phase formation, it grow to amount of magnetization.

• Journal of Electrochemical Science and Technology
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• v.14 no.2
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• pp.162-173
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• 2023

Aqueous zinc-ion batteries are considered as promising alternatives to lithium-ion batteries for energy storage owing to their safety and cost efficiency. However, their lifespan is limited by the irreversibility of Zn anodes because of Zn dendrite growth and side reactions such as the hydrogen evolution reaction and corrosion during cycling. Herein, we present a strategy to restrict direct contact between the Zn anode and aqueous electrolyte by fabricating a protective layer on the surface of Zn foil via phosphidation method. The Zn₃(PO₄)₂ protective layer effectively suppresses Zn dendrite growth and side reactions in aqueous electrolytes. The electrochemical properties of the Zn₃(PO₄)₂@Zn anode, such as the overpotential, linear polarization resistance, and hydrogen generation reaction, indicate that the protective layer can suppress interfacial corrosion and improve the electrochemical stability compared to that of bare Zn by preventing direct contact between the electrolyte and the active sites of Zn. Remarkably, MnO₂ Zn₃(PO₄)₂@Zn exhibited enhanced reversibility owing to the formation a stable porous layer, which effectively inhibited vertical dendrite growth by inducing the uniform plating of Zn²⁺ ions underneath the formed layer.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.5
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• pp.875-884
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• 2023

Hydrogen infiltration into metals has been reported to induce alterations in their mechanical properties under load. In this study, we conducted CTOD (Crack Tip Opening Displacement) tests on steel specimens designed for use in liquid hydrogen storage systems. Electrochemical hydrogen charging was performed using both FCC series austenitic stainless steel and BCC series structural steel specimens, while CTOD testing was carried out using a 500kN-class material testing machine. Results indicate a notable divergence in behavior: SS400 test samples exhibited a higher susceptibility to failure compared to austenitic stainless steel counterparts, whereas SUS 316L test samples displayed minimal changes in displacement and maximum load due to hydrogen charging. However, SEM (Scanning Electron Microscopy) analysis results presented challenges in clearly explaining the mechanical degradation phenomenon in the tested materials. This study's resultant database holds significant promise for enhancing the safety design of liquid hydrogen storage systems, providing invaluable insights into the performance of various steel alloys under the influence of hydrogen embrittlement.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.