• Title/Summary/Keyword: electrical components

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Analysis of CD stud welding process and defects (CD 스터드 용접공정의 해석 및 결함 분석)

  • O, Hyeon-Seok;Yu, Jung-Don
    • Proceedings of the KWS Conference
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    • 2005.11a
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    • pp.55-57
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    • 2005
  • In this study, modeling of the CD stud welding system was conducted considering mechanical and electrical components. The electrical components such as arc resistance, cable resistance, capacitance, internal resistance and cable inductance were found to affect the output waveform significantly. The calculated results showed food agreements with the experiment results within 20% error. The main defect of CD stud welding with 1010 steel stud and SS400 steel plate was the void trapped between stud and base metal. The effect of the spring force and stud tip size on void formation was investigated.

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Fast labeling a1gorithm for the surface defect inspection of Cold Mill Strip (냉연 강판의 개별 흠 분리를 위한 고속 레이블링에 관한 연구)

  • Kim, Kyung-Min;Park, Joo-Jo
    • Proceedings of the KIEE Conference
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    • 2000.07d
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    • pp.3056-3059
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    • 2000
  • This paper describes a fast image labeling algorithm for the feature extraction of connected components. Labeling the connected regions of a digitized image is a fundamental computation in image analysis and machine vision, with a large number of application that can be found in various literature. This algorithm is designed for the surface defect inspection of Cold Mill Strip. The labeling algorithm permits to separate all of the connected components appearing on the Cold Mill Strip.

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Low molecular weight components and space charge formation in LDPE (저분자량성분과 저밀도폴리에틸렌의 공간전하형성과의 관계)

  • 구중회;한재홍;서광석
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1994.05a
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    • pp.87-89
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    • 1994
  • The effects of low molecular weight components of LDPE and sample molding condition were investigated to find the orgins for heterocharge in LDPE without any addtives. Low molecular weight chains of LDPE encourages the formation of heterocharge by being charged and migrating the counter electrode. The formation of heteroohage in LDPE was also effected by sample preparation process and the kind of a moling film. When PET film is used as a molding layer, the carbonyl, which may lead to increase the heterocharge, formed at surface of LDPE.

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A New Approach to Calculation of the Components of Locational Marginal Price (모선별 한계가격의 구성요소 산정 기법)

  • Lee Ki-Song;Jeong Yun-Won;Shin Joong-Rin;Kim Jin-Ho;Park Jong-Bae
    • The Transactions of the Korean Institute of Electrical Engineers A
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    • v.55 no.8
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    • pp.341-350
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    • 2006
  • This paper presents a new methodology to draw the components of locational marginal price (LMP) in electricity market. Recently, the changing environments surrounding electricity industries resulted in the unbundled services provided by electricity market players, which may require the new pricing mechanisms based on the LMP. The changed pricing mechanisms will provide the price signals of time and location to the market participants. Most of the existing studies of LMP are based on the Lagrangian multipliers as shadow prices to evaluate the equivalent values of constraints or factors for security, reliability and quality. However, the shadow prices cannot provide enough information for components of LMP. In this paper, therefore, we proposed a new approach that LMP is divided into three components. To do this, we first present the method for shadow prices calculation and then break down LMP into a variety of parts corresponding to the concerned factors. The proposed approach is applied to 5-bus and modified IEEE 14-bus sample system in order to verify its validity.

The Analysis of Zero Sequence Components in Dynamic Voltage Restorer System (영상성분을 고려한 DVR 기기 해석)

  • Jeong, Il-Yeop;Park, Sang-Yeong;Won, Dong-Jun;Mun, Seung-Il;Park, Jong-Geun;Han, Byeong-Mun
    • The Transactions of the Korean Institute of Electrical Engineers A
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    • v.51 no.4
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    • pp.169-174
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    • 2002
  • The magnitude and phase of the compensating voltage in Dynamic Voltage Restorer (DVR) system depend on the voltage sag in the phases affected by the fault and on the influence of the zero sequence components. If the delta connection of the transformer is used, the zero sequence components do not appear on the load side. But nowadays, Y connected transformers with grounded neutral, that is 3-phase 4-wire system, are usually used. Therefore the zero-sequence components are occurred during faults. The zero-sequence components result in the high insulation costs and the asymmetry of the phase and magnitude of the terminal voltages. In this paper 3 phase 4 wire distribution system and 3 phase 3 wire system are analyzed and characteristics of voltage sag are presented. And this paper proposes the method that can mitigate the zero-sequence under the unbalance faults causing voltage sage and phase angle iumps.

Diode and MOSFET Properties of Trench-Gate-Type Super-Barrier Rectifier with P-Body Implantation Condition for Power System Application

  • Won, Jong Il;Park, Kun Sik;Cho, Doo Hyung;Koo, Jin Gun;Kim, Sang Gi;Lee, Jin Ho
    • ETRI Journal
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    • v.38 no.2
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    • pp.244-251
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    • 2016
  • In this paper, we investigate the electrical characteristics of two trench-gate-type super-barrier rectifiers (TSBRs) under different p-body implantation conditions (low and high). Also, design considerations for the TSBRs are discussed in this paper. The TSBRs' electrical properties depend strongly on their respective p-body implantation conditions. In the case of the TSBR with a low p-body implantation condition, it exhibits MOSFET-like properties, such as a low forward voltage ($V_F$) drop, high reverse leakage current, and a low peak reverse recovery current owing to a majority carrier operation. However, in the case of the TSBR with a high p-body implantation condition, it exhibits pn junction diode.like properties, such as a high $V_F$, low reverse leakage current, and high peak reverse recovery current owing to a minority carrier operation. As a result, the TSBR with a low p-body implantation condition is capable of operating as a MOSFET, and the TSBR with a high p-body implantation condition is capable of operating as either a pn junction diode or a MOSFET, but not both at the same time.

FEA-based Torque Ripple and Noise Reduction of DC Motor for Automotive Air-Conditioning (유한요소 해석 기반 자동차 공조용 DC모터 토크 리플과 소음 저감에 관한 연구)

  • Hwang, Myeonghwan;Kim, Donghyeon;Yang, Seungjin;Cha, Hyunrok;Han, Jongho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.66 no.12
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    • pp.1895-1898
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    • 2017
  • This paper discusses methods for the torque ripple and noise reduction of DC motors for automotive air-conditioning based on electromagnetic field analysis. The target of the motor is a blower motor, and to reduce cogging torque and the torque ripple, the optimum model was selected by deforming the brush or commutator shape. In addition, to reduce the cogging torque, the model design was carried out by applying the skew method and the magnetization method of a magnet to the rotor. For optimization, the shape, material, and drive system of the motor were selected using an electromagnetic field as the analysis tool, and the method of reducing the cogging torque was applied to 4-pole, 12- and 13-slot motors considering the mechanical part. Lastly, this paper confirmed thatthemethod, which proposed how much noise, cogging torque, and vibration are reduced, improves through practical analysis.

Piezoelectric properties of PSNZT ceramics with Mn electronic valence (PSNZT계 세라믹스에서 Mn전자가 변화에 따른 압전 특성)

  • Suk, Jong-Min;Lee, Moon-Seok;Lee, Yong-Hyun;Hur, Geun;Choi, Chal-Hee;Lee, Young-Hwan;Cho, Jeong-Ho;Kim, Byung-Ik;Ko, Tae-Gyung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.171-172
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    • 2005
  • PSNZT계 압전 세라믹스는 압전 특성을 개량하고, 여러 가지 응용 분야의 요구를 만족할 특성을 얻기 위해 Mn을 포함하는 첨가물에 관한 연구를 하였다. Mn을 포함하는 산화물은 기계적 품질계수($Q_m$)를 높이는 강화제로 널리 활용되고 있으며, $Mn^{4+}$를 갖는 $MnO_2$가 가장 많이 사용되고 있다. 산화물에서 Mn 전자가는 여러 상태 인데, 이런 전자가의 변화가 압전 특성에 미치는 영향을 조사하였다. Mn 전자가에 따라서 소결체의 미세구조는 $MnCO_3$$Mn_3O_4$경우 입자크기가 10${\mu}m$정도였으며, $Mn_2O_3$$MnO_2$의 입자크기는 $1\sim5{\mu}m$정도로 불규칙하였다. 전반적으로 소결체는 밀도가 $7.75g/cm^2$이상이었고, 치밀하였다. $MnCO_3$경우 전기기계 결합계수는 56%이고, $MnO_2$경우 기계적 품질계수는 2000이상이었다.

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Visco-Elastic Properties of Glass Fiber Manufactured by Slag Material (슬래그 원료를 사용해서 제조된 유리섬유의 점탄성 특성)

  • Lee, Ji-Sun;Kim, Sun-Woog;Ra, Yong-Ho;Lee, Youngjin;Lim, Tae-Young;Hwang, Jonghee;Jeon, Dae-Woo;Kim, Jin-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.6
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    • pp.477-482
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    • 2019
  • This study investigated the influence of the viscoelastic property of slag when producing glass fiber, MFS631 with 60% of manganese slag, 30% of steel slag, and 10% of silica stone. To fabricate the MFS631 glass bulk, slag materials were placed in an alumina crucible, melted at $1,550^{\circ}C$ for 2 h, and then annealed at $600^{\circ}C$ for 2 h. It was found that glass is non-crystalline through X-ray diffraction analysis. MFS631 fiber was produced at speed in the range of 100~300 rpm at $1,150^{\circ}C$. The loss modulus (G") and storage modulus (G') of the produced glass fiber were evaluated at high temperatures. G' and G" of MFS631 were greater than $893^{\circ}C$, and the modulus value was 136,860 pa. This is similar to the results of a general E-glass fiber graph. Therefore, it was concluded that its spinnability is similar to that of E-glass fiber; therefore, it can be commercialized.

VLSI Implementation of H.264 Video Decoder for Mobile Multimedia Application

  • Park, Seong-Mo;Lee, Mi-Young;Kim, Seung-Chul;Shin, Kyoung-Seon;Kim, Ig-Kyun;Cho, Han-Jin;Jung, Hee-Bum;Lee, Duk-Dong
    • ETRI Journal
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    • v.28 no.4
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    • pp.525-528
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    • 2006
  • In this letter, we present a design of a single chip video decoder called advanced mobile video ASIC (A-MoVa) for mobile multimedia applications. This chip uses a mixed hardware/software architecture to improve both its performance and its flexibility. We designed the chip using a partition between the hardware and software blocks, and developed the architecture of an H.264 decoder based on the system-on-a-chip (SoC) platform. This chip contains 290,000 logic gates, 670,000 memory gates, and its size is $7.5\;mm{\times}7.5\;mm$ (using 0.25 micron 4-layers metal CMOS technology).

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