• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.47-48
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• 2006

In this paper, intrinsic n channel MOSFETs with external parasitic components are modeled. Using sensitivity analysis, effective parasitic components are tested and the optimized model is extracted. The extracted model is fitted to the measured S-parameters with different channel width. Based on this methodology, this method, external parasitic components that affect MOSFET operations can be analyzed and modeled.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.321-322
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• 2005

In this paper, we dealt with a partial discharge(PD) measurement system that has been accepted as an effective and non-destructive technique for estimating reliabilities of low-voltage electrical and electronic components. Calibration tests on laboratory set-up have shown that the PD measurement system has a stable sensitivity of 37.6 mv/pC. In an application test on photo coupler, we could detect 0.1 pC level of partial discharge at the applied voltage of AC 520 $V_{peak}$.

• Transactions on Electrical and Electronic Materials
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• v.11 no.3
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• pp.106-111
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• 2010

The convergence of significantly different and disparate technologies such as spintronics, carbon nano tube field effect transistors, photon and bio-responsive molecular switches, memristor and memristive systems and metamaterials, coupled with energy scavenging sources are gaining a renewed focus in the quest for new products. This paper will provide an insight into an anticipated technological revolution and will highlight a futuristic Roadmap to capture opportunities that are brought about as the results of formulation of new circuit components basically driven by emergence of nanoscale materials as part of System on System integration. Challenges as the result of new lumped components such as memristor, metamaterial-based lumped components and the like that will challenge the designers' comfort zone will also be discussed.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.52 no.12
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• pp.671-678
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• 2003

This paper proposes an expert system to generate automatically the test table of test system which can highly enhance the quality and productivity of product by inspecting quickly and accurately the defect device on the electronic circuit board tested. The expert system identifies accurately the tested components and the circuit patterns by tracing automatically the connectivity of circuit from electronic circuit database. And it generates automatically the test table to detect accurately the missing components, the misplaced components, and the wrong components for analog components such as resistance, coil, condenser, diode, and transistor, based on the experience knowledge of veteran expert. It is implemented in C computer language for the purpose of the implementation of the inference engine using the dynamic memory allocation technique, the interface with the electronic circuit database and the hardware direct control. And, the validity of the builded expert system is proved by simulating for a typical electronic board model.

• Proceedings of the IEEK Conference
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• 2007.07a
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• pp.159-160
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• 2007

Two analog predsitorters (PDs) using the mixing operation are proposed to compensate for the memory effects of the power amplifier and then significantly cancel IM3 components with the independent control of IM3 terms. In the first PD, IM3 terms are generated by using mixing operation of low frequency terms. In the second PD, the double mixing operation of the fundamental components is used. For a two-tone signal with 20-MHz tone spacing, the notable IM3 suppression is achieved over a whole output power range.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.39-44
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• 2017

This paper proposes a novel approach to determine symmetrical components of power system by applying method of least squares in time domain. For the modern power system stability, clearance of faults on high voltage transmission lines in zero response time is crucial and important. Symmetrical components have a great attention since last century. They have been found an effective tool for the analysis of symmetrical and unsymmetrical faults in power system. Moreover, magnitude of symmetrical components are also used as a caution about faults in system. With rapid changes in technology, Microprocessor assumed to be fastest machine of the modern era. Hence microprocessor based techniques were developed and implemented for last few decades. The proposed technique apply least square method in the computation of symmetrical components which is suitable as an application in microprocessor based monitoring and controlling power system in order to avoid cascading failures. Simulation of proposed model is carried out in MATLAB/SIMULINK and all results exploit the validity of model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.503-504
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• 2006

This paper describes a low-level partial discharge(PD) testing that has been accepted as a non-destructive test method on insulation performance of electronic components. A comparative PD analysis combined with the Withstand Voltage Test (WVT) specified in IEC standards is carried out on high frequency switching transformers. The analysis shows that insulation degradation of the transformers under test progresses during the WVT. To avoid insulation degradation of the specimen, PD test has to be carried out at as low voltage as possible. In this study, the PD test on the transformers is performed in ranges from 50% to 70% of the test voltage specified in the WVT by measuring apparent charges below 1 pC. From the experimental results, it is expects that the low-level PD test is applicable for electronic components as a replacement of the WVT.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.202-202
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• 2008

The world gross market of many kinds of electronics, such as TV and mobile phone has been increasing rapidly these days. It is mainly caused by the amazing developments of IT technology during past decade and the changes of individual life style for the better. Thanks to the increases of electronics manufactured in quantity, much more electronic components such as MLCC (multi layer ceramic capacitor) and PCB (printed circuit board), which are our main products, have been needed as a consequence. Though it was reported that total market of electronic components exceeds several hundreds of billion dollars, there are many manufactures struggling for survival in the competition of electronics components. Then the recognition of quality as a key technology has spread and the efforts for high-yield production lines have been kept in many companies. In this paper, our efforts to eliminate the contamination of particles and the diffusion of some volatile organic compounds which is very harmful to workers at production line have been introduced.