• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.2
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• pp.88-94
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• 2011

In this paper, we design a 1-kb OTP (Onetime programmable) memory IP in consideration of BCD process based EM (Electro-migration) and resistance variations of eFuse. We propose a method of precharging BL to VSS before activation of RWL (Read word-line) and an optimized design of read NMOS transistor to reduce read current through a non-programmed cell. Also, we propose a sensing margin test circuit with a variable pull-up load out of consideration for resistance variations of programmed eFuse. Peak current through the non-programmed eFuse is reduced from 728 ${\mu}A$ to 61 ${\mu}A$ when a simulation is done in the read mode. Furthermore, BL (Bit-line) sensing is possible even if sensed resistance of eFuse has fallen by about 9 $k{\Omega}$ in a wafer read test through a variable pull-up load resistance of BL S/A (Sense amplifier).

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.17 no.4
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• pp.266-274
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• 2024

In this paper, we designed a low-area 32-bit PF (Poly-fuse) OTP IP, a non-volatile memory that stores data required for analog circuit trimming and calibration. Since one OTP cell is constructed using two PFs in one select transistor, a 1cell-2bit multibit PF OTP cell that can program 2bits of data is proposed. The bitcell size of the proposed 1cell-2bit PF OTP cell is 1/2 of 12.69㎛ × 3.48㎛ (=44.161㎛2), reducing the cell area by 33% compared to that of the existing PF OTP cell. In addition, in this paper, a new 1 row × 32 column cell array circuit and core circuit (WL driving circuit, BL driving circuit, BL switch circuit, and DL sense amplifier circuit) are proposed to meet the operation of the proposed multbit cell. The layout size of the 32bit OTP IP using the proposed multibit cell is 238.47㎛ × 156.52㎛ (=0.0373㎛2) is reduced by about 33% compared that of the existing 32bit PF OTP IP using a single bitcell, which is 386.87㎛ × 144.87㎛ (=0.056㎛2). The 32-bit PF OTP IP, designed with 10 years of data retention time in mind, is designed with a minimum programmed PF sensing resistance of 10.5㏀ in the detection read mode and of 5.3 ㏀ in the read mode, respectively, as a result of post-layout simulation of the test chip.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1259-1260
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• 2013

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.84-87
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• 2010

We manufacture an antifuse OTP (One-time programmable) cell for analog trimming which will be used in power management ICs. For the antifuse cell using dual program voltage of VPP (=7V) and VNN (=-5V), the thin gate oxide is broken down by applying a voltage higher than the hard break-down voltage to the terminals of the antifuse. The area of the manufactured antifuse OTP cell using $0.18{\mu}m$ BCD process is $48.01{\mu}m^2$ and is about 44.6 percent of that of an eFuse cell. The post-program resistances of the antifuse are good with the values under several kilo ohms when we measure twenty test patterns.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.8
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• pp.1877-1886
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• 2010

In this paper, we design a redundancy control circuit for 1T-SRAM repair using electrical fuse programming. We propose a dual port eFuse cell to provide high program power to the eFuse and to reduce the read current of the cell by using an external program supply voltage when the supply power is low. The proposed dual port eFuse cell is designed to store its programmed datum into a D-latch automatically in the power-on read mode. The layout area of an address comparison circuit which compares a memory repair address with a memory access address is reduced approximately 19% by using dynamic pseudo NMOS logic instead of CMOS logic. Also, the layout size of the designed redundancy control circuit for 1T-SRAM repair using electrical fuse programming with Dongbu HiTek's $0.11{\mu}m$ mixed signal process is $249.02 {\times}225.04{\mu}m^{2}$.