• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.657-658
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.645-646
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.15.2-15.2
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• 2009

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology with both low cost and high productivity, can be applied in the production of organic thin film transistor (OTFT), solar cell, radio frequency identification (RFID) tag, printed battery, E-paper, touch screen panel, black matrix for liquid crystal display (LCD), flexible display, and so forth. The emerging technology to manufacture the products in mass production is roll-to-roll printing technology which is a manufacturing method by printings of multi-layered patterns composed of semi-conductive, dielectric and conductive layers. In contrary to the conventional printing machines in which printing precision is about $50~100{\mu}m$, the printing machines for printed electronics should have a precision under $30{\mu}m$. In general, in order to implement printed electronics, narrow width and gap printing, register of multi-layer printing by several printing units, and printing accuracy of under $30{\mu}m$ are all required. We developed the roll-to-roll printing equipment used for printed electronics, which is composed of un-winder, re-winder, tension measurement system, feeding units, dancer systems, guide unit, printing unit, vision system, dryer units, and various auxiliary devices. The equipment is designed based on cantilever type in which all rollers except printing ones have cantilever types, which could give more accurate machine precision as well as convenience for changing rollers and observing the process.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.8
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• pp.709-714
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• 2014

Reverse-offset printing is one of the technologies that can be used for patterning fine features of the order of a few micrometers for printed electronics. In reverse-offset printing, a coated ink film is transferred to a blanket made of elastomer-like poly-dimethylsiloxane. Then, the blanket is impressed onto a clich$\acute{e}$ that has intaglio patterns. The blanket is deformed by penetrating the intaglio of the clich$\acute{e}$ according to the printing pressure. Excessive deformation of the blanket can cause printing defects upon touching the bottom of the intaglio pattern, especially in large patterns. In this paper, we modelled the deformation of the blanket using the finite element method. Considering the actual printing parameters, a condition for fabricating a clich$\acute{e}$ is proposed to prevent defects by the deformation of the blanket.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.511-511
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• 2007

Low-emissivity (low-e) coatings with visible transparency have attracted increased interest m reducing heat radiation loss through window panes from ecological and sustainable aspects. $TiO_2$-silver transparent thin films for low-e have good properties for UV and IR blocking as well as photocatalyst compared to that with commercial UV blocking films such as fluorine doped oxide (FTO), antimony doped tin oxide (ATO), etc. In this study, transparent $TiO_2$-silver thin films were prepared by successive ink-jet printing of commercial nano silver and $TiO_2$ sol. The $TiO_2$ sol, as ink for ink-jet printing, were synthesized by hydrothermal process in the autoclave externally pressurized with $N_2$ gas of 200 bar at $120^{\circ}C$ for 10 hrs. The synthesized $TiO_2$ sols were all formed with brookite phase and their particle size was several to 30 nm. At first nano sized silver sol was coated on glass substrate, after that $TiO_2$ sol was coated by ink-jet printing. With increasing coating thickness of $TiO_2$-silver multilayer by repeated ink-jet coating, the absorbance of UV region (under 400nm) and IR region (over 700nm) also increase reasonably, compared to that with commercial UV blocking films.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.2
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• pp.50-53
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• 2008

A design approach using a one-dimensional (1D) lumped model was studied and applied to an industrial inkjet printing head design for micro patterning on printed circuit boards. For an accurate analysis, a three-dimensional piezoelectric-driven actuator model was analyzed and its jetting characteristics were applied to 1Danalysis model. The performance of the 1D lumped model was verified by comparing measured and simulated results. The developed 1D model helped to optimize the design and configuration of the inkjet head and could be implemented in the design of multi-nozzle inkjet printing heads to improve the jetting frequency and minimize crosstalk.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.256-257
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• 2006

3D printing of NiTi alloys has been successfully achieved. A novel printing process has been developed and used, which consists in selective deposition of a solvent on a granule bed. The granules are composed of metal powders and thermoplastic binder, which are mixed and sieved by conventional methods. A sound green strength is obtained after solvent evaporation. Sintered parts exhibit good density, proper phase composition and shape memory behaviour.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.18-23
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• 2022

Electrohydrodynamic jet (e-jet) printing, a type of direct contactless microfabrication technology, is a versatile fabrication process that enables a wide range of micro/nanopattern arrays by applying a strong electric field between the nozzle and the substrate. In general, the morphology and the thickness of polymers/quantum dot micropatterns show a systematic dependence on the diameter of the nozzle and the ink composition with a fully automated printing machine. The purpose of this report is to provide typical examples of e-jet printed micropatterns of polymers/quantum dots to explain the effect of each process variable on the result of experiments. Here, we demonstrate several operating conditions that allow high-resolution printing of layers of polymers/quantum dots with a precise control over thickness and submicron lateral resolution.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.497-504
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• 2014

The digital signage display is actively researched as the next generation of large FPD. To commercialize those digital signage display, the manufacturing cost must be downed with printing method instead of conventional photolithography. Here, we demonstrate a reverse offset printed TFT electrodes for the digital signage display. For the fabricated source/drain and gate electrode, we used Ag ink, silicone blanket, Clich$\acute{e}$ and reverse offset printer. We printed uniform TFT electrode patterns with narrow line width(10 ${\mu}m$ range) and thin thickness(nm range). In the end the printing source/drain and gate electrode are successfully achieved by optimization of experimental conditions such as Clich$\acute{e}$ surface treatment, ink coating process, delay time, off/set process and curing temperature. Also, we checked that the printing align accuracy was within 5 ${\mu}m$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.5
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• pp.374-380
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• 2011

In this paper a printing process for patterning electrodes on large area substrate was developed by combining screen printing with reverse off-set printing. Ag ink was uniformly coated by screen printing. And then etching resist (ER) was patterned in the Ag film by reverse off-set printing, and then the non-desired Ag film was etched off by etchant. Finally, the ER was stripped-off to obtain the final Ag patterns. We extracted the suitable conditions of reverse Using the process we successfully fabricated gate electrodes and scan bus lines of OTFT-backplane used for e-paper, in which the diagonal size was 6 inch, the resolution $320{\times}240$, the minimum line width 30 um, and sheet resistance 1 ${\Omega}/{\Box}$.