• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.109-109
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• 2006

Screen printing (SP) metal contact is typically applied to the solar cells for mass production. However, SP metal contact has low aspect ratio, low accuracy, hard control of the substrate penetration and unclean process. On the other hand, photo lithograpy (PL) metal contact can reduce defects by metal contact. In this investigation, PL metal contact was obtained the multi-layer structure of Ti/Pd/Ag by e-beam process. We applied SP metal contact and PL metal contact to single crystalline silicon solar cells, and demonstrated the difference of conversion efficiency. Because PL metal contact silicon solar cell has Jsc (short circuit current density) better than silicon solar cell applied SP metal contact.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.109-112
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• 2006

A fluorine-doped diamond-like carbon (F-DLC) stamp which has high contact angle, high UV-transmittance and sufficient hardness, was fabricated using the following direct etching method: F-DLC is deposited on a quartz substrate using DC and RF magnetron sputtering, PMMA is spin coated and patterned using e-beam lithography and finally, $O_2$ plasma etching is performed to transfer the line patterns having 100 nm line width, 100 nm line space and 70 nm line depth on F-DLC. The optimum fluorine concentration was determined after performing several pre-experiments. The stamp was applied successfully to UV-NIL without being coated with an anti-adhesion layer.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.30.1-30.1
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• 2010

Hydrogen silsesquioxane (HSQ)는 spin-on glass (SOG)의 일종으로 spin-coating이 가능하며 $400^{\circ}C$ 이상의 고온에서의 어닐링을 통해 silica로 변환되는 물질이다. 이 물질은 가시광선 영역에서 95% 이상의 높은 투과도를 나타내며 산화물로의 변환 공정이 간단하며 표면 개질이 용이하기 때문에 나노 바이오, 반도체, 광전자 소자 등의 다양한 분야로의 적용이 기대되는 물질이다. 최근 나노 기술의 발전에 따라 다양한 나노 구조물을 이용하여 소자들의 효율을 향상시키는 연구가 활발하게 진행되고 있다. 따라서 HSQ를 이용하는 소자의 효율을 높이기 위해서는 쉽고 간단하면서 생산성이 높은 HSQ 나노 구조물 제작 기술에 대한 연구가 필요하다. 현재 개발된 대면적 HSQ 나노 구조물 제작 기술로는 e-beam lithography, x-ray lithography, room temperature nanoimprint lithography 등이 있다. 하지만 이와 같은 나노 패터닝 기술들은 생산성이 낮거나 공정이 복잡한 단점이 있다. 본 연구에서는 poly(dimethylsiloxane) (PDMS) mold를 이용한 직접 printing 기술을 통해 HSQ 나노 구조물을 제작하는 기술을 개발하였다. 이 기술은 대면적에 간단한 기술로 HSQ 나노 패턴을 제작할 수 있으며 master mold의 패턴이 그대로 HSQ layer로 전사되기 때문에 제작이 까다로운 아날로그 패턴도 손쉽게 제작할 수 있는 장점을 가지고 있다. 따라서 이와 같은 HSQ 직접 printing 기술을 이용하여 HSQ 아날로그 나노 패턴을 제작하고 이의 응용기술에 대한 연구를 진행하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.145-146
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• 2006

A fluorine-doped diamond-like carbon (F-DLC) stamp which has high contact angle, high UV-transmittance and sufficient hardness, was fabricated using the following direct etching method: F-DLC is deposited on a quartz substrate using DC and RF magnetron sputtering, PMMA is spin coated and patterned using e-beam lithography and finally, O2 plasma etching is performed to transfer the line patterns having 100 nm line width, 100 nm line space and 70 nm line depth on F-DLC. The optimum fluorine concentration was determined after performing several pre-experiments. The stamp was applied successfully to UV-NIL without being coated with an anti-adhesion layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.4
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• pp.262-268
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• 2021

For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.224-227
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• 2009

Nanofabrication is an essential process throughout industry. Technologies that produce general nanofabrication, such as e-beam lithography, dip-pen lithography, DUV lithography, immersion lithography, and laser interference lithography, have drawbacks including complicated processes, low throughput, and high costs, whereas nano-transfer printing (nTP) is inexpensive, simple, and can produce patterns on non-plane substrates and multilayer structures. In general nTP, the coherency of gold-deposited stamps is strengthened by using SAM treatment on substrates, so the gold patterns are transferred from stamps to substrates. However, it is hard to apply to transfer other metallic materials, and the existing nTP process requires a complicated surface treatment. Therefore, it is necessary to simplify the nTP technology to obtain an easy and simple method for fabricating metal patterns. In this paper, asnTP process with poly vinyl alcohol (PVA) mold was proposed without any chemical treatment. At first, a PVA mold was duplicated from the master mold. Then, a Mo layer, with a thickness of 20 nm, was deposited on the PVA mold. The Mo deposited PVA mold was put on the Si wafer substrate, and nTP process progressed. After the nTP process, the PVA mold was removed using DI water, and transferred Mo nano patterns were characterized by a Scanning electron micrograph (SEM) and Energy Dispersive spectroscopy (EDS).

• KSBB Journal
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• v.22 no.6
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• pp.433-437
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• 2007

A constant desire has been to fabricate nanopatterns for biochip and the Ultraviolet-nano imprint lithography (UV-NIL) is promising technology especially compared with thermal type in view of cost effectiveness. By using this method, nano-scale to micro-scale structures also called nanopore structures can be fabricated on large scale gold plate at normal conditions such as room temperature or low pressure which is not possible in thermal type lithography. One of the most important methods in fabricating biochips, immobilizing, was processed successfully by using this technology. That means immobilizing proteins only on the nanopore structures based on gold, not on hardened resin by UV is now possible by utilizing this method. So this selective nano-patterning process of protein can be useful method fabricating nanoscale protein chip.

• 한국초전도학회:학술대회논문집
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• v.16
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• pp.38-38
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• 2006

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.424-424
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• 2009

그라핀은 밴드갭이 없어서 세미메탈의 성질을 띠므로 초고속 RF 소자에는 응용이 가능하지만, 현재 사용되는 반도체 칩에 사용하기가 불가능하다. 그러나 그라핀을 매우 좁은 리본 형태로 만들 경우 밴드갭이 생기고 이에 따라 반도체특성을 뛰게 된다. 이러한 특성은 시뮬레이션을 통해서만 이해되다가 2007년 P. Kim이 그라핀 나노리본의 밴드캡이 리본의 폭이 좁아짐에 따라 증가함을 실험적으로 최초로 발표하였다. 하지만 그라핀을 나노리본형태로 식각 방법에 대해서는 정확히 연구되지 않았다. 따라서 본 연구에서는 $O_2$ plasma ashing 방법을 이용하여 그라핀을 식각하는 방법에 대해 연구하였다. 먼저 Si기판을 initial cleaning 한 후, highly-oriented pyrolytic graphite(HOPG)를 이용하여 기존의 mechanical exfoliation 방식을 통해 그라핀을 형성하였다. Photo-lithography 방법을 통하여 패터닝한 후, 그라핀을 식각하기 위하여 Reactive Ion Etcher (RIE) system을 이용한 $O_2$ plasma ashing을 50 W에서 1 분간 실시하였다. 다시 image reverse photo-lithography 과정과 E-beam evaporator system를 통해서 Al 전극을 형성하여 graphene-FET를 제작하였고, 광학 현미경과 AFM (Atomic force microscope)을 통해 두께를 확인하였다. 본 연구를 통하여 $O_2$ plasma ashing을 이용하여 쉽게 그라 E을 식각할 수 있음을 확인 하였으며, 제작된 소자의 전기적 특성에 대해서 현재 실험중에 있다.

• Journal of the Korean Vacuum Society
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• v.6 no.3
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• pp.242-248
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• 1997

Porous silicons were prepared by dry etching as well as by chemical etching. The latter is a conventional method used by many researchers. Meanwhile, the former is a new method we developed. Also the porous silicon structure was made by E-beam lithography technique. However, due to the limit of this technique, minimum size we could produce was about 0.3 $\mu\textrm{m}$ in diameter on silicon wafer. In a new method, the porous silicon microstructure was fabricated by using Reactive Ion Etching method after covering with diamond powder on 4 inch wafer by using spin coater. In this method, diamond powder acted as a mask. The morphology of samples prepared under many different conditions were analysed be SEM and AFM. And we measured PL spectra for the samples. Based on these results, we observed the structure of a few hundreds $\AA$ in size from porous silicon which was made by dry etching with diamond powder. Also the PL peak for these samples lied around 590 nm compared to 760 nm for chemically etched porous silicon.