• 제목/요약/키워드: dynamic mechanical analysis (DMA)

검색결과 59건 처리시간 0.023초

A Study of Aging Effect for Train Carbody Using Accelerated Aging Tester

  • Nam, Jeong-Pyo;LI, Qingfen;LI, Hong
    • International Journal of Railway
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    • 제1권3호
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    • pp.113-116
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    • 2008
  • The long-tenn exposure of polymeric composite materials to extreme-use environments, such as pressure, temperature, moisture, and load cycles, results in changes in the original properties of the material. In this study, the effect of combined environmental factors such as ultraviolet ray, high temperature and high moisture on mechanical and thermal analysis properties of glass fabric and phenolic composites are evaluated through a 2.5 KW accelerated environmental aging tester. The environmental factors such as temperature, moisture and ultraviolet ray applied of specimens. A xenon-arc lamp is utilized for ultraviolet light and exposure time of up to 3000 hours are applied. Several types of specimens - tensile, bending, and shear specimens that are warp direction and fill direction are used to investigate the effects of environmental factors on mechanical properties of the composites. Mechanical degradations for tensile, bending and shear properties are evaluated through a Universal Testing Machine (UTM). Also, storage shear modulus, loss shear modulus and tan a are measured as a function of exposure time through a Dynamic Mechanical Analyzer (DMA). From the experimental results, changes in material properties of glass fabric and phenolic composites are shown to be slightly degraded due to combined environmental effects.

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A micromechanics-based time-domain viscoelastic constitutive model for particulate composites: Theory and experimental validation

  • You, Hangil;Lim, Hyoung Jun;Yun, Gun Jin
    • Advances in aircraft and spacecraft science
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    • 제9권3호
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    • pp.217-242
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    • 2022
  • This paper proposes a novel time-domain homogenization model combining the viscoelastic constitutive law with Eshelby's inclusion theory-based micromechanics model to predict the mechanical behavior of the particle reinforced composite material. The proposed model is intuitive and straightforward capable of predicting composites' viscoelastic behavior in the time domain. The isotropization technique for non-uniform stress-strain fields and incremental Mori-Tanaka schemes for high volume fraction are adopted in this study. Effects of the imperfectly bonded interphase layer on the viscoelastic behavior on the dynamic mechanical behavior are also investigated. The proposed model is verified by the direct numerical simulation and DMA (dynamic mechanical analysis) experimental results. The proposed model is useful for multiscale analysis of viscoelastic composite materials, and it can also be extended to predict the nonlinear viscoelastic response of composite materials.

Characterization of Microcapsules for Self-Healing in Polymeric Composites

  • Lee Jong Keun;Hong Soon Ji;Liu Xing;Park Hee Won;Yoon Sung Ho
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2004년도 춘계학술발표대회 논문집
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    • pp.190-193
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    • 2004
  • Two different diene monomers [dicyclopentadiene (DCPD) and 5-ethylidene-2-norbomene (ENB)] as self­healing agent for polymeric composites were microencapsuled by in-situ polymerization of urea and formaldehyde. The healing agents were investigated by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). Exothermic reaction and glass transition temperature from DSC and storage modulus (G') and tan $\delta$ from DMA curves were analyzed for the samples cured for 5 min and 24 h in the presence of different amounts of catalyst. Micorcapsules were successfully formed for both diene monomers. Microcapsules containing the healing agent were manufactured and its thermal properties were characterized by thermo gravimetric analysis (TGA). Optical microscope (OM) and particle size analyzer (PSA) were employed to observe morphology and size distribution of microcapsules, respectively. Comparison of the two self-healing agents and their microcapsules with the two was made in this study.

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방사선 경화 비닐에스터 수지의 기계적 특성 연구 (Mechanical Properties of Radiation-Curing Vinyl Ester Resin)

  • 신범식;전준표;김현빈;강필현
    • 방사선산업학회지
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    • 제4권1호
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    • pp.19-23
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    • 2010
  • Vinyl ester (VE) resins, introduced in the late 1960s, have made large strides in reinforced plastics applications as adhesive and matrix materials on their appropriate mechanical performance characteristics in the glassy state. Generally, VE resins are a group of dimethacrylate resins based on bisphenol A type epoxy resin. They exhibit easy handling properties as well as good resistance to most chemical agents due to their mechanical and thermal properties. In this study, the effects of curing methods of vinyl ester resins on gel contents, flexural strength and dynamic mechanical properties were investigated. Thermal curing (room temperature, $80^{\circ}C$) and electron beam curing were used to crosslink a VE resin/styrene complex (65/35 wt%) with methyl ethyl ketone peroxide (MEKPO) as a catalyst and an 8 wt% cobalt naphthenate in styrene solution as a accelerator. For the samples, gel contents as well as flexural strength and dynamic mechanical properties were characterized and compared by soxhlet apparatus, universal testing machine (UTM) and dynamic mechanical analysis (DMA). As a result, the electron-cured VE resin was confirmed as a better condition than those for gel contents, flexural strength and dynamic mechanical properties, respectively.

Mercaptan 경화제에 의한 저온속경화 에폭시의 열적 기계적 물성 (Mechanical Properties of Low Temperature and Fast Cure Epoxy with Various Mercaptans)

  • 김원영;엄세연;서상범;이기윤
    • 폴리머
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    • 제37권5호
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    • pp.557-562
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    • 2013
  • 본 연구에서는 DGEBA(diglycidyl ether of bisphenol A)와 mercaptan 경화제계의 경화 후 열에 의한 팽창 특성과 역학 거동을 에폭시/아민 유도체형 경화제계와 비교하여 연구하였다. 열팽창계수와 역학거동은 각각 TMA(thermo mechanical analysis)와 역학 거동은 DMA(dynamic mechanical ananlysis)를 이용하여 분석하였다. 아민 유도체형 경화제를 사용한 에폭시 경화물의 유리전이온도와 열팽창계수는 각각 $82.6^{\circ}C$와 71.2 $ppm/^{\circ}C$의 값을 나타냈다. Mercaptan 경화제를 사용한 에폭시 경화물의 경우 -SH 관능기가 증가할수록 유리전이온도는 급격히 감소하였다가 점차 증가하여 약 $80^{\circ}C$ 이상의 값을 갖는 경향을 보였고, 유리전이온도 이하에서 열팽창률은 약 80 $ppm/^{\circ}C$에서 최대 200 $ppm/^{\circ}C$까지 증가하였다가 약 100 $ppm/^{\circ}C$로 다시 감소하는 경향을 보였다. 아민 유도체형 경화제를 사용한 에폭시 경화물은 약 1.5 $mol/cm^3$의 가교밀도를 나타냈고, mercaptan 경화제를 사용한 에폭시 경화물은 약 1.0 $mol/cm^3$에서 약 1.7 $mol/cm^3$로 관능기가 증가할수록 가교밀도가 증가했다. 또한 $30^{\circ}C$에서 2700 MPa 이상의 저장 탄성률을 가질 수 있음을 확인하였다.

초임계 공정을 이용한 Thin-walled carbon nanotubes (TWNTs)/아민계 에폭시 첨가제의 복합체 제조 (Study on the Thin-walled carbon nanotubes (TWNTs)/Amine epoxy additive composite via supercritical fluid process)

  • 김용렬;정현택
    • 한국응용과학기술학회지
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    • 제31권3호
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    • pp.486-491
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    • 2014
  • 본 연구에서는, 유기용매를 사용하지 않는 친 환경적인 건식 공정과 초임계 공정을 이용한 Thin-multiwalled carbon nanotube (TWNTs)/아민계 에폭시 첨가제의 복합체 제조에 관하여 연구를 하였다. 제조된 TWNTs/아민계 에폭시 첨가제의 복합체는 우레탄기반의 비스페놀 A 타입의 에폭시 레진의 경화제로 사용하였다. TWNTs/아민계 에폭시 첨가제의 복합체를 경화제로 사용하여 제조된 에폭시 레진의 열적 성질을 Dynamic mechanical analysis (DMA)를 이용하여 분석 하였으며, 메트릭스상의 carbon nanotube의 높은 분산성은 SEM을 통하여 확인 하였다. 그 결과, 초임계 공정을 이용하여 제조된 에폭시 레진의 열적 성질과 매트릭스내의 carbon nanotube 분산성이 건식 공정을 사용 하였을 때 보다 더욱 증가된 결과를 확인 할 수 있었다.

BGA 패키지를 위한 언더필의 열적 특성과 유동성에 관한 연구 (Evaluation of Thermal Property and Fluidity with Underfill for BGA Package)

  • 노보인;이보영;김수종;정승부
    • Journal of Welding and Joining
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    • 제24권2호
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    • pp.57-63
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    • 2006
  • In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster.

Effects of Formaldehyde to Urea Mole Ratio on Thermomechanical Curing of Urea-Formaldehyde Resin Adhesives

  • Park, Byung-Dae;Kim, Jae-Woo
    • Journal of the Korean Wood Science and Technology
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    • 제35권5호
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    • pp.76-86
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    • 2007
  • This study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermomechanical curing of UF resin adhesives with different F/U mole ratios. Thermomechanical curing of these UF resin adhesives was characterized using parameters of dynamic mechanical analysis (DMA) such as the gel temperature, maximum storage modulus, and peak temperatures of storage and loss modulus. As the F/U mole ratio decreased, the gel temperature of UF resin adhesives increased. The maximum storage modulus as an indicator of the rigidity of UF resin adhesives decreased with decreasing F/U mole ratio. The peak temperature of tan $\delta$ increased with decreasing F/U mole ratio, indicating that the vitrification occurred faster for high F/U mole ratio of UF resin adhesives than for the one of lower F/U mole ratio. These results partially explained the reason why UF resin adhesives with lower F/U mole ratio resulted in relatively poor adhesion performance when they were applied.

기상성장 탄소나노섬유/에폭시 복합재료의 열적 및 기계적 특성에 관한 연구 (A Study on Thermal and Mechanical Properties of Vapor Grown Carbon Nanofibers-Reinforced Epoxy Matrix Composites)

  • 박수진;이은정;이재락
    • 폴리머
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    • 제29권5호
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    • pp.481-485
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    • 2005
  • 본 연구에서는 2관능성 에폭시 수지에 기상성장 탄소나노섬유(VGCNFs)를 0, 0.1, 0.5, 1.0 그리고 $2wt\%$ 함량 비로 첨가하여, 제조한 VGCNFs/에폭시 복합재료의 열적 및 기계적 특성을 고찰하고자 하였다. VGCNFs/에폭시 나노복합재료의 열적 특성은 TMA와 DMA로 알아보았으며, 기계적 특성은 만능 시험기와 낙하 충격 시험기 및 마찰$\cdot$마모 시험기를 통하여 관찰하였다. 실험 결과. VGCNFs의 함량이 증가할수록 열적 및 기계적 특성이 향상됨을 확인할 수 있었는데, 이는 현재의 복합재료 시스템에 있어서 VGCNFs와 에폭시 사이의 기계적 얽힘 현상의 향상을 가져오는 복합재료의 가교구조의 증가 때문이라 판단된다.

에폭시 아크릴레이트의 전자선 영향 평가 (Characterization of Electron Beam Cured Epoxy Acrylate)

  • 신진욱;오병환;고금진;전준표;강필현
    • 방사선산업학회지
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    • 제4권3호
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    • pp.271-276
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    • 2010
  • Epoxy resin has wide application in various industrial fields because of their good mechanical strength, superiority adhesion and low shrinkage etc. And the typical curing method for epoxy resins is thermal and press compaction. However, a curing method was used electron beam process in this study. Epoxy acrylate was fabricated from mixture of epoxy, acrylic acid, tetraphenylporphyrin (TPP) and hydroquinone monomethyl ether (MEHQ) with mole ratios. Then electron beam irradiation effect on the curing of the epoxy acrylate resin was investigated various absorption dose in nitrogen atmospheres at room temperature. The dynamic mechanical and thermal properties of the irradiated epoxy acrylate resins were characterized using dynamic mechanical analysis (DMA) and thermogravimetric analyzer (TGA). And the tensile and flexural strength were measured by an universal tensile machine (UTM).