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http://dx.doi.org/10.7317/pk.2013.37.5.557

Mechanical Properties of Low Temperature and Fast Cure Epoxy with Various Mercaptans  

Kim, Won Young (Department of Polymer Science and Engineering, Chungnam National University)
Eom, Se Yeon (Department of Polymer Science and Engineering, Chungnam National University)
Seo, Sang Bum (Korea Taconic)
Lee, Kee Yoon (Department of Polymer Science and Engineering, Chungnam National University)
Publication Information
Polymer(Korea) / v.37, no.5, 2013 , pp. 557-562 More about this Journal
Abstract
The thermal expansion and mechanical properties of diglycidyl ether of bisphenol A (DGEBA) with mercaptan hardeners were studied by a comparative method with an amine-adduct type hardener. Thermal expansion and dynamic mechanical properties were measured by thermo mechanical analysis (TMA) and dynamic mechanical ananlysis (DMA), respectively. The $T_g$ and the coefficient of thermal expansion (CTE) of epoxy/amine-adduct type hardener system were $82.6^{\circ}C$ and 71.2 $ppm/^{\circ}C$, respectively. As the number of -SH functional group of mercaptan hardener increased, the $T_g$ rapidly decreased and gradually increased up to ca. $80^{\circ}C$ and the CTE under the $T_g$ rapidly increased to ca. 200 $ppm/^{\circ}C$ from 80 $ppm/^{\circ}C$ and decreased to ca. 100 $ppm/^{\circ}C$. The crosslinking density of epoxy with amine-adduct type hardener was ca.1.5 $mol/cm^3$, while that of epoxy with mercaptan hardeners increased from 1.0 to 1.7 $mol/cm^3$, as the number of -SH functional group increased. The storage modulus can increase up to 2700MPa at $30^{\circ}C$.
Keywords
epoxy resin; mercaptan; thermal analysis; dynamic mechanical analysis;
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Times Cited By KSCI : 1  (Citation Analysis)
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