Evaluation of Thermal Property and Fluidity with Underfill for BGA Package |
Noh, Bo-In
(School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Lee, Bo-Young (Department of Aerospace and Mechanical Engineering, Hankuk Aviation University) Kim, Soo-Jung (Department of Aerospace and Mechanical Engineering, Hankuk Aviation University) Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) |
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