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Evaluation of Thermal Property and Fluidity with Underfill for BGA Package  

Noh, Bo-In (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Lee, Bo-Young (Department of Aerospace and Mechanical Engineering, Hankuk Aviation University)
Kim, Soo-Jung (Department of Aerospace and Mechanical Engineering, Hankuk Aviation University)
Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Publication Information
Journal of Welding and Joining / v.24, no.2, 2006 , pp. 57-63 More about this Journal
Abstract
In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster.
Keywords
BGA package; Underfill; Glass transition temperature; Viscosity;
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