1 |
J. H. Lau : Flip Chip Technologies, McGraw-Hill. 1996. 123-153
|
2 |
K. Schroder, H. Gelbe : Two-and three-dimensional CED-simulation of flow-induced vibration excitation in tube bundles, Chemical Enigineering and Processing, 38 (1999). 621-629
DOI
ScienceOn
|
3 |
D. T. Hsu. H. K. Kim. F. G. Shi, H. Y. Tong. S. Chungpaiboonpatana. C. Davidson. J.M. Adams : Curing kinetics and optimal cure schedulesfor underfill materials. Microelectronics Journal. 2000. 271-275
|
4 |
Chin-Lung Chiang, Chen-Chi M. Ma, Feng-Yih Wang, Hsu-Chiang Kuan : Thermo-oxidative degradation of novel epoxy containing silicon and phosphorus nanocomposite, European Polymer Journal, 2003, 825-830
|
5 |
J. H. Lau : Low Cost Flip Chip Technologies: For DCA. WLCSP, and PBGA Assemblies, 2000, 183-222
|
6 |
De-Shin Liu, Chirr-Yu Ni : A study on the electrical resistance of solder joint interconnections, Microelectronic Engineering, 2002. 363-372
|
7 |
Jurgen Stabel, Mingmin Ren: Fluid-structureinteraction for the analysis of the dynamics of fuel storage racks in the case of seismic loads, Nuclear Engineering and Design, 206 (2001). 167-176
DOI
|
8 |
S.Gordeev, V. Heinzel. V. Slobodtechouk : Features of convective heat transfer in heated helium channelflow, International Journal of Heat and Mass Transfer, 48 (2005). 3363-3380
DOI
ScienceOn
|
9 |
Chun Shan Wang. Ching Hsuan Lin : Novel phosphorus-containing epoxy resins. Part II: curing kinetics. Polymer 41 (2000). 8579-8586
DOI
ScienceOn
|
10 |
S. Alberici, A. Dellafiore, G. Manzo, G. Santospirito, C.M. Villa, L.Zanotti : Organic contamination study for adhesion enhancement between final passivation surface and packaging molding compound. Microelectronic Engineering, 2004. 227-234
|
11 |
Y.C. Chan. P. L. Tu, K. C. Hung: Study of the self-alignment -of no-flow underfill for micro-BGA assembly, Microelectronics Reliability, 2001. 1867-1875
|
12 |
Young-Shin Cho, Mi-Ja Shim. Sang-Week Kim : Thermal degradation kinetics of PE by the kissinger equation. Materials Chemistry and Physics 52 (1998). 94-97
DOI
ScienceOn
|
13 |
Yah-Fang Duann, Tsan-Min Liu, Kuo-Chung Cheng, W.-F. Su : Thermal stability of some naphthalene and phenyl-based epoxy resin. Polymer Degradation and Stability. 2004. 305-310
|
14 |
Yi He : DSC and DEA studies of underfill curing kinetics., Thermochimica Acta, 367-368 (2001). 101-106
DOI
ScienceOn
|
15 |
L. Nguyen. C. Quentin. P. Fine. B. Cobb. S. Bayyuk. H. Yang. and S. A.Bidstrupt-Allen : IEEE Transactions on Components and Packaging Technologies. 1999, 168-176
|
16 |
Yi. He, Brian E. Moreira, Alan Overson, Stacy H. Nakamura, Christine Bider, John F. Briscoe : Thermal characterization of an epoxy-based underfill material flip chip packaging, Thermochimica Acta.1-8 (2000). 357-358
|