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Effects of Formaldehyde to Urea Mole Ratio on Thermomechanical Curing of Urea-Formaldehyde Resin Adhesives  

Park, Byung-Dae (Department of Wood Science and Technology, Kyungpook National University)
Kim, Jae-Woo (Tennessee Forest Products Center, University of Tennessee)
Publication Information
Journal of the Korean Wood Science and Technology / v.35, no.5, 2007 , pp. 76-86 More about this Journal
Abstract
This study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermomechanical curing of UF resin adhesives with different F/U mole ratios. Thermomechanical curing of these UF resin adhesives was characterized using parameters of dynamic mechanical analysis (DMA) such as the gel temperature, maximum storage modulus, and peak temperatures of storage and loss modulus. As the F/U mole ratio decreased, the gel temperature of UF resin adhesives increased. The maximum storage modulus as an indicator of the rigidity of UF resin adhesives decreased with decreasing F/U mole ratio. The peak temperature of tan $\delta$ increased with decreasing F/U mole ratio, indicating that the vitrification occurred faster for high F/U mole ratio of UF resin adhesives than for the one of lower F/U mole ratio. These results partially explained the reason why UF resin adhesives with lower F/U mole ratio resulted in relatively poor adhesion performance when they were applied.
Keywords
formaldehyde to urea mole ratio; urea-formaldehyde resin; thermomechanical cure; dynamic mechanical analysis;
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