• 소성∙가공
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• 제10권7호
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• pp.525-533
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• 2001

PET bottles are main]y manufactured by the stretch blow-molding process. In order to improve the thickness distribution to avoid crack generation at bottom region of one-piece PET bottle, process analysis of stretch blow-molding using a finite element method has been carried out. Finite element analysis has been carried out using ABAQUS/Standard. CREEP user subroutine provided in ABAQUS has been used to model PET behavior that is rate sensitive. Among the process parameters, the effect of plunger movement to thickness distribution of bottle has been considered by axisymmetric analysis. A modified process of plunger movement, which yields more uniform thickness distribution, has been proposed. 3D FE analysis has been done to confirm the validity of the proposed process.

• 반도체디스플레이기술학회지
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• 제20권1호
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• pp.18-24
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• 2021

The current settlement and distribution used in theme, background and signal music market other than conventional music is being carried out with either the comprehensive settlement method or the measured meter-rate settlement method in the payment process of collected user fees and compensation depending on the use-permission types. In this settlement and distribution process, however, the reliability issues are often being raised because of the difficulty of tracking rights due to changes in music source rights management information, etc, and the opaque settlement and distribution method itself. This paper proposes a new settlement and distribution platform using a blockchain for the reliable collection and distribution of copyright fees among music user group, monitoring organization group, trust organization group and copyright holders, based on the monitoring information of the theme, background and signal music usage. This platform also provides the transparency in settlement and distribution process among stakeholders through smart contract system.

• Journal of Information Technology Applications and Management
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• 제28권4호
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• pp.13-20
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• 2021

In this paper, I was applied the life distribution following linear failure rate distribution, Lindley distribution and Burr-Hatke exponential distribution extensively used in the arena of software reliability and were associated the reliability possessions of the software using the nonhomogeneous Poisson process with finite failure. Furthermore, the average value functions of the life distribution are non-increasing form. Case of the linear failure rate distribution (exponential distribution) than other models, the smaller the estimated value estimation error in comparison with the true value. In terms of accuracy, since Burr-Hatke exponential distribution and exponential distribution model in the linear failure rate distribution have small mean square error values, Burr-Hatke exponential distribution and exponential distribution models were stared as the well-organized model. Also, the linear failure rate distribution (exponential distribution) and Burr-Hatke exponential distribution model, which can be viewed as an effectual model in terms of goodness-of-fit because the larger assessed value of the coefficient of determination than other models. Through this study, software workers can use the design of mean square error, mean value function as a elementary recommendation for discovering software failures.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.777-778
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• 2013

• 경영과학
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• 제28권3호
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• pp.73-82
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• 2011

Basel II advanced measurement approaches for operational risk need to estimate the frequency and severity distribution of operational losses. Due to lack of internal loss data, the estimation is impossible in many cases and so external loss data might be used by scaling on asset or gross income. To get around lack of loss data, scenario analysis combined with loss distribution approach can be useful in calculating the capital charge of operational risk. However, scenario based loss distribution approach requires much time and effort. Instead we may apply the analytic hierarchy process to measure operational risk of financial institutions. The analytic hierarchy process combined with loss distribution approach is to estimate the capital charge of operational risk in other areas based on the operational VaR in an area with sufficient loss data. AHP provides a tool for timely measurement of operational risk in this rapidly changing global environment.

• Journal of Advanced Marine Engineering and Technology
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• 제25권5호
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• pp.1058-1064
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• 2001

In this paper, the development of probability distribution estimation program for fatigue crack growth lives was summarize. The probability distribution estimation program of life was developed to increase the reliability of life estimation. In this study, it is considered that the cause of scatter in fatigue crack growth data is due to material inhomogeneity. The material resistance to fatigue crack growth is modelled as a spatial stochastic process, which varies randomly along the crack path. We developed the GUI program to estimate the probability distribution and reliability using the non-Gaussian stochastic process method. This program can be used for the reliability assessment.

• 한국정밀공학회지
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• 제20권5호
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• pp.39-39
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• 2003

As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer or beyond. To meet such requirements, it is essential to understand the CMP equipment and process itself. In this paper, authors suggest the velocity distribution on the wafer, direction of friction force and the uniformity of velocity distribution of conventional rotary CMP equipment in an analytical method for an intuitive understanding of variation of kinematic variables. To this end, a novel dimensionless variable defined as “kinematic number” is derived. Also, it is shown that the kinematic number could consistently express the velocity distribution and other kinematic characteristics of rotary CMP equipment.

• 한국정밀공학회지
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• 제20권5호
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• pp.29-38
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• 2003

As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer or beyond. To meet such requirements, it is essential to understand the CMP equipment and process itself. In this paper, authors suggest the velocity distribution on the wafer, direction of friction force and the uniformity of velocity distribution of conventional rotary CMP equipment in an analytical method for an intuitive understanding of variation of kinematic variables. To this end, a novel dimensionless variable defined as “kinematic number” is derived. Also, it is shown that the kinematic number could consistently express the velocity distribution and other kinematic characteristics of rotary CMP equipment.

• 대한전기학회논문지:전력기술부문A
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• 제50권10호
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• pp.447-453
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• 2001

This paper presents the unified reliability evaluation technique of distribution system. To calculate accurate reliabi1ity and reliability indices which can consider line limitation and voltage drop of distribution system, we employed the deterministic evaluation technique with PLOC technique. And to evaluate the distribution system, we presented the evaluating method which is based on Analytic network process. As a result, we can evaluate the distribution system and build the expansion planning of the system considering system load and reliability indices.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.449-453
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• 2005

Electrochemical systems find widespread technical application. Industrial electrolytic process include electroplating, electroforming, and electropolishing. Electroforming and electroplating is widely used in the manufacture of metal parts. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process. And make an experiment on its relation and electroformed thickness. It shows that it is useful method using FEM with multi-physics to estimate electroformed thickness.