• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.2
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• pp.238-246
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• 2004

This paper reports an experimental study around a module about forced air flow by blower (35${\times}$35${\times}$6㎣) in a portable personal computer model(200${\times}$235${\times}$10㎣). Experimental report is to know three data to investigate thermal resistance, adiabatic wall temperature and visualized fluid flow around the module by combination of the moving number and the arrangement method of blower. The channel inlet flow velocity has been varied between 0.26, 0.52 and 0.78㎧, and input power ( $Q_{p}$) to the module is 4W. To investigate thermal resistance. the heated module is mounted on two boards(110${\times}$110${\times}$1.2㎣, k=20.73, 0.494W/ $m^{\circ}C$) in parallel-plate channel to forced air flow. The temperature distribution were visualized by heated module on acrylic board(k=0.262W/ $m^{\circ}C$) using liquid crystal film. Fluid flow around the module were visualized using particle image velocimetry system.

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of Power Electronics
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• v.12 no.5
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• pp.813-820
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• 2012

This paper presents the development of a software supported acquisition system for metrological verification and testing of the equipment for monitoring and analysis of the basic electrical power quality parameters. The described procedure consists of two functionally connected segments. The first segment involves generation of the reference three-phase voltage signals, including the possibility of simulation of the various power quality disturbances, typical for electrical power distribution networks. The second part of this procedure includes the real-time recording of power quality disturbances in three-phase distribution networks. The procedure is functionally supported by the virtual instrumentation concept, including a software application developed in LabVIEW environment and data acquisition boards NI 6713 and NI 9215A. The software support of this system performs graphical presentation of the previously generated and recorded signal waveforms. A number of the control functions and buttons, implemented on the virtual instrument front panels, are provided to adjust the basic signal acquisition, generation and recording parameters.

• International journal of advanced smart convergence
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• v.10 no.4
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• pp.278-288
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• 2021

Recently, IoT systems are cloud-based, so that continuous and large amounts of data collected from sensor nodes are processed in the data server through the cloud. However, in the centralized configuration of large-scale cloud computing, computational processing must be performed at a physical location where data collection and processing take place, and the need for edge computers to reduce the network load of the cloud system is gradually expanding. In this paper, a cluster system consisting of 6 inexpensive Raspberry Pi boards was constructed to perform fast data processing. And we propose "Kubernetes cluster system(KCS)" for processing large data collection and analysis by model distribution and data pipeline method. To compare the performance of this study, an ensemble model of deep learning was built, and the accuracy, processing performance, and processing time through the proposed KCS system and model distribution were compared and analyzed. As a result, the ensemble model was excellent in accuracy, but the KCS implemented as a data pipeline proved to be superior in processing speed..

• Korean Chemical Engineering Research
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• v.54 no.1
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.56-62
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• 2013

The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

• Proceedings of the KSRS Conference
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• 1999.11a
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• pp.43-47
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• 1999

In this paper, we describe the configuration of the KITSAT-3 image data receiving, archiving, processing and distribution system in operation. Following the low-cost and software-based design concept, the whole system is composed of three PCs : two for data receiving, archiving and processing which provide a full dual-redundant configuration and one for image catalog browsing which can be accessed by public users. Except that receiving and archiving PCs have serial data ingest boards plugged in, they are configured by general peripherals. This basic and simple hardware configuration made it possible to show that a very low cost system can support a full ground operation for the utilization of high-resolution satellite image data.

• Proceedings of the Korean Geotechical Society Conference
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• 2000.11a
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• pp.33-40
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• 2000

The horizontal drain method is one of the soil improvement methods in reclamation works using dredged soils. In this method, plastic drain boards are installed horizontally in the ground, and a seepage pressure or negative pressure is applied through one end of these drains. In this study, a basic consolidation test using horizontal drains was conducted to investigate the effectiveness of this method. The configuration of soil box which was used in this test is 100cm(B)${\times}$100cm(L)${\times}$85cm(H). The drain board was reduced to 25mm${\times}$5mm. The variations in settlement and volume of drain water during the consolidation process were measured, and the distribution of water content and the transpormation of horizontal drain were investigated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.430-436
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• 2008

This paper proposes a way to predict electrical lifetime of a relay using Accelerated Life Testings (ALTs). The relay of interest mounting on printed circuit boards is usually under an inrush current stress. The inrush current is generated and accelerated through controlling a lamp switching device in the ALT. We find that the dominant failure mechanism under high levels of inrush current would be contact welding in the contact surface of the relay and the contact welding process is accelerated according to increase in inrush current. The electrical lifetime model based on Inverse Power Law in term of inrush current is proposed, and parameters characterizing relay's lifetime distribution are statistically estimated using ALTA 6 PRO software.