• Title/Summary/Keyword: diode structure

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Design of Small-Size High-Power SPDT PIN Diode Switch with Defected Ground Structure for Wireless Broadband Internet Application (결함접지구조(Defected Ground Structure)를 갖는 휴대 인터넷용 소형 고전력 SPDT PIN 다이오드 스위치 설계)

  • Kim Dong-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.10 s.101
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    • pp.1003-1009
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    • 2005
  • In this paper, small-size high-power single pole double throw(SPDT) switch with defected pound structure(DGS) is presented for wireless broadband internet application. To reduce the circuit size using slow-wave characteristic, the DGS is applied to ${\lambda}/4$ transmission line of the switch and the measured results are compared with them of conventional switch. To secure high degree of isolation, the switch with the DGS is composed of shunt-connected PIN diodes and shows insertion loss of 0.8 dB and isolation more than 50 dB at 2.3 GHz. The size of the switch is reduced about $50\%$ only with the DGS patterns while it has very similar performance to the conventional shunt-type switch.

Process and Structure Design for High Power Reverse-Conducting Gate Commutated Thyristors (RC- GCTs) (고전압 역도통 Gate Commutated Thyristor (RC-GCT) 소자의 공정 및 구조 설계)

  • Kim, Sang-Cheol;Kim, Eun-Dong;Zhang, Chang-Li;Kim, Nam-Kyun;Baek, Do-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.1096-1099
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    • 2001
  • The basic design structure of RC-GCTs (Reserve-Conducting Gate-Commutated Thyristors) is firstly given in this paper. The bulk of wafer is punch-through (PT) type with high resistivity and narrow N-base width. The photo-mask was designed upon the turn-off characteristics of GCT and solution of separation between GCT and diode part. The center part of Si wafer is free-wheeling diode (FWD) and outer is GCT part which has 240 fingers totally. The switching performance of GCT was investigated by Dessis of ISE. The basic manufacture process of 2500V-4500V RC-GCTs was given in this work. Additionally, the local carrier lifetime control by 5Mev proton irradiation was adopted so as to not only to have the softness of reverse recovering for FWD but for reduction of turn-off losses of GCT as well.

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Modeling and HSPICE analysis of the CMOS image sensor pixel with the complementary signal path (상보형 신호경로 방식의 CMOS 이미지센서 픽셀 모델링 및 HSPICE 해석)

  • Kim, Jin-Su;Jung, Jin-Woo;Kang, Myung-Hun;Noh, Ho-Sub;Kim, Jong-Min;Lee, Jae-Woon;Song, Han-Jung
    • Journal of Sensor Science and Technology
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    • v.17 no.1
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    • pp.41-52
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    • 2008
  • In this paper, a circuit analysis of the complementary CMOS active pixel and readout circuit is carried out. Complementary pixel structure which is different from conventional 3TR APS structure is consist of photo diode, reset PMOS, several NMOSs and PMOSs sets for complementary signals. Photo diode is modelled with Medici device program. HSPICE was used to analyze the variation of the signal feature depending on light intensity using $0.5{\mu}M$ standard CMOS process. Simulation results show that the output signal range is from 0.8 V to 4.5 V. This signal range increased 135 % output dynamic range compared to conventional 3TR pixel in the condition of 5 V power supply.

A Simple Analytical Model for the Study of Optical Bistability Using Multiple Quantum Well p-i-n Diode Structure

  • Jit, S.;Pal, B.B.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.1
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    • pp.63-73
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    • 2004
  • A simple analytical model has been presented for the study of the optical bistability using a $GaAs-Al_{0.32}Ga_{0.68}As$ multiple quantum well (MQW) p-i-n diode structure. The calculation of the optical absorption is based on a semi-emperical model which is accurately valid for a range of wells between 5 and 20 nm and the electric field F< 200kV/cm . The electric field dependent analytical expression for the responsivity is presented. An attempt has been made to derive the analytical relationship between the incident optical power ( $(P_{in})$ ) and the voltage V across the device when the diode is reverse biased by a power supply in series with a load resistor. The relationship between $P_{in}$ and $P_{out}$ (i.e. transmitted optical power) is also presented. Numerical results are presented for a typical case of well size $L_Z=10.5nm,\;barrier\;size\;L_B=9.5nm$ optical wave length l = 851.7nm and electric field F? 100kV/cm. It has been shown that for the values of $P_{in}$ within certain range, the device changes its state in such a way that corresponding to every value of $P_{in}$ , two stable states and one unstable state of V as well as of $P_{out}$ are obtained which shows the optically controlled bistable nature of the device.

Electrical characteristics of polycrystalline 3C-SiC thin film diodes (다결정 3C-SiC 박막 다이오드의 전기적 특성)

  • Chung, Gwiy-Sang;Ahn, Jeong-Hak
    • Journal of Sensor Science and Technology
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    • v.16 no.4
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    • pp.259-262
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    • 2007
  • This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode Layer (이중 음극층을 이용한 고휘도 전면발광(Top emission) 유기EL소자의 특성평가)

  • Kang, Yoon-Ho;Lee, Su-Hwan;Shin, Dong-Won;Kim, Sung-Jun;Kim, Dal-Ho;Lee, Gon-Sub;Park, Jea-Gun
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.3 s.16
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    • pp.23-27
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    • 2006
  • Recently, Top emission organic light-emitting diode (TEOLED) has been attracted by their potential application for the development of flat panel display (FPD). We have fabricated the high luminance top emission organic-emitting diode (TEOLED) using dual cathode layer and three top emitting structure. These devices were characterized by electroluminescence (EL) and current density-voltage (J-V) measurements. After compared it with Au anode structure, luminance of the device using dual anode was better than using without Al device. Consequently, Al layers are very good candidates for a promising electron-injecting buffer layer for top emission light-emitting diode (TEOLED).

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Properties of Y3Al5O12:Ce3+,Pr3+ Single Crystal for White Laser Lightings (백색 레이저 조명용 Y3Al5O12:Ce3+,Pr3+ 단결정 특성)

  • Kang, Taewook;Lim, Seokgyu;Kim, Jongsu;Lee, Bong
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.4
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    • pp.37-41
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    • 2018
  • $Y_3A_{l5}O_{12}:Ce^{3+},Pr^{3+}$ single crystal phosphor was prepared by floating zone method. single crystal was confirmed to have a Ia-3d (230) space group of cubic structure and showed regular morphology. The optical properties, single crystal exhibited a emission band from green, yellow wide wavelength and 610nm, 640nm red wavelength vicinity. The luminance maintenance rate was decreased by phonon with increasing temperature, but high luminance is maintained more than powder phosphor. In addition, $Y_3A_{l5}O_{12}:Ce^{3+},Pr^{3+}$ single crystal phosphor was applied to a high power blue laser diode, we implemented high power white laser lightings. and it was confirmed that thermal properties over time, due to the effective heat transfer of complete crystal structure. We confirmed that excellent radiant heat properties than powder phosphor was applied to a high power white laser diode.

Development of a Fast Neutron Detector (속중성자 탐지용 반도체 소자 개발)

  • 이남호;김승호;김양모
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.12
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    • pp.545-552
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    • 2003
  • When a Si PIN diode is exposed to fast neutrons, it results in displacement damage to the Si lattice structure of the diode. Defects induced from structural dislocation become effective recombination centers for carriers which pass through the base of a PIN diode. Hence, increasing the resistivity of the diode decreases the current for the applied forward voltage. This paper involves the development of a neutron sensor based on the phenomena of the displacement effect damaged by neutron exposure. The neutron effect on the semiconductor was analyzed. Several PIN diode arrays with various thickness and cross-section area of the intrinsic layer(I layer) were fabricated. Under irradiation tests with a neutron beam, the manufactured diodes have a good linearity to neutron dose and show that the increase of thickness of I layer and the decrease of cross-section of PIN diodes improve the sensitivity. Newly developed PIN diodes with thicker I layer and various cross section, were retested and then showed the best neutron sensitivity at the condition that the I layer thickness was similar to a side length. On the basis of two test results, final discrete PIN diodes with a rectangular shape were manufactured and the characteristics as neutron detectors were analyzed through the neutron beam test using on-line electronic dosimetry system. Developed PIN diode shows a good linearity as dosimetry in the range of 0 to 1,000cGy(Tissue) and its neutron sensitivity is 13mV/cGy at constant current of 5mA, that is three times higher than that of commercially available neutron detectors. And the device shows little dependency on the orientation of the neutron beam and a considerable stability in annealing test for a long period.

Direct Conversion receiver adapting DC offset free diode mixer (직접 변환수신기 (direct conversion receiver)에 적합한 DC offset이 없는 주파수 변환기를 채용한 직접변환 수신기의 설계)

  • 박필재;유현규;조한진
    • Proceedings of the IEEK Conference
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    • 2000.11a
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    • pp.361-364
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    • 2000
  • One of the problems using DCR(Direct Conversion Receiver) are DC offset, poor channel selectivity. APDP(Anti Parallel Diode Pair) can be good candidate for DCR frequency mixer due to its inherent End harmonic suppression. APDP shows good IP2 and DC suppression. This paper describe single APDP LO power characteristics, IP2, and receiver structure utilizing APDP frequency mixer

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Study of White Polymer Light Emitting Diode with Blending Method

  • Shin, Byong-Wook;Lee, Sung-Youp;Lee, Eui-Wan;Lee, Hyeong-Rag
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1461-1463
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    • 2007
  • In this study, we report the luminescent properties of white polymer light emitting diode (WPLED) fabricated by soluble methods with poly-fluorenebased polymers blends which emit blue and yellow light. A device structure of ITO/PEDOT:PSS/Emissive Layer (EML)/Al was employed.

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