• 한국재료학회지
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• 제26권6호
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• pp.342-346
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• 2016

To observe the bonding structure and electrical characteristics of a GZO oxide semiconductor, GZO was deposited on ITO glasses and annealed at various temperatures. GZO was found to change from crystal to amorphous with increasing of the annealing temperatures; GZO annealed at $200^{\circ}C$ came to have an amorphous structure that depended on the decrement of the oxygen vacancies; increase the mobility due to the induction of diffusion currents occurred because of an increment of the depletion layer. The increasing of the annealing temperature caused a reduction of the carrier concentration and an increase of the bonding energy and the depletion layer; therefore, the large potential barrier increased the diffusion current dna the Hall mobility. However, annealing temperatures over $200^{\circ}C$ promoted crystallinity by the defects without oxygen vacancies, and then degraded the depletion layer, which became an Ohmic contact without a potential barrier. So the current increased because of the absence of a potential barrier.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Journal of Welding and Joining
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• 제15권2호
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• pp.43-53
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• 1997

The complete joining method for dissimilar press punch materials and its real-time evaluation method is not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction welding with a diffusion mechanism in bonding was applied in this study. This work was carried out to determine the proper friction welding conditions and to analyze mechanical properties of friction welded joints of sintered carbide tool materials (SKNM50 for the blade part of press punch) to alloy steel (SCM440 for the shank part of press punch) using aluminum (A6061 for the interlayer material) as an insert material between the sintered carbide tool materials and the alloy steel. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• 동력기계공학회지
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• 제4권4호
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• pp.54-58
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• 2000

The complete joining method for dissimilar hot die punch materials and its real-time evaluation method are not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction welding with a diffusion mechanism in bonding was applied in this study. So, this work was carried out to determine the optimal friction welding conditions and to analyze mechanical properties of friction welded joints of hot die punch materials (STD61 for the blade part of hot die punch) to alloy steel (SCM440 for the shank part of hot die punch) such as plunger. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1130-1131
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• 2006

We found that the """interface reaction between Ni-based alloy bond, diamond, and steel core is very critical in bond strength of diamond tool. None element from metal bond diffuses into the steel core but the Fe element of steel core was easily diffused into the bond. This diffusion depth of Fe has a great effect on the bonding strength. The Cr in steel core accelerated the Fe diffusion and improved the bond strength, on the other hand, carbon decreased the strength. Ni-based alloy bond including Cr was chemically bonded with diamond by forming Cr carbide. However, the Cr and Fe in STS304 were largely interdiffused, the strength was very low. The Cr passivity layer formed at surface of STS304 made worse strength at commissure in brazing process.

• 대한금속재료학회지
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• 제48권2호
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• pp.116-121
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• 2010

The Mg-Zn-RE alloy cladded with the thin Al1050 sheet was fabricated by means of a roll bonding process at $280^{\circ}C$.Microstructures and mechanical properties of the clad sheets were investigated. After heat treatment at $230^{\circ}C$ for 30 min, an Mg-rich diffusion layer with about $2{\mu}m$ in thickness was developed at the Mg and Al interface. Tensile tests were carried out in a temperature range up to $300^{\circ}C$. The clad sheet exhibits superior elongation to failure not only at room temperature but also at elevated temperatures compared with those of the Mg alloy sheet. For the deformed specimens, interface debonding does not occur and the diffusion layer shows only a few cracks.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1993년도 특별강연 및 춘계학술발표 개요집
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• pp.70-72
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• 1993

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1998년도 특별강연 및 추계학술발표 개요집
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• pp.97-100
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• 1998

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1991년도 특별강연 및 추계학술발표 개요집
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• pp.32-34
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• 1991

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1999년도 특별강연 및 추계학술발표대회 개요집
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• pp.236-238
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• 1999