• 한국전기전자재료학회논문지
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• 제26권11호
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• pp.816-820
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• 2013

We investigated the characteristics of the silicon oxy-nitride and nitride films grown by plasma-enhanced chemical vapor deposition (PECVD) at the low temperature with a varying $NH_3/N_2O$ mixing ratio and a fixed $SiH_4$ flow rate. The deposition temperature was held at $150^{\circ}C$ which was the temperature compatible with the plastic substrate. The composition and bonding structure of the nitride films were investigated using Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS). Nitrogen richness was confirmed with increasing optical band gap and increasing dielectric constant with the higher $NH_3$ fraction. The leakage current density of the nitride films with a high NH3 fraction decreased from $8{\times}10^{-9}$ to $9{\times}10^{-11}(A/cm^2$ at 1.5 MV/cm). This results showed that the films had improved electrical properties and could be acceptable as a gate insulator for thin film transistors by deposited with variable $NH_3/N_2O$ mixing ratio.

• 한국전기전자재료학회논문지
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• 제15권9호
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• pp.783-787
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• 2002

In recent year, B $i_{4-}$x L $a_{x}$ $Ti_3$ $O_{12(BLT)}$ is one of promising substitute materials for the ferroelectric random access memory(FRAM) applications. But the systematic composition is still insufficient, so this experiment was carried out in ceramic ambient sintering process which has the very excellent ferroelectric property. Samples were prepared by a bulk and the purpose which was estimated with a suitability of thin films applications. The density of B $i_{3.75}$ L $a_{0.25}$ $Ti_3$ $O_{12}$ was high and the XRD pattern showed that the intensity of main peak (117) was increased at the argon ambient sintering. Controlling the quantity of oxygen, crystallization showed a thin, long plate like type, and we obtained the excellent dielectric and polarization properties at the argon atmosphere sintering. Also this sintering process was effective at the bulk sample. Argon ambient sintered sample produced higher permittivity of 154, the remanent polarization(2Pr) of 6.8 uC/$\textrm{cm}^2$ compared with that sintered in air and oxygen ambient. And this sintering process showed a possibility which could be applied to thin films process..

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.117-120
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• 1998

In this study, $Al_2O_3/MgO$ bilayer was prepared with Electron-beam evaporation and the properties of the film was investigated in order to improve the property of MgO film, which is used for the protection layer in PDP(P1asma Display Panel). The thickness of $Al_2O_3/MgO$ bilayer was optimized by the Matrix Theory for the fabrication of antireflection structure for 5350A wavelength. The secondary electron emission yields of as-deposited film and annealed film were measured and compared, the bilayer was considered for the applicability as PDP. XRD showed the strong (200) primary peak of MgO. The intensity of (200) peak in the film annealed at 300C was decreased. As the result of SEM analysis for MgO films and Alz03 films, it is considered that the morphology of the films were improved of roughness and it were condensed by annealing.

• Korean Chemical Engineering Research
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• 제46권4호
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• pp.824-832
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• 2008

용매인 물과 마이셀을 이루지 않고 있는 계면활성제 단분자를 포함한 단분산 마이셀 용액을 통계 역학적으로 고찰하였다. 본 논문에서 논의된 모델은 물, 계면활성제 단분자와 마이셀로 이루어진 계에 대한 것이며, 계면활성제 단분자의 분배 함수와 마이셀의 분배 함수는 용매인 물과의 서로 작용을 포함하고 있다. 이 모델에서 계는 용매의 유전 상수를 갖는 이상 기체로 가정하였는데 이것은 보통 유체를 연속체로 보는 관점과 일치한다. 이 모델은 임계 마이셀 농도(CMC)가 온도에 대해 ln CMC = A+BT+C/T+DlnT와 같이 변하는 결과를 제공하여 임계 마이셀 농도의 온도 의존성을 이론적으로 해석할 수 있는 기반을 구축하였다. 이 식에서 T는 온도이고 A, V, C, D는 마이셀을 이루는 계면활성제 분자의 성질에 의존하는 상수이다.

• 한국재료학회지
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• 제18권3호
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• pp.148-152
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• 2008

A new cost-effective atomic layer deposition (ALD) technique, known as Proximity-Scan ALD (PS-ALD) was developed and its benefits were demonstrated by depositing $Al_2O_3$ and $HfO_2$ thin films using TMA and TEMAHf, respectively, as precursors. The system is consisted of two separate injectors for precursors and reactants that are placed near a heated substrate at a proximity of less than 1 cm. The bell-shaped injector chamber separated but close to the substrate forms a local chamber, maintaining higher pressure compared to the rest of chamber. Therefore, a system configuration with a rotating substrate gives the typical sequential deposition process of ALD under a continuous source flow without the need for gas switching. As the pressure required for the deposition is achieved in a small local volume, the need for an expensive metal organic (MO) source is reduced by a factor of approximately 100 concerning the volume ratio of local to total chambers. Under an optimized deposition condition, the deposition rates of $Al_2O_3$ and $HfO_2$ were $1.3\;{\AA}/cycle$ and $0.75\;{\AA}/cycle$, respectively, with dielectric constants of 9.4 and 23. A relatively short cycle time ($5{\sim}10\;sec$) due to the lack of the time-consuming "purging and pumping" process and the capability of multi-wafer processing of the proposed technology offer a very high through-put in addition to a lower cost.

• 한국재료학회지
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• 제8권8호
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• pp.775-779
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• 1998

$\textrm{BaCo}_{x}\textrm{Ti}_{x}\textrm{Fe}_{12-2x}\textrm{O}_{19}$($1.0\leq\textrm{x}\leq5.0$)의 치환량 x에 따른 마이크로파 유전특성을 조사하기 위하여 5-10GHz 대역에서의 공명주파수 fo 및 무부하인자 Qu를 wave guide 방법으로 측정하였다. 측정결과, 치환양의 증가에 따라 유전율은 14.7(x=1)에서 23.4(x=5)까지 증가하였으며 계산결과 loss tangent는 모두 $\textrm{10}^{-3}$정도로 작았다. 이러한 제특성은 저비용으로 제조가능한 CoTi 치환형 Barium ferrite가 공진기 안테나 등 마이크로파 소자에 응용이 가능한 유망한 재료임을 보여주었다.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.319-324
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• 2002

In this study, the reduce of plasma etching damage in PZT thin film with addictive gas and re-annealing after etching have been investigated. The PZT thin films were etched as a function of $Cl_2/CF_4$ with addition of Ar and $O_2$ with inductively coupled plasma. The etch rates of PZT thin films were 1450 ${\AA}/min$ at 30% additive Ar and 1100 ${\AA}/min$ at 10% auditive $O_2$ into $Cl_2/CF_4$ gas mixing ratio of 8/2. In order to reduce plasma damage of PZT thin films after etching, the etched PZT thin films were re-annealed at various temperatures at $O_2$ atmosphere. From the hysteresis curries, the ferroelectric properties are improved by $O_2$ re-annealing process. The improvement of ferroelectric behavior at annealed PZT films is consistent wish the increase of the (100) and (200) PZT peaks revealed by x-ray diffraction (XRD). From x ray photoelectron spectroscopy (XPS) analysis, the intensity of Pb-O, Zr-O and Ti-O peak are increased and the chemical residue peak is reduced by $O_2$ re-annealing. The ferroelectric behavior consistent with the dielectric nature of $Ti_xO_y$ is recovered by $O_2$ recombination during rapid thermal annealing process.

• 한국세라믹학회지
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• 제51권6호
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• pp.623-628
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• 2014

Orthorhombic $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals are fabricated using the cost-effective solid-state single crystal growth (SSCG) method; their dielectric and piezoelectric properties are also characterized. Measurements show that (001) $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals have an electromechanical coupling factor ($k_{33}$) higher than 0.83, piezoelectric charge constant ($d_{33}$) of about 400 [pC/N], and piezoelectric voltage constant ($g_{33}$) higher than 50 [${\times}10^{-3}Vm/N$]. The transition temperature ($T_{OT}$) of the (001) $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals between orthorhombic and tetragonal phases is also observed to be about $61^{\circ}C$. Because their electromechanical coupling factor ($k_{33}$) and piezoelectric voltage constant ($g_{33}$) are higher than those of soft PZT ceramics, it is expected that (001) $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals can be used as "lead-free" piezoelectric materials in many piezoelectric applications.

• 조명전기설비학회논문지
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• 제13권4호
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• pp.87-95
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• 1999

새로운 종류의 고체상태 대전력, 고속전자장치 즉 광전도전력스위치(PCPS)의 가장 큰 문제점은 평균전계하의 표면에서 스위치 섬락의 대부분이 반도체의 벌크파괴보다 낮다는 것이다. 이러한 문제를 극복하고 고밀도 고체 전력 스위치에 사용할 수 있는 유일한 방법이 고체 절연물로 표면을 페시베이션(Passivation)하는 것이다. 본 실험에서 Silicon의 절연내력은 진공중에서 10[kV/cm]에서 심하게 열화되어졌고, 기중에서 30[kV/cm], SF6에서 80∼90[kV/cm]으로 개선되지만, 스위치의 주 응용이 진공 또는 우주에서 사용되기 때문에 이러한 현상은 매우 심각한 문제이다. 페시베이션후 소자들은 진공과 기중에서 언페시베이션된 소자가 SF6내에서 얻을 수 있는 만큼의 높은 파괴값을 가졌다. 이러한 결과로 볼 때 페시베이션된 소자들이 매우 우수한 파괴값을 가진다는 것을 알 수 있다. 본 논문은 고전계 하에서 페시베이션 전·후 실리콘 파괴의 주 특성과 메커니즘에 대해 밝혔다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 1999년도 추계종합학술대회
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• pp.552-554
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• 1999

포논산란과 임팩트이온화 모델은 풀밴드 모델과 페르미 황금법칙을 이용한 고에너지 영역에서 hot carrier 전송을 해석하기 위해서 제시되어 왔다. 본 연구에서는 77K와 300k에서 실제에너지 밴드 구조를 이용한 Si의 임팩트이온화 과정에 대해서 온도 의존성을 조사했다. 풀밴드 모델은 local form factors을 이용한 의사포텐셜방법에서 얻어지고, 산란율 계산에 이용된다. 정확한 임팩트이온화율 계산은 파동벡터와 주파수에 의존하는 유전함수를 필요로 한다. 포논 산란율은 상태밀도에 선형적으로 의존하기 때문에 포논산란율과 상태밀도의 비에 대한 선형함수 유도에 의해서 구해진다 임팩트이온화율 $P_{ii}$ 는 first principle's theory로부터 계산되어지고, 수정된 Keldysh 공식에 의해서 최적화되었다.