• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.3
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• pp.22-28
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• 2022

In the semiconductor and display component industries, the use of ceramic materials, which are high-strength materials, is increasing for ensuring durability and wear resistance. Among them, alumina materials are used increasingly. Alumina materials are extremely difficult to process because of their high strength; as such, research and development in the area of mineral material processing is being promoted actively to improve their processing. In this study, the processability of an electrodeposition tool is investigated using the electrodeposition method to smoothly process alumina materials. Furthermore, processing is conducted under various processing conditions, such as spindle speed, feed speed, and depth of cut. In addition, the processing characteristics of the workpiece are analyzed based on the tooling.

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.538-543
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• 2008

Recently a nano-scale diamond is possible to manufacture forms of powder(below 100 nm) by new processing of explosion or deposition method. Using a sintering of nano-scale diamond is possible to manufacture of grinding tools. We have need of a processing development of coated uniformly inorganic to prevent an abnormal grain growth of nano-crystal and bonding obstacle caused by sintering process. This paper, in order to improve the sintering property of nano-scale diamond, we coated ZnO thin films(thickness: $20{\sim}30\;nm$) in a vacuum by ALD(atomic layer deposition) Economically, in order to deposit ZnO all over the surface of nano-scale diamond powder, we used a new modified fluidized bed processing replaced mechanical vibration effect or fluidized bed reactor which utilized diamond floating owing to pressure of pulse(or purge) processing after inserted diamond powders in quartz tube(L: 20 mm) then closed quartz tube by porosity glass filter. We deposited ZnO thin films by ALD in closed both sides of quartz tube by porosity glass filter by ALD(precursor: DEZn($C_4H_{10}Zn$), reaction gas: $H_2O$) at $10^{\circ}C$(in canister). Processing procedure and injection time of reaction materials set up DEZn pulse-0.1 sec, DEZn purge-20 sec, $H_2O$ pulse-0.1 sec, $H_2O$ purge-40 sec and we put in operation repetitive 100 cycles(1 cycle is 4 steps) We confirmed microstructure of diamond powder and diamond powder doped ZnO thin film by TEM(transmission electron microscope) Through TEM analysis, we confirmed that diamond powder diameter was some $70{\sim}120\;nm$ and shape was tetragonal, hexagonal, etc before ALD. We confirmed that diameter of diamond powders doped ZnO thin film was some $70{\sim}120\;nm$ and uniform ZnO(thickness: $20{\sim}30\;nm$) thin film was successfully deposited on diamond powder surface according to brightness difference between diamond powder and ZnO.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• The Journal of Advanced Prosthodontics
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• v.11 no.2
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• pp.128-137
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• 2019

PURPOSE. The aim of this study was to compare the effect of different finishing and polishing techniques on water absorption, water solubility, and microhardness of ceramic or glass-polymer based computer-aided design and computer-aided manufacturing (CAD/CAM) materials following thermocycling. MATERIALS AND METHODS. 150 disc-shaped specimens were prepared from three different hybrid materials and divided into five subgroups according to the applied surface polishing techniques. All specimens were subjected up to #4000 grit SiC paper grinding. No additional polishing has been done to the control group (Group I). Other polishing procedures were as follows: Group II: two-stage diamond impregnated polishing discs; Group III: yellow colored rubber based silicone discs; Group IV: diamond polishing paste; and Group V: Aluminum oxide polishing discs. Subsequently, 5000-cycles of thermocycling were applied. The analyses were conducted after 24 hours, 7 days, and 30 days of water immersion. Water absorption and water solubility results were analyzed by two-way ANOVA and Tukey post-hoc tests. Besides, microhardness data were compared by Kruskal-Wallis and MannWhitney U tests (P<.05). RESULTS. Surface polishing procedures had significant effects on water absorption and solubility and surface microhardness of resin ceramics (P<.05). Group IV exhibited the lowest water absorption and the highest microhardness values (P<.05). Immersion periods had no effect on the microhardness of hybrid ceramic materials (P>.05). CONCLUSION. Surface finishing and polishing procedures might negatively affect physical properties of hybrid ceramic materials. Nevertheless, immersion periods do not affect the microhardness of the materials. Final polishing by using diamond polishing paste can be recommended for all CAD/CAM materials.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.3
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• pp.122-128
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• 2000

세라믹, 다이야몬드등과 같은 고경질재료에 대한 미소형상의 가공은 대단히 어렵고 일반적인 방법으로는 상당한 시간을 요구한다. 이러한 재료의 고능률 가공을 실현하기 위하여, 메탈본드 다이야몬드휠에 전해 인프로세스 드레싱(Electrolytic In-Process Dressing)을 적용한 연삭을 머시닝센타에서 시도하였다 본 연구에서, 메탈본드 다이야몬드휠은 전기방전에 의하여 고능률로 트루잉(truing)되었다. 알루미나 세라믹의 핀선단($\phi$50$\mu\textrm{m}$)과 로커웰 경도측정기의 다이야몬드 압입자(indenter)($\phi$40$\mu\textrm{m}$)를 ELID연삭에 의하여 창성하였다. 그 결과를 본 논문에서 보고한다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.213-216
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• 2001

A micro hole punching system was developed and micro holes of 100m in diameter were successfully made on brass sheets of loom in thickness. A micro punch made of tungsten carbide was designed to withstand the punch load, considering the buckling and the bending moment due to possible misalignment error. The punch was fabricated by the grinding process with diamond wheel. The die was designed considering the punch load and fabricated by micro electrodischarge machining process. In this system the stripper is designed to guide punch tip to minimize the possible misalignment. The punch was installed on a vertical stepper and the die was mounted on an X-Y translation unit. The precision motion controller controlled all motions of the micro hole punching system. In this study technical difficulties and solutions in the micro hole punching process were also discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• Journal of the Korean Society for Precision Engineering
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• v.9 no.3
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• pp.67-72
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• 1992

This paper presents the process of manufacturing technology of ceramics ferrule for opitcal fiber connector. Precision zirconia ceramic ferrules is widely for high performance and low cost single mode optical fiber connectors. To polish the hole of the zirconia ceramic ferrule, the wire lapping instrument is developed and the machining experiment is conducted. Through the centerless grinding using diamond wheel the surface roughness of zirconia ceramics ferrule is below the 1$\mu$m Rmax.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.923-928
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• 1997

An MCP (Microchannel Plate) is a secondary electron multiplier to detect and amplify electrons. An MCP has many rnicrochannels whose diameters range from 10 to 100pm and whose lengths range from 40 to 100times of the diameter. Each microchannel of the MCP amplifies electrons over IOOOtimes by the secondary electron emission. Even though MCPs have high performance for electron amplification, the application of MCPs is limited to high performance electronic equipments because of their high fabricating cost and the limit of increasing their size due to the conventional fabrication process. Therefore, in this work, microchannels of the MCP are manufactured by micro-drilling to reduce the cost of the MCP and to increase their size. Alumina green body with epoxy binder was machined for fabricating microchannels using a high speed air turbine spindle and micro-drills with diamond grinding abrasives. Then alumina MCP was fabricated through the sintering of the machined alumina green body.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.04a
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• pp.48-54
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• 1992

최근 미래지향적 고부가가치의 첨단 산업 전반에 걸친 세계 각국의 연구 개발 노력이 더 한층 가속되 어지면서 특히 항공, 우주, 신운송기기, 정보 통신기기, 메카높틱스, 전자산업, 메카트로닉스 등에 있어 보다 더 가혹한 조건과 분위기 하에서도 우수한 특성과 다양한 기능성 등을 유지할 수 있는 신소재로의 소재 대체화 요구가 높아지게 되어졌다. 국내 역시 최근 다양한 종류의 세라믹스를 생산 하고있긴 하나 이와 같은 기계적 특성치를 구하기 위한 시험편의가공 및 제작을 최적화 수행하지 못하는 관계로 인하여 동일한 소재를 갖고도 충분히 신뢰도있는 데이터들이나 높은 값의 데이터들을 제시하지 못하고 있는 실정이다. 따라서 본 연구에서는 굽힘 강도측정용 세라믹스 시험편을 최적 가공함으로써 기계적 특성치를 최대로발휘하 고자 한 바, 기 발표한 연삭 가공 조건 변화에 따른 최적화 가공 연구에 영향을 미칠 수 있는 것으로 보여지는 연삭 공구에 대한 "In-process dressign"을 최초로 도입하여 일반 연삭 가공을 실행해 봄으로써 그 효과를 명확히 규명하고자 하였으며, 이를 토대로 실제 부품화에 있어서나 Creep-feed grinding에 있어서도 적용할 수 있는 가에 대해서도 알아보고자 하였다.알아보고자 하였다.