Thermal Annealing Effect on the Machining Damage for the Single Crystalline Silicon |
정상훈
(연세대학교 세라믹공학과)
정성민 (연세대학교 세라믹공학과) 오한석 ((주)새빛 생산기술연구소) 이홍림 (연세대학교 세라믹공학과) |
1 |
The Surface of Machined Silicon Wafers : A Raman Spectroscopic Study
/
DOI ScienceOn |
2 |
Comprehensive Investigation of Polish-induced Surface Strain in <100> and <111> GaAs and InP
/
DOI |
3 |
Low Temperature Growth of Si on Si(111) by Gas-source MBE with Rapid Thermal Annealing : AFM Study on Surface Morphology
/
DOI ScienceOn |
4 |
Ductileregime Turning Mechanism of Single-crystal Silicon
/
|
5 |
Study of Scratch-induced Mechanical Damage on Silicon (111) Surfaces
/
DOI |
6 |
Fine Grinding of Silicon Wafers
/
DOI ScienceOn |
7 |
Raman Microspectroscopy Analysis of Pressure-induced Metallization in Scratching of Silicon
/
DOI ScienceOn |
8 |
Surface Damage in Nanomachined Silicon
/
DOI ScienceOn |
9 |
Crystal Orientation Dependence of Machining Damage-A Stress Model
/
DOI |
10 |
Crystal Orientation Dependence of Machining Demage-A Stress Model
/
DOI |