• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.25 no.4
• /
• pp.145-152
• /
• 2015

In this work, we were investigated the effect of the additive gases on the relationship between bonding structure and mechanical properties of the deposited films when the DLC films were deposited on Si-wafer by the rf-PECVD method with the addition of small amounts of carbon dioxide and nitrogen to the mixture gas of methane and hydrogen. The deposition rate of the films increased as the rf-power increased, while it decreased with increasing the amount of additive gases. Also, as the carbon dioxide gas increased, the hydrogen content in the films decreased but the $sp^3/sp^2$ ratio of the films increased. In case of nitrogen gas, the hydrogen content decreased, however the $sp^3/sp^2$ ratio and nitrogen gas flow rate did not show a specific tendency.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.43 no.5 s.347
• /
• pp.11-16
• /
• 2006

This paper reports the correlation between dielectric constant and degree of amorphism of the hybrid type SiOC thin films. SiOC thin films were deposited by high density plasma chemical vapor deposition using bistrimethyl- silylmethane(BTMSM,$H_{9}C_{3}-Si-CH_{2}-Si-C_{3}H_{9}$) and oxygen precursors with various flow rate ratio. As-deposited film and annealed films at $400^{\circ}C$ were analyzed by XRD. The SiOC thin films were amorphous from XRD patterns. For quantitative analysis, the diffraction pattern of the samples was transformed to radial distribution function by Fourier analysis, and then compared with each other. The degree of amorphism of annealed films was higher than that of as-deposited ones. The dielectric constant varied in accordance with flow rate ratio of precursors. The lowest dielectric constant was obtained from the as-deposited film which has the highest degree of amorphism after annealing.

• Korean Chemical Engineering Research
• /
• v.50 no.3
• /
• pp.574-581
• /
• 2012

The relatively short lifetime is a major obstruction for the commercial applications of OLED. One of the reason for the short lifetime is that the organic materials are interacted with water or oxygen in the atmosphere. Protection of water or oxygen from diffusing into the organic material layers are necessary to increase the lifetime of OLED. Although encapsulation of OLED with glass or metal cans has been established, passivation methods of OLED by organic/inorganic thin films are still being developed. In this paper we have developed in-situ passivation system and thin film passivation method using PECVD by which deposition can be performed at room temperature. We have analyzed the characteristics of the passivated OLED device also. The WVTR (Water Vapor Transmission Rate) for the inorganic thin film mono-layer can be reached down to $1{\times}10^{-2}g/m^2{\cdot}day$ and improved lifetime can be obtained. Thin film passivation methods are expected to be applied to flexible display.

• Journal of Ocean Engineering and Technology
• /
• v.18 no.6 s.61
• /
• pp.79-83
• /
• 2004

The curved blocks which compose the bow and stem of a ship contain many skewed joints that are inclined horizontally and vertically. Most of these joints have a large fitness error and are continuously changing their form and are not easily accessible. The welding position and parameter values should be appropriately set in correspondence to the shape and the inclination of the joints. The welding parameters such as current, voltage, travel speed, and melting rate, are related to each other and their values must be in a specific limited range for the sound welding. These correlations and the ranges are dependent up on the kind and size of wire, shielding gas, joint shape and fitness. To determine these relationships, extensive welding experiments were performed. The experimental data were processed using several information processing technologies. The regression method was used to determine the relationship between current voltage, and deposition rate. When a joint is inclined, the weld bead should be confined to a the limited size, inorder to avoid undercut as well as overlap due to flowing down of molten metal by gravity. The dependency of the limited weld size which is defined as the critical deposited area on various factors such as the horizontally and vertically inclined angle of the joint, skewed angle of the joint, up or down welding direction and weaving was investigated through a number of welding experiments. On the basis of this result, an ANN system was developed to estimate the critical deposited area. The ANN system consists of a 4 layer structure and uses an error back propagation learning algorithm. The estimated values of the ANN were validated using experimental values.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.158-161
• /
• 2004

We have studied a lifetime in organic light-emitting diodes depending on buffer layer. A transparent electrode of indium-tin-oxide(ITO) was used as an anode. And the cathode for electron injection was LiAl. Phthalocyanine Copper(CuPc), Poly(3,4-ethylenedioxythiophene):poly (PEDOT:PSS), or poly (9-vinylcarbazole)(PVK) material was used as a buffer layer. A thermal evaporation was performed to make a thickness of 40nm of TPD layer at a rate of $0.5{\sim}1\;{\AA}/s$ at a base pressure of $5{\times}10^{-6}\;torr$. A material of tris(8-hydroxyquinolinate) Aluminum($Alq_3$) was used as an electron transport and emissive layer. A thermal evaporation of $Alq_3$ was done at a deposition rate of $0.7{\sim}0.8[{\AA}/s]$ at a base pressure of $5{\times}10^{-6}\;torr$. By varying the buffer material, hole injection at the interface could be controlled because of the change in work function. Devices with CuPc and PEDOT:PSS buffer layer are superior to the other PVK buffer layer.

• Applied Science and Convergence Technology
• /
• v.26 no.4
• /
• pp.79-85
• /
• 2017

The crack-free AlGaN template has been successfully grown by using selective area growth with triangular GaN facet. The triangular GaN stripe structure was obtained by vertical growth rate enhanced mode with low growth temperature of $950^{\circ}C$ and high growth pressure of 500 torr. The lateral growth rate enhanced mode of AlGaN for crack-free and flat surface was also investigated. Low pressure of 30 torr and high V/III ratio of 4400 were favorable for lateral growth of AlGaN. It was confirmed that the $4{\mu}m$ -thick $Al_{0.2}Ga_{0.8}N$ was crack-free over entire 2-inch wafer. The dislocation density of $Al_{0.2}Ga_{0.8}N$ was as low as ${\sim}7.6{\times}10^8/cm^2$ measured by cathodoluminescence. Based on the high quality AlGaN with low dislocation density, the ultraviolet laser diode epitaxy with cladding, waveguide and GaN/AlGaN multiple quantum well (MQW) was grown by metalorganic chemical vapor deposition. The stimulated emission at 349 nm with full width at half maximum of 1.8 nm from the MQW was observed through optical pumping experiment with 193 nm KrF laser. We also have fabricated the deep ridge type ultraviolet laser diode (UV-LD) with $5{\mu}m-wide$ and $700{\mu}m-long$ cavity for electrical properties. The turn on voltage was below 5 V and the resistance was ${\sim}55{\Omega}$ at applied voltage of 10 V. The amplified spontaneous emission spectrum of UV-LD was also observed from pulsed current injection.

• Korean Journal of Metals and Materials
• /
• v.48 no.12
• /
• pp.1097-1102
• /
• 2010

Silver coated copper powders were prepared by a chemical reduction method with controlling the deposition process variables such as the feeding rate of the silver ionic solution and concentration of the reductants at room temperature. The characteristics of the products were evaluated by scanning electron microscope (SEM), X-ray diffractometer (XRD), atomic absorption spectrophotometer (AA) and a 4 probe resistivity measurement system. The optimum condition of the preparation of Ag coated Cu powders was at 0.05 M of potassium sodium tartrate and 2 ml/min of the feeding rate of the silver ionic solution. Our method successfully produced dense, uniform, and well-dispersed Ag coated Cu powder of $2{\sim}2.5{\mu}m$ witha silver layer of 100~200 nm. Additionally, we found that thespecific resistivity of the 30 wt.% Ag coated Cu powder was similar to that of pure silver, so that the composite powder could be used as an alternative electromagnetic shielding material for silver.

• Korean Journal of Metals and Materials
• /
• v.48 no.11
• /
• pp.1041-1046
• /
• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Journal of The Geomorphological Association of Korea
• /
• v.23 no.3
• /
• pp.41-55
• /
• 2016

The granulometric characteristics and chemical composition of the samples from the Bukpyeong myeon, Hainam gun, Jeollanam do were analyzed in this study. The samples were collected from the outcrop of coastal area where the height is about 30m. The burial age of the sediments also estimated by OSL(Optically Stimulated Luminescence) method. The origin and forming processes of the samples are not clear in this stage as limited number of evidences can be found. However it is suggested that the samples are not aeolian deposits originated from chinese loess by the chemical analysis. The mean diameter of samples were $5{\sim}6{\varphi}(silt)$ and are increased slightly downwards. The samples also well sorted. The samples have been heavily weathered by the chemical alteration index. The value of CIA increase downward rapidly at the upper part of outcrop, then stabilized afterwards. The vertical concentration changes ratio of cations varies; Si increases downwards while Fe, Ti, K and Mg decrease. There are fluctuation in concentration ratio of Na and Ca with increasing depth. The burial age of sample from upper part are estimated as $104.52{\pm}4.45ka\;BP$, while that of lower part are $136.10{\pm}6.52ka\;BP$, and they fall in to last part of MS6. The deposition rate for this site is found about 0.017mm/year. The uplift rate of the site is supposed to be 0.24~0.26m/ka with assumption of palaeo-sea level of +6m. However the origin of the sediment deposits should be explored and cleared.

• Analytical Science and Technology
• /
• v.34 no.2
• /
• pp.87-98
• /
• 2021

In this study, we developed the nanoparticle multi-generator by 3D printer fusion deposition modeling (FDM) method that can reliably generate and deliver nanoparticles at a constant concentration for inhalation risk assessment. A white ABS filament was used as the test material, and SMPS was used for concentration analysis such as particle size and particle distribution. In the case of particle size, the particle size was divided by 100 nm or less and 100 to 1,000 nm, and the number of particles concentration, mass concentration, median diameter of particles, geometric average particle diameter, etc were measured. The occurrence conditions were the extruder temperature, the extruding speed of the nozzle, and the air flow rate, and experiments were conducted according to the change of conditions including the manufacturer's standard conditions. In addition, the utility of inhalation risk assessment was reviewed through a stability maintenance experiment for 6 h. As a result of the experiment, the size of the nanoparticles increased as the discharger temperature increased, as the discharge speed of the nozzle increased, and as the air flow rate decreased. Also, a constant pattern was shown according to the conditions. Even when particles were generated for a long time (6 h), the concentration was kept constant without significant deviation. The distribution of the particles was approximately 80 % for particles of 60 nm to 260 nm, 1.7 % for 1 ㎛ or larger, 0.908 mg/㎥ for the mass concentration, 111 nm for MMAD and 2.10 for GSD. Most of the ABS particles were circular with a size of less than 10 nm, and these circular particles were aggregated to form a cluster of grape with a size of several tens to several hundred nm.