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http://dx.doi.org/10.6111/JKCGCT.2015.25.4.145

Effect of the additive gas on the bonding structure and mechanical properties of the DLC films deposited by RF-PECVD  

Choi, Bong-Geun (Division of Materials Science and Engineering, Hanyang University)
Abstract
In this work, we were investigated the effect of the additive gases on the relationship between bonding structure and mechanical properties of the deposited films when the DLC films were deposited on Si-wafer by the rf-PECVD method with the addition of small amounts of carbon dioxide and nitrogen to the mixture gas of methane and hydrogen. The deposition rate of the films increased as the rf-power increased, while it decreased with increasing the amount of additive gases. Also, as the carbon dioxide gas increased, the hydrogen content in the films decreased but the $sp^3/sp^2$ ratio of the films increased. In case of nitrogen gas, the hydrogen content decreased, however the $sp^3/sp^2$ ratio and nitrogen gas flow rate did not show a specific tendency.
Keywords
Diamond-like carbon; PE-CVD; Bonding structure; Mechanical property;
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