• 제목/요약/키워드: deposition density

검색결과 1,250건 처리시간 0.03초

Substrate Temperature Dependence of Microcrystalline Silicon Thin Films by Combinatorial CVD Deposition

  • Kim, Yeonwon
    • 한국표면공학회지
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    • 제48권3호
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    • pp.126-130
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    • 2015
  • A high-pressure depletion method using plasma chemical vapor deposition (CVD) is often used to deposit hydrogenated microcrystalline silicon (${\mu}c-Si:H$) films of a low defect density at a high deposition rate. To understand proper deposition conditions of ${\mu}c-Si:H$ films for a high-pressure depletion method, Si films were deposited in a combinatorial way using a multi-hollow discharge plasma CVD method. In this paper the substrate temperature dependence of ${\mu}c-Si:H$ film properties are demonstrated. The higher substrate temperature brings about the higher deposition rate, and the process window of device quality ${\mu}c-Si:H$ films becomes wider until $200^{\circ}C$. This is attributed to competitive reactions between Si etching by H atoms and Si deposition.

The geometry change of carbon nanofilaments by SF6 incorporation in a thermal chemical vapor deposition system

  • Kim, Sung-Hoon
    • 한국결정성장학회지
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    • 제21권3호
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    • pp.119-123
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    • 2011
  • Carbon nanotilaments (CNFs) could be synthesized on nickel catalyst layer-deposited silicon oxide substrate using $C_2H_2$ and$H_2$ as source gases under thermal chemical vapor deposition system. By the incorporation of $SF_6$ as a cyclic modulation manner, the geometries of carbon coils-related materials, such as nano-sized coil and wave-like nano-sized coil could be observed on the substrate. The characteristics (formation density and morphology) of as-grown CNFs with or without $SF_6$ incorporation were investigated. Diameter size reduction for the individual CNFs-related shape and the enhancement of the formation density of CNFs-related material could be achieved by the incorporation of $SF_6$ as a cyclic modulation manner. The cause for these results was discussed in association with the slightly increased etching ability by $SF_6$ addition and the sulfur role in SF 6 for the geometry change.

펄스 레이저 증착법에 의한 DLC 박막 제작 연구 (Study on the fabrication of DLC thin films by pulsed laser deposition)

  • 정영식;은동석;이상렬;정해석;박형호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1997년도 추계학술대회 논문집 학회본부
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    • pp.285-287
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    • 1997
  • We have deposited hydrogen-free diamond-like carbon (DLC) films by pulsed laser deposition of graphite. Pulsed laser deposition (PLD) can be utilized to generate films with desired properties quite different from those of the starting material. Since DLC films grown by PLD using turbo pump are perpared without hydrogen, they have a higher density and a higher index of refraction than the hydrogenated DLC films. In this study, effects of the substrate temperature and laser energy density on the properties of DLC films were systematically investigated. The structure and properties of the films have been studied by scanning electron microscopy (SEM), Fourier Transform Infrared (FT-IR), X-ray diffraction (XRD), and Raman spectroscopy.

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레이저 증착변수에 의한 다이아몬드상 카본 박막 특성변화 (The Variation of the Characteristics of DLC Thin films by Pulsed Laser Deposition)

  • 심경석;이상렬
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권5호
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    • pp.344-348
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    • 1999
  • Diamond like carbon(DLC) thin films possesed not only marvelous material characteristics such as large thermal conductivity, high hardness and being chemically inert, but also possesed negative electron affinity (NEA) properties. The NEA is an extremely desirable property of the material used in microelestronics and vacuum microelestronics device. DLC films were fabricated by pulsed laser deposition(PLD). Theeffect of the laser energy density and the substrate temperature on the properies of DLC films was investigated. The experiment was accomplished at temperatures in the range of room temperature to $600^{\circ}C$. The laser energy density was in the range of 6 $J/cm^2$ to 16 $J/cm^2$.

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열처리 방법에 따른 세라믹 박막의 AFM 및 C-F 특성 (AFM and C-F Properties of Ceramic Thin Film with Annealing Method)

  • 최운식
    • 한국전기전자재료학회논문지
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    • 제28권9호
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    • pp.598-601
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    • 2015
  • The $Sr_{0.7}Bi_{2.3}Nb_2O_9(SBN)$ thin films are deposited on Pt electrode($Pt/Ti/SiO_2/Si$) using RF sputtering method at various deposition temperature. The deposition temperature of optimum was $300^{\circ}C$. SBN thin films were annealed at $500{\sim}700^{\circ}C$ using furnace and RTA, respectively. The surface roughness showed about 2.42 nm in annealing temperature($600^{\circ}C$) of furnace. The capacitance density of SBN thin films were increased with the increase of annealing temperature. The maximum capacitance density of $0.7{\mu}F/cm^2$ was obtained by annealing temperature($700^{\circ}C$). The frequency dependence of dielectric loss showed about 0.03 in frequency ranges of 1~1,000 kHz.

Room Temperature Preparation of Poly-Si Thin Films by IBE with Substrate Bias Method

  • Cho, Byung-Yoon;Yang, Sung- Chae;Han, Byoung-Sung;Lee, Jung-Hui;Yatsui Kiyoshi
    • Transactions on Electrical and Electronic Materials
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    • 제6권2호
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    • pp.57-62
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    • 2005
  • Using intense pulsed ion beam evaporation technique, we have succeeded in the preparation of poly crystalline silicon thin films without impurities on silicon substrate. Good crystallinity and high deposition rate have been achieved without heating the substrate by using lEE. The crystallinity of poly-Si film has been improved with the high density of the ablation plasma. The intense diffraction peaks of poly-Si thin films could be obtained by using the substrate bias system. The crystallinity and the deposition rate of poly-Si thin films were increased by applying (-) bias voltage for the substrate.

SILICON DIOXIDE FILMS FOR INTERMETAL DIELECTRIC APPLICATIONS DEPOSITED BY AN ECR HIGH DENSITY PLASMA SYSTEM

  • Denison, D.R.;Harshbarger, W.R.
    • 한국진공학회지
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    • 제4권S1호
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    • pp.130-137
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    • 1995
  • Deopsition of thermal quality SiO2 using a high density plasma ECR CVD process has been demonstrated to give void and seam free gap fill of high aspect ratio metallization structures with a simple oxygen-silane chemistry. This is achieved by continuous sputter etching of the film during the deposition process. A two-step process is utilized to deposit a composite layer for higher manufacturing efficiency. The first step, which has a deposition rate of approximately 0.5 $\mu$m/min., is used to provide complete gap fill between the metal lines. The second step, which has a deposition rate of up to 1.5 $\mu$m/min., is used to deposit a total thickness of 2.0$\mu$m for the intermetal dielectric film. The topography of this composite film is very compatible with subsequent chemicl mechanical polishing(CMP) planarization processing.

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2G HTS wire with enhanced engineering current density attained through the deposition of HTS layer with increased thickness

  • Markelov, A.;Valikov, A.;Chepikov, V.;Petrzhik, A.;Massalimov, B.;Degtyarenko, P.;Uzkih, R.;Soldatenko, A.;Molodyk, A.;Sim, Kideok;Hwang, Soon
    • 한국초전도ㆍ저온공학회논문지
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    • 제21권4호
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    • pp.29-33
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    • 2019
  • 2G HTS wire with high engineering current density is desired for applications where compact, high power density superconducting equipment is important. We have succeeded in enhancing engineering current density of commercial SuperOx 2G HTS wire based on GdBCO by increasing the HTS layer thickness without fast degradation of the HTS film microstructure. This was possible after improving the temperature uniformity along the HTS film deposition zone. In particular, the wire engineering current density was increased from 700-770 A/㎟ (for a 65 ㎛-thick wire without stabilisation) or 430-480 A/㎟ (for a 105 ㎛-thick stabilised wire) at the beginning of this study to almost 1200 A/㎟ (for a 67 ㎛-thick wire without stabilisation) or 770 A/㎟ (for a 107 ㎛-thick stabilised wire) at completion of this study.

Gas phase diagnostics of high-density $SiH_4/H_2$ microwave plasma

  • Toyoda, Hirotaka;Kuroda, Toshiyuki;Ikeda, Masahira;Sakai, Junji;Ito, Yuki;Ishijima, Tatsuo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.94-94
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    • 2010
  • As a new plasma source for the plasma enhanced chemical vapor deposition (PCVD) of ${\mu}c$-Si deposition, we have demonstrated a microwave-excited plasma source, which can produce high density (${\sim}10^{12}\;cm^{-3}$) plasma with low electron temperature (~1 eV) and low plasma potential (~10 V). In this plasma source, microwave power radiated from slot antenna is distributed along the plasma-dielectric interface in large area and this enables us to produce uniform high-density plasma in large area. To optimize deposition conditions, deep understanding of gas phase chemistry is indispensable. In this presentation, we will discuss on the gas phase diagnostics of microwave $SiH_4/H_2$ plasma such as $SiH_4$ dissociation or $SiH_3$ radical profile as well as deposited film properties.

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Large Area Diamond Nucleation and Si (001) Using Magnetoactive Microwave Plasma Chemical Vapor Deposition

  • Hyeongmin Jeon;Akimitsu Hatta;Hidetoshi Suzuki;Nam Jiang;Jaihyung Won;Toshimichi Ito;Takatomo Sasaki;Chongmu Lee;Akio Hiraki
    • The Korean Journal of Ceramics
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    • 제3권3호
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    • pp.159-162
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    • 1997
  • Diamond was uniformly nucleated on large area Si(001) substrate (3cm$\times$4cm) using the low pressure magnetoactive microwave plasma chemical vapor deposition. $CH_4/He$ gas mixture was used as source gas in order to obtain high radical density in the nucleation enhancement step. $CH_3$radical density was measured by means of infrared laser absorption spectroscopy. The effect of substrate bias voltage on diamond nucleation was examined. The results showed that a suitable positive bias voltage appled to the substrate with respect to the chamber could enhance diamond nucleation while a negative bias voltages leaded to deposition of only non-diamond phase carbon.

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