• Economic and Environmental Geology
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• v.33 no.2
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• pp.91-100
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• 2000

It has been more than ten years since Dukun mine was abandoned. Tailings of waste deposits and slime dumps in the abandoned Dukum mine have been left to be deserted for fifty years. The results of fifty years of neglecting are nothing short of major environmental problems. Slime dumps have been exposed to air and water in the mine over ten years and then soil profile has been formed well. Soil in the upper layer (A horizon) is the light gray color due to the leaching of cations. Soil in the lower layer (A2 horizon, 0.2∼0.3m)is tinted with reddish brown and yellowish brown color due to the development of iron oxides and iron hydroxides. Soil in the lower part of B horizon of (1.0∼3.0m) with the growth of copper and zinc oxides exposes to the bluish green, light blue, and dark gray. Ranging from 3m to 8m in depth, 85 samples were taken from 22 sampling sites with 50m intervals located on the slime dump area with hand auger and trench (open cut). As tailings was distributed, heavy metal elements extracted by the process of surface water and ground water move and disperse in to the hydrosphere. Waste dumps were distributed in and around the mine and water draining from those dumps be a potential source of contamination. Soils, thus, can be dispersed into downslope and downstream through wind and water by clastic movement. These materials may be deposited in another horizon if the water is withdrawn, or if the materials are precipitated as a result of differences in pH, or other conditions in deeper horizons. These were primarily associated with acid mine drainage. The characteristics and rate of release of acid mine drainage are influenced by various chemical and biological reactions at the source of acid generations. Prolonged extration of heavy metal elements has a detrimental effect on the agricultural land and residental area. Twenty soil samples were collected from the agricultural land in the area (0∼30 cm). Seventeen samples were also taken from the sediment in the stream running alongside the dumps. The dispersion patterns of heavy metal elements are as follows: The content of As ranged 2∼6 ppm in a horizon, 20∼125 ppm in B horizon with large amount of clay mineral is concentrated and the content of Cd ranged 1∼2 ppm in A horizon, 4∼22 ppm in B horizon. Like Cd, the content of As, Cu, Zn, Pb in B horizon is higher than that in A horizon (approximately 5∼100 times). When soil formation proceeds in stages, it is necessary to investicate the B horizon with the concentration of heavy metal and preventive measures will have to established.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.8
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• pp.14-18
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• 2018

Generally. the Ohmic's law is an important factor to increase the conductivity in a micro device. So it is also known that the Ohmic contact in a semiconductor device is import. The PN junction as a structure of semiconductor involves the depletion layer, and this depletion layer induces the non linear electrical properties and also makes the Schottky contact as an intrinsic characteristics of semiconductor. To research the conduction effect of insulators in the semiconductor device, $SiO_2$ thin film and $V_2O_5/SiO_2$ thin film were researched by using the current-voltage system. In the nano electro-magnetic system, the $SiO_2$ thin film as a insulator had the non linear Schottky contact, and the as deposited $V_2O_5$ thin film had the linear Ohmic contact owing to the $SiO_2$ thin film with superior insulator's properties, which decreases the leakage current. In the positive voltage, the capacitance of $SiO_2$ thin film was very low, but that of $V_2O_5$ thin film increased with increasing the voltage. In the normal electric field system, it was confirmed that the conductivity of $V_2O_5$ thin film was increased by the effect of $SiO_2$ thin film. It was confirmed that the Schottky contact of semiconductors enhanced the performance of electrical properties to increased the conductivity.

• Journal of Powder Materials
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• v.22 no.5
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• pp.321-325
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• 2015

The triboelectric property of a material is important to improve an efficiency of triboelectric generator (TEG) in energy harvesting from an ambient energy. In this study, we have studied the TEG property of a semiconducting $SnO_2$ which has yet to be explored so far. As a counter triboelectric material, PET and glass are used. Vertical contact mode is utilized to evaluate the TEG efficiency. $SnO_2$ thin film is deposited by atomic layer deposition on bare Si wafer for various thicknesses from 5.2 nm to 34.6 nm, where the TEG output is increased from 13.9V to 73.5V. Triboelectric series are determined by comparing the polarity of output voltage of 2 samples among $SnO_2$, PET, and glass. In conclusion, $SnO_2$, as an intrinsic n-type material, has the most strong tendency to be positive side to lose the electron and PET has the most strong tendency to be negative side to get the electron, and glass to be between them. Therefore, the $SnO_2$-PET combination shows the highest TEG efficiency.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.8
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• pp.248-255
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• 2020

The effects of the coating thickness on the thermal durability and thermal stability of thermal barrier coatings (TBCs) with a gradient coating thickness were investigated using a flame thermal fatigue (FTF) test and thermal shock (TS) test. The bond and topcoats were deposited on the Ni-based super-alloy (GTD-111) using an air plasma spray (APS) method with Ni-Cr based MCrAlY feedstock powder and yttria-stabilized zirconia (YSZ), respectively. After the FTF test at 1100 ℃ for 1429 cycles, the bond coat was oxidized partially and the thermally grown oxide (TGO) layer was observed at the interface between the topcoat and bond coat. On the other hand, the interface microstructure of each part in the TBC specimen showed a good condition without cracking or delamination. As a result of the TS test at 1100 ℃, the TBC with gradient coating thickness was initially delaminated at a thin part of the coating layer after 37 cycles, and the TBC was delaminated by more than 50% after 98 cycles. The TBCs of the thin part showed more oxidation of the bond coat with the delamination of topcoat than the thick part. The thick part of the TBC thickness showed good thermal stability and oxidation resistance of the bond coat due to the increased thermal barrier effect.

• Journal of Korea Water Resources Association
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• v.43 no.10
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• pp.883-891
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• 2010

More recently, there have been significant changes in the forms of channels due to runoff characteristics driven by climate changes and other alterations in basin/channel environments. Particularly, increasing local deposition in major channels is being observed nationwide. Of such phenomena, it is noteworthy that flood-plains show unidirectional growth and lowering of channels within compound channels in the form of a high-flow plain. These changes are supposed to affect management of the river ecology as well as flood control. In this study, the research on channels in Korea confirmed that the phenomenon of local deposition in those channels is actually taking place, rendering a problem to be urgently addressed. Previous studies on bed changes have been focused on low channels based on bed materials distributed over the channels. However, this research has proved that surface-layer deposition of a high-flow plain is closely related with changes in the conditions of ground surfaces and, ultimately, affects the bed of the entire channel as well. According to the intensive research on the condition of the high-flow plain of the mouth of the Han River, the silt deposited in the high-flow plain was the main cause of settlement/growth of vegetation. And this leads to landforming along with woods-forming, disturbing flood control as well as the normal river ecology.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.2
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• pp.1-6
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• 2007

This study investigated the magnetic properties of $Ni_{80}Fe_{20}/SiO_2$ laminates with shape-induced magnetic anisotropy. The multilayer films were deposited on Si or upilex substrates, from separate $Ni_{80}Fe_{20}$ and $SiO_2$ (at %) alloy targets using a rf diode sputtering system. $Ni_{80}Fe_{20}/SiO_2$ laminates with a various number of bilayers (N) were prepared. The laminates with ellipse array patterns were prepared using photolithographic technique. The magnetic properties were measured at room temperature using a B-H hysteresisgraph and a high frequency permeameter. The several steps during domain wall reversal were observed in multilayer films, attributing to inter-magnetic layer coupling. Intrinsic uniaxial anisotropy field increases with N. The experimental values of the total anisotropy field are found to be in good agreement with the calculated values. This study utilized the shape anisotropy of the laminated film objects with small ellipse array patterns to induce a larger uniaxial anisotropy so as to maximize their operating frequency.

• Proceedings of the Korean Magnestics Society Conference
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• 2010.06a
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• pp.79-79
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• 2010

Semimetallic bismuth (Bi) has been extensively investigated over the last decade since it exhibits very intriguing transport properties due to their highly anisotropic Fermi surface, low carrier concentration, long carrier mean free path l, and small effective carrier mass $m^*$. In particular, the great interest in Bi nanowires lies in the development of nanowire fabrication methods and the opportunity for exploring novel low-dimensional phenomena as well as practical application such as thermoelectricity[1]. In this work, we introduce a self-assembled interconnection of nanostructures produced by an on-film formation of nanowires (OFF-ON) method in order to form a highly ohmic Bi nanobridge. A Bi thin film was first deposited on a thermally oxidized Si (100) substrate at a rate of $40\;{\AA}/s$ by radio frequency (RF) sputtering at 300 K. The sputter system was kept in an ultra high vacuum (UHV) of $10^{-6}$ Torr before deposition, and sputtering was performed under an Ar gas pressure of 2m Torr for 180s. For the lateral growth of Bi nanowires, we sputtered a thin Cr (or $SiO_2$) layer on top of the Bi film. The Bi thin films were subsequently put into a custom-made vacuum furnace for thermal annealing to grow Bi nanowires by the OFF-ON method. After thermal annealing, the Bi nanowires cannot be pushed out from the topside of the Bi films due to the Cr (or $SiO_2$) layer. Instead, Bi nanowires grow laterally as a mean s of releasing the compressive stress. We fabricated a self-assembled Bi nanobridge (d=192 nm) device in-situ using OFF-ON through annealing at $250^{\circ}C$ for 10hours. From I-V measurements taken on the Bi nanobridge device, contacts to the nanobridge were found highly ohmic. The quality of the Bi nanobridge was also proved by the high MR of 123% obtained from transverse MR measurements. These results manifest the possibility of self-assembled nanowire interconnection between various nanostructures for a variety of applications and provide a simple device fabrication method to investigate transport properties on nanowires without complex patterning and etching processes.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.51-51
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• 2010

Recently just as in the automobile industry, shipbuilders also try to reduce material consumption and weight in order to keep operating costs as low as possible and improve the speed of production. Naturally industry is ever searching for welding techniques offering higher power, higher productivity and a better quality. Therefore it is important to have a details research based on the various welding process applied to steel and other materials, and to have the ability both to counsel interested companies and to evaluate the feasibility of implementation of this process. Submerged-arc welding (SAW) process is usually used about 20% of shipbuilding. Similar to gas metal arc welding(GMAW), SAW involves formation of an arc between a continuously-fed bare wire electrode and the work-piece. The process uses a flux to generate protective gases and slag, and to add alloying elements to the weld pool and a shielding gas is not required. Prior to welding, a thin layer of flux powder is placed on the work-piece surface. The arc moves along the joint line and as it does so, excess flux is recycled via a hopper. Remaining fused slag layers can be easily removed after welding. As the arc is completely covered by the flux layer, heat loss is extremely low. This produces a thermal efficiency as high as 60% (compared with 25% for manual metal arc). SAW process offers many advantages compared to conventional CO2 welding process. The main advantages of SAW are higher welding speed, facility of workers, less deformation and better than bead shape & strength of welded joint because there is no visible arc light, welding is spatter-free, fully-mechanized or automatic process, high travel speed, and depth of penetration and chemical composition of the deposited weld metal. However it is difficult to application of thin plate according to high heat input. So this paper has been focused on application of the field according to SAW process for thin plate in ship-structures. For this purpose, It has been decided to optimized welding condition by experiments, relationship between welding parameters and bead shapes, mechanical test such as tensile and bending. Also finite element(FE) based numerical comparison of thermal history and welding residual stress in A-grade 3.2 thickness steel of SAW been made in this study. From the result of this study, It makes substantial saving of time and manufacturing cost and raises the quality of product.