• Journal of the Korean Applied Science and Technology
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• v.26 no.4
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• pp.379-384
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• 2009

Epoxy resin based encapsulants are widely used in semiconductor packaging applications. Epoxy resin based encapsulants are often subject to crack or delamination during the reliability test due to the thermal stress caused by high modulus nature of epoxy resins. Epoxy functional siloxanes are often added into epoxy resin to reduce the modulus so that the thermal stress can be reduced. Epoxy functional siloxanes, additives for reduced modulus, were synthesized and added into the curable epoxy resins. The modulus and the coefficient of thermal expansion (CTE) were also measured to investigate the thermal stress and to see whether the epoxy functional siloxane adversely affects the CTE or not. As a result, around 26% to 72% of thermal stress reduction was observed with no adverse effect on CTE.

• Journal of Applied Reliability
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• v.12 no.2
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• pp.91-103
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• 2012

Tubular markers for road safety facilities are used to lead the driver's sight line and separate the lanes on the road. Such tubular markers are usually installed on the road and frequently hit by vehicles, they are accordingly requested to assure the product durability. The traditional evaluation method of tubular markers include only quality tests of the material properties. However, most of consuming agencies in charge of road management at fields have proposed problems on long-term performance of the products hit by vehicles under various weather conditions. Therefore, the objectives of this study are to develop the reliability test methods and equipments to simulate the product failures of tubular markers due to vehicle collision and wheel compression and the delamination and discoloration of reflection sheets attached on the surface of the products under high and low temperatures.

• Structural Engineering and Mechanics
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• v.6 no.5
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• pp.485-496
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• 1998

Standard finite element wave propagation codes are useful for determining stresses caused by the impact of one body with another; however, their applicability to a laminated system such as architectural laminated glass is limited because the important interlayer delamination process caused by impact loading is difficult to model. This paper presents a method that allows traditional wave propagation codes to model the interlayer debonding of laminated architectural glass subject to low velocity, small missile impact such as that which occurs in severe windstorms. The method can be extended to any multilayered medium with adhesive bonding between the layers. Computational results of concern to architectural glazing designers are presented.

• Steel and Composite Structures
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• v.28 no.4
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• pp.415-426
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• 2018

This paper presents a multi-layer finite element for buckling and free vibration analyses of laminated beams based on a higher-order layer-wise theory. An N-layer beam element with (9N + 7) degrees-of-freedom is proposed for analyses. Delamination and slip between the layers are not allowed. Element matrices for the single- and multi-layer beam elements are derived by Lagrange's equations. Buckling loads and natural frequencies are calculated for different end conditions and lamina stacking. Comparisons are made to show the accuracy of proposed element.

• Korean Journal of Materials Research
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• v.26 no.9
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• pp.455-459
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• 2016

The deposition process for the gap-filling of sub-micrometer trenches using DMDMOS, $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by flowable chemical vapor deposition (F-CVD) is presented. We obtained low-k films that possess superior gap-filling properties on trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on IMD and STI for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universal in other chemical vapor deposition systems.

• The korean journal of orthodontics
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• v.21 no.1 s.33
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• pp.7-16
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• 1991

To estimate the possibility of the application of TiN ion-plating to the orthodontic appliance, colorimetric properties, and characteristics of ion-plated film as well as adhesive strength of TiN film to the substrate and mechanical properties of ion-plated orthodontic appliance were investigated. The obtained results were as follows: 1) TiN ion-plated film had the colorimetric properties which were the hue of about 2.5 Y, the brightness of about 6, and the chroma of about 4 by the standard color chip of JIS. 2) TiN ion-plated film was $2{\mu}m$ in thickness and its deposition pattern was rather irregular. 3) TiN phase was confirmed on the X-ray diffraction pattern. 4) Critical load for delamination of ion-plated film from stainless steel band was 10N. 5) Tensile and yield strength of ion-plated specimen was increased about 10Kg $f/mm^2$, while elongation was decreased $1\%$ compairing to the values of the non ion-plated specimen.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.347-355
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• 2016

Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.33-39
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• 2014

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

• Corrosion Science and Technology
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• v.14 no.4
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• pp.161-165
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• 2015

This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.815-818
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• 2001

The buckling of an orthotropic layer bonded to an isotropic half-space with an interface crack subjected to compressive load under plane strain is considered. Basic stability equations derived from the mathematical theory of elasticity are applied to describe the buckling behavior. A system of homogeneous Cauchy-type singular integral equations of the second kind is solved numerically by utilizing Gauss-Chebyshev integral formulae. Numerical results for the buckling load are presented for various delamination geometries and material properties of both the layer and half-space.