• Title/Summary/Keyword: delamination resistance

검색결과 114건 처리시간 0.029초

유/무기 하이브리드 코팅액에 의한 냉간압연강판의 열처리 온도에 따른 내식특성 (Corrosion Resistance of Cold Rolled Steel coated Organic/inorganic Hybrid Coating Solution According to Heat Treatment Temperature)

  • 남기우;김정량;최창민
    • 한국해양공학회지
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    • 제25권6호
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    • pp.56-59
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    • 2011
  • The demand for cold rolled steel (CR) for structural members is gradually increasing. If no surface treatment (coating for corrosion resistance) for CR is conducted, its use is very limited because CR is vulnerable to corrosion. Therefore, we need to develop a coating solution to provide high corrosion resistance for CR. In this study, an organic/inorganic coating solution with Si and Ti (Si polysilicate 7 wt.% + Urethane 13 wt.% + Ti amorphous 0.5 wt.%; LR-0727(1)) was used to evaluate the corrosion resistance of CR under a salt spray test. The specimens with the LR-0727(1) coating were heat treated in a drying oven at $120{\sim}210^{\circ}C$for 5 min. The corrosion resistance was investigated using a salt spray test of 7 h. In addition, an adhesive test was conducted. Rust showed under a heat treatment of $150^{\circ}C$, but no vestiges were found over $160^{\circ}C$. The specimens with heat treatment at $160^{\circ}C$ or more did not experience delamination. From these results, it is considered that the temperature limit for optimum heat treatment is $160^{\circ}C$ considering energy efficiency.

라디에타소나무 단판적층재의 밀도·접착·강도성능 및 내부후성 (Density, Bonding Strength, Bending strength and Decay Resistance of Radiata Pine Laminated Veneer Lumber)

  • 서진석;이동흡;황원중;오형민;박영란;강승모
    • Journal of the Korean Wood Science and Technology
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    • 제39권4호
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    • pp.344-350
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    • 2011
  • 라디에타소나무 단판적층재(LVL)를 제조함에 있어서, CuAz 및 ACQ 방부처리와 비처리, 수성비닐우레탄 접착제와 페놀변성 리조시놀수지 접착제의 상온경화형 접착제를 적용함에 따른 밀도경사, 접착 강도성능 및 내부후성(방부효력)을 살펴보았다. 결과, LVL의 밀도경사에서 접착층 주변이 원추형으로 밀도가 커지는 경사패턴을 보였다. 접착성은 수성비닐우레탄 접착의 경우, 자비반복시험 후 전층이 박리되거나, 일부 층이 박리하고 할렬 틈새 현상이 일어났다. 페놀변성 리조시놀수지 접착제 접착의 경우, 자비반복시험 후 접착층의 응력이 큰데 연유한 굽음과 상하 접착층 사이의 단판의 수직할렬 현상이 있었으나, 접착층의 박리나 할렬이 거의 발견되지 않아 침지박리접착력은 높은 것으로 판단되었다. 한편, 방부효력시험에 있어서, 수성비닐우레탄 접착제로 적층한 LVL의 경우 갈색부후균에 의한 부후도가 백색부후균보다 크게 나타났다. 페놀변성 리조시놀수지 접착제로 LVL을 제조한 경우에는 갈색부후균에 의한 질량감소가 적었고, 약제를 처리하지 않더라도 그 피해가 낮았으며, 약제처리한 것은 질량감소율 0 수준을 보일 정도로 방부효력이 큰 것을 알 수 있었다.

목재(木材)파티클과 철강결체(鐵鋼結締)가 보오드의 물리적(物理的) 성질(性質)에 미치는 영향(影響) (Effect of Combining Wood Particles and Wire Net on the Physical Properties of Board)

  • 이필우
    • Journal of the Korean Wood Science and Technology
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    • 제13권3호
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    • pp.3-26
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    • 1985
  • The object of this study was to investigate the effects on physical and mechanical properties of wood particle and sawdust board combined with wire net. Conventional forming, press-lam, and veneer comply boards combining one to four wire net sheets were made from wood particle and sawdust with different spacings (8, 10, 12, and 18 Mok) and different wire diameters (0.35, 0.50, and 0.80mm) composing wire net. They were compared and analyzed statistically with specific gravity, thickness swelling, length swelling, bending properties (modulus of rupture, modulus of elasticity, work to proportional limit, and total work), internal bonding strength, and screw holding strength between wood particle and sawdust boards. The results obtained at this study as cording to the discussions might be concluded as follows; 1. In specific gravity, both particle and sawdust boards by press-lam method were higher than by conventional forming and veneer comply method, and the boards containing more wire net sheets also showed higher value. But the wire net spacings(Mok) had no influence on specific gravity. In general, particle board showed higher specific gravity than sawdust board. Veneer comply board showed lowest specific gravity values. 2. Both particle and sawdust boards by press-lam method was slightly lower than by conventional forming and veneer comply method in thickness swelling. The sawdust board containing 8, 12. and 18 Mok wire net showed lower thickness swelling than the corresponding particle board, but both sawdust and particle boards containing the T8 and 10 Mok wire net showed higher and similar thickness swelling. 3. Both particle and sawdust boards containing wire net showed no difference in MOR and MOE of bending. Comply board was the highest and particle board showed slightly higher than sawdust board in MOR and MOE values. 4. In work to proportional limit and total work in bending, both particle and sawdust boards containing thicker wire diameter and more wire net sheets showed higher value. From these facts, it is conceivable that boards with thicker wire diameter and more wire net sheets show increasing resistance against external force. But there was no significant difference between particle and sawdust borads. 5. In resistance against delamination (internal bonding strength), both sawdust and particle boards containing wire net showed lower value than control, and also showed decreasing tendency with more number of wire net sheet composed. Particle board showed higher resistance against delamination than sawdust board. 6. In screw holding strength, sawdust board containing thicker wire diameter and more wire net sheets showed higher value, but particle board by press-lam method was higher than by conventional forming and veneer comply method. Screw holding strength of particle board was higher than that of sawdust board.

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I-fiber 스티칭 공법이 적용된 Single-lap Joint의 강도 특성 및 파손 신호 검출 연구 (A Study on the Strength Characteristics and Failure Detection of Single-lap Joints with I-fiber Stitching Method)

  • 최성현;송상훈;안우진;최진호
    • Composites Research
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    • 제34권5호
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    • pp.317-322
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    • 2021
  • 적층 복합재의 특성상 두께 방향 물성이 취약하여 비틀림, 저속충격, 피로 하중 등 복합 하중을 받게 되면 재료 내부의 미세크랙 진전을 통해 층간분리 현상이 발생하게 된다. 이를 방지하고자 Z-pinning, Stitching 등 다양한 3차원 보강 공법과 구조물의 미세균열을 실시간으로 검출하는 구조 건전성 감시 기법이 꾸준히 연구되고 있다. 본 논문에서는 I-fiber 스티칭 공법으로 보강된 Single-lap joint를 Co-curing 방법으로 제작하였으며, 제작된 시편의 강도 및 파손신호 검출 특성을 평가하였다. 균열과 파손신호 검출을 위하여 전기저항법과 AE법을 사용하였으며, 신호분석을 위한 전용회로를 제작하여 인장시험 중의 파손신호를 분석하였다. 실험결과, I-fiber 스티칭으로 보강된 Single-lap joint 시편은 보강이 없는 Co-cured single-lap joint 시편에 비해 강도가 약 44.6% 향상되었다. 또한, I-fiber로 보강된 Single-lap joint 시편은 강도 향상과 더불어 전기저항법과 AE법에 의한 파손 검출이 모두 가능하므로 파손 모니터링에도 효과적인 구조임을 확인하였다.

탄소 섬유강화 복합재료의 중력 낙하 충격으로 인한 손상 평가 (Drop-weight impact damage evaluation for carbon fiber/epoxy composite laminates)

  • Sohn, Min-Seok;Hu, Xiao-Xhi;Ki, Jang-Kyo;Hong, Soon-Hyung
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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    • pp.89-92
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    • 2001
  • Drop weight impact tests were performed to investigate the impact behavior of carbon fiber/epoxy composite laminates reinforced by short fibers and other interleaving materials. Characterization techniques, such as cross-sectional fractography and scanning acoustic microscopy, were employed quantitatively to assess the internal damage of some composite laminates. Scanning electron microscopy was used to observe impact damage and fracture modes on specimen fracture surfaces. The results show that composite laminates experience various types of fracture; delamination, intra-ply cracking, matrix cracking and fiber breakage depending on the interlayer materials. Among the composite laminates tested in this study, the composites reinforced by Zylon fibers showed very good impact damage resistance with medium level of damage, while the composites interleaved by poly(ethylene-co-acrylic acid) (PEEA) film is expected to deteriorate the bulk strength due to the reduction of fiber volume fraction, even though the damaged area is significantly reduced.

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섬유강화 적층복합재의 열림모드 파괴특성 향상을 위해 $Ar^+$ 이온도움반응법을 적용한 프리프레그의 표면처리 연구 (A Study on the Surface Treatment of Prepreg with $Ar^+$ Ion to Increase Mode I Fracture Characteristics of Fiber-Reinforced Composites)

  • 이경엽;지창헌;양준호
    • 대한기계학회논문집A
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    • 제24권11호
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    • pp.2771-2776
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    • 2000
  • In this work, the effect of surface treatment of prepreg on the mode I fracture behavior was studied. Unidirectional (0-deg) double cantilever beam (DCB) specimens were used for fracture tests. Two groups of DCB specimens were made: the first group was made of prepregs surface-treated by Ar(sup)+ ion beam under oxygen environment and the second group was made of regular prepregs. For both groups, fracture resistance curve (R-curve) was determined and compared to each other, Results showed that resistance behavior of the first group is better than that of the second group. That is, mode I fracture toughness, G(sub)Ic of the first group is 24% larger than that of the second group. SEM examination shows that the improvement of G(sub)Ic is due to the increase of interfacial strength between plies.

가압소결법으로 제조된 알루미나 단섬유 보강 청동기지 복합재의 마모특성 (Wear Properties of the Alumina Short Fiber Reinforced Tin-Bronze Matrix Composites manufactured by Hot Pressing)

  • 최준호;허무영
    • 소성∙가공
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    • 제4권4호
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    • pp.398-409
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    • 1995
  • The wear properties of the alumina short fiber reinforced tin-bronze matrix composites manufactured by hot pressing was studied at the room temperature and $350^{\circ}C.$ The wear loss of various specimens having different constituent and different density was examined by a pin-on-disc type wear testing machine. The results were discussed by the observation of the worn surface morphology and the analysis of the composition on the worn surfaces. Since the reinforced effect of the alumina fiber on the wear resistance was dependent on the strength of alloy matrix, the pressureless sintered composites having a lower matrix strength showed a marked increase in wear resistance by the fiber reinforcement. As the wear condition became severe, the fiber reinforcement was more effective. The delamination on the wear surface was observed in the pressureless sintered specimens having pores which are related to the initiation and the propagation of cracks. However, the wear mechanism acting on a big failure area was not found on the wear surfaces of the hot pressed specimens having a few pores.

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무연계 Ag 외부전극재의 열충격에 따른 열화특성과 고장해석 (Degradation and Failure Analysis of Lead-free Silver Electrodes with Thermal Cycling)

  • 김정우;윤동철;이희수;전민석;송준광
    • 한국전기전자재료학회논문지
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    • 제21권5호
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    • pp.434-439
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    • 2008
  • Silver pastes as the outer electrodes have been prepared using Pb-free glass frits with different content of $Bi_2O_3$ and the effects of glass composition on the degradation behaviors of the Ag electrodes were investigated using the change of adhesion between Ag electrode and alumina substrate with thermal cycle stress. Low adhesion and high surface resistance were observed in Ag electrode using glass frit with a $Bi_2O_3$ content of 60 wt%, owing to the open microstructure formed at the firing temperature of $600^{\circ}C$. When the $Bi_2O_3$ was increased to 80 wt% in the glass frit, the Ag electrodes had a dense microstructure with high adhesion and a low surface resistance. Delamination of the Ag electrodes was a major failure mode under thermal cycle stress and this was attributed to residual stress due to the thermal expansion mismatch between the Ag electrode and the alumina substrate.

원통형 단판적층재의 접착성 및 도장처리에 따른 표면내구성 (Bonding Quality of Cylindrical LVL and Surface Durability by Its Painting)

  • 서진석;김종인;황성욱;박상범
    • Journal of the Korean Wood Science and Technology
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    • 제40권6호
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    • pp.418-423
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    • 2012
  • 원통형 단판적층재(LVL)의 구조재 이외의 공예재 등의 용도개발을 위하여 원통형 단판적층재의 내수접착성과 도장처리에 따른 내마모성 및 표면경도를 측정하였다. 레조시놀 수지와 경화제(paraformaldehyde)를 100 : 5의 혼합비로 하여 접착 경화한 원통형 단판적층재의 전체적인 접착층에 대한 삶음박리 접착력은 양호한 편이었다. 내마모성은 횡단면이 접선단면보다 상대적으로 우수하였으며, 접선단면에 자외선 차단 오일을 도장 처리한 경우 내마모성이 향상되었다. 표면경도는 횡단면의 경우, 낙엽송 중심재가 라디에타소나무 단판적층 부위보다 높았고, 접선단면의 경우에는 접착층 부위가 단판부위보다 높게 나타났다.

Thermal Transient Characteristics of Die Attach in High Power LED Package

  • Kim Hyun-Ho;Choi Sang-Hyun;Shin Sang-Hyun;Lee Young-Gi;Choi Seok-Moon;Oh Yong-Soo
    • 마이크로전자및패키징학회지
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    • 제12권4호통권37호
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    • pp.331-338
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    • 2005
  • The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

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