Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Degradation and Failure Analysis of Lead-free Silver Electrodes with Thermal Cycling

무연계 Ag 외부전극재의 열충격에 따른 열화특성과 고장해석

  • 김정우 (부산대학교 재료공학부) ;
  • 윤동철 (부산대학교 재료공학부) ;
  • 이희수 (부산대학교 재료공학부) ;
  • 전민석 (한국산업기술시험원 신뢰성기술본부/재료평가팀) ;
  • 송준광 (한국산업기술시험원 신뢰성기술본부/재료평가팀)
  • Published : 2008.05.01
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Abstract

Silver pastes as the outer electrodes have been prepared using Pb-free glass frits with different content of $Bi_2O_3$ and the effects of glass composition on the degradation behaviors of the Ag electrodes were investigated using the change of adhesion between Ag electrode and alumina substrate with thermal cycle stress. Low adhesion and high surface resistance were observed in Ag electrode using glass frit with a $Bi_2O_3$ content of 60 wt%, owing to the open microstructure formed at the firing temperature of $600^{\circ}C$. When the $Bi_2O_3$ was increased to 80 wt% in the glass frit, the Ag electrodes had a dense microstructure with high adhesion and a low surface resistance. Delamination of the Ag electrodes was a major failure mode under thermal cycle stress and this was attributed to residual stress due to the thermal expansion mismatch between the Ag electrode and the alumina substrate.

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References

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