• Title/Summary/Keyword: data-driver

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A New Pre-Emphasis Driver Circuit for a Packet-Based DRAM (패킷 방식의 DRAM에 적용하기 위한 새로운 강조 구동회로)

  • Kim, Jun-Bae;Kwon, Oh-Kyong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.4
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    • pp.176-181
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    • 2001
  • As the data rate between chip-to-chip gets high, the skin effect and load of pins deteriorate noise margin. With these, noise disturbances on the bus channel make it difficult for receiver circuits to read the data signal. This paper has proposed a new pre-emphasis driver circuit which achieves wide noise margin by enlarging the signal voltage range during data transition. When data is transferred from a memory chip to a controller, the output boltage of the driver circuit reaches the final values through the intermediate voltage level. The proposed driver supplies more currents applicable to a packet-based memory system, because it needs no additional control signal and realizes very small area. The circuit has been designed in a 0.18 ${\mu}m$ CMOS process, and HSPICE simulation results have shown that the data rate of 1.32 Gbps be achieved. Due to its result, the proposed driver can achieved higher speed than conventional driver by 10%.

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Silicon-based 0.69-inch AMOEL Microdisplay with Integrated Driver Circuits

  • Na, Young-Sun;Kwon, Oh-Kyong
    • Journal of Information Display
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    • v.3 no.3
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    • pp.35-43
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    • 2002
  • Silicon-based 0.69-inch AMOEL microdisplay with integrated driver and timing controller circuits for microdisplay applications has been developed using 0.35 ${\mu}m$ l-poly 4-metal standard CMOS process with 5 V CMOS devices and CMP (Chemical Mechanical Polishing) technology. To reduce the large data programming time consumed in a conventional current programming pixel circuit technique and to achieve uniform display, de-amplifying current mirror pixel circuit and the current-mode data driver circuit with threshold roltage compensation are proposed. The proposed current-mode data driver circuit is inherently immune to the ground-bouncing effect. The Monte-Carlo simulation results show that the proposed current-mode data driver circuit has channel-to-channel non-uniformity of less than ${\pm}$0.6 LSB under ${\pm}$70 mV threshold voltage variaions for both NMOS and PMOS transistors, which gives very good display uniformity.

Development and Validation of A Finite Optimal Preview Control-based Human Driver Steering Model (최적예견 제어 기법을 이용한 운전자 조향 모델의 개발 및 검증)

  • Kang, Ju-Yong;Yi, Kyong-Su;Noh, Ki-Han
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.855-860
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    • 2007
  • This paper describes a human driver model developed based on finite preview optimal control method. The human driver steering model is constructed to minimize a performance index which is a quadratic form of lateral position error, yaw angle error and steering input. Simulation studies are conducted using a vehicle simulation software, Carsim. The Carsim vehicle model is validated using vehicle test data. In order to validate the human driving steering model, the human driver steering model is compared to the driving data on a virtual test track(VTT) and the actual vehicle test data. It is shown that human driver steering behaviors can be well represented by the human driver steering model presented in this paper

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Study on Thermal Analysis for Optimization LED Driver ICs

  • Chung, Hun-Suk
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.2
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    • pp.59-61
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    • 2017
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

Study on Thermal Characteristics of Smart LED Driver ICs Package (일체형 스마트 LED Driver ICs 패키지의 열 특성 분석)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.2
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    • pp.79-83
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    • 2016
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

A Study on Data Driver IC for Field Emission Display (FED 용 Data Driver IC에 관한 연구)

  • Jang, Young-Min;Lee, Jin-Seok;Lee, Jun-Sung;Cho, Jun-Dong
    • Proceedings of the Korea Information Processing Society Conference
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    • 2004.05a
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    • pp.797-800
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    • 2004
  • FED(Field Emission Display)는 CRT(Cathode Ray Tube)의 화질과 LCD(Liquid Crystal Display)와 같은 FPD(Flat Panel Display)의 경량, 박형의 장점을 만족시키는 차세대 Display 소자로서 주목을 받고 있다. 본 논문은 저항열을 이용하여 256 Gray-Scale Level을 출력하는 8 비트 FED Data Driver IC 설계에 관한 것이다. 즉, 저항열과 D/A 변환기를 통하여 디지털 입력 데이터에 따른 아날로그 출력 데이터를 갖는 FED 용 Data Driver IC이다. 본 논문에서 설계된 Driver IC는 집적도를 높여 Output Channel 수를 증가시키는 것을 목표로, 하이닉스 0.6um High Voltage 공정을 사용하였으며, 8 비트 RGB 데이터 입력과 40V 구동전압에서 동작하도록 설계하였다.

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The Study to Diagnose the Road-Driver Compatibility II: Data Collection, Variable Selection and Parameter Quantification (운전자 주행 적합성 진단을 위한 연구 II: 생체신호 추출, 선정 및 정량화)

  • Kim, Jung-Yong;Yoon, Sang-Young;Park, Ji-Soo
    • Journal of Korean Institute of Industrial Engineers
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    • v.30 no.1
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    • pp.50-57
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    • 2004
  • The aim of this study is to collect driver's psychophysiological signal under various road condition and to select and quantify psychophysiological variables for diagnosis of road-driver compatibility. A 4x4 vehicle with measuring devices was developed to collect driver's psychophysiological signal and collected driver's psychophysiological signal under various road conditions. The collected data were analyzed by the temporal pattern of signal overtime. Thirteen bio-signals with consistent pattern were selected and quantified in terms of slope and amplitude of the signal. These quantified values could be used as a part of tool to diagnose the road-driver compatibility.

Design of A 1'${\times}$1', 512${\times}$512 Poly-Si TFT-LCD with Integrated 8-bit Parallel-Serial Digital Data Drivers

  • Shin, Won-Chul;Lee, Seung-Woo;Chung, Hoon-Ju;Han, Chul-Hi
    • Journal of Information Display
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    • v.2 no.2
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    • pp.1-6
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    • 2001
  • A $1"{\times}l"$, $512{\times}512$ poly-Si TFT-LCD with a new integrated 8-bit parallel-serial digital data driver was proposed and designed. For high resolution, the proposed parallel-serial digital driver used serial video data rather than parallel ones. Thus, digital circuits for driving one column line could be integrated within very small width. The parallel-serial digital data driver comprised of shift registers, latches, and serial digital-to-analog converters (DAC's). We designed a $1"{\times}l"$, $512{\times}512$ poly-Si TFT-LCD with integrated 8-bit parallel-serial digital data drivers by a circuit simulator which has physical-based analytical model of poly-Si TFT's. The fabricated shift register well operated at 2 MHz and $V_{DD}$=10V and the fabricated poly-Si TFT serial DAC's, which converts serial digital data to an analog signal, could convert one bit within $2.8{\mu}s$. The driver circuits for one data line occupied $8100{\times}50{\mu}m^2$ with $4{\mu}m$ design rule.

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An Estimation of Comfort on the Automobile Driver Seat Korean Anthropometric Experiment (한국인 인체측정 실험에 의한 자동차 운전석의 안락감 평가)

  • 이영신;이석기;박세진
    • Transactions of the Korean Society of Automotive Engineers
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    • v.4 no.3
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    • pp.61-72
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    • 1996
  • In this paper, the driver seat comfort of eight automobiles was studied. The joint angles and anthropometric data of eleven subjects sitting on the seating buck were investigated using the instrument devices such as scale, goniometer, vernier calipers, protractor, Martin set. The joint angles of the most comfort posture were found by experiment and compared with previous studies. The anthropometric data of Korean(1992 year surveys) and American(1970∼1974 year) were applied to evaluate the driver seat layout of Korean automobile. The joint angles of the most comfort posture for eleven subjects were obtained with experimental results. The joint angles were agreed with reference angles. The driver seat layout was not suited to seat length and acceleratorseatpan forward distance in 5 percentiles female, pedal separation and seatpan-roof height in 95 percentiles male. Korean automobiles were not suited to seatpan length and steering wheelseatpan clearance, floor-roof height for American 95 percentiles male. The driver anthropometric dimensions were more suitable to middle size than small size automobiles.

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Study on Chip on Chip Technology for Minimizing LED Driver ICs (LED Driver ICs칩의 소형화를 위한 Chip on Chip 기술에 관한 연구)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.3
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    • pp.131-134
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    • 2016
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.