• Journal of Welding and Joining
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• v.29 no.4
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• pp.54-60
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• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

• International Journal of Highway Engineering
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• v.16 no.6
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• pp.39-50
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• 2014

PURPOSES : The objective of this study is to evaluate the curing and adhesive behavior of asphalt emulsions including polymer-modified emulsions for chip seals and fog seals. METHODS : For the laboratory testing, the evaporation test, the bitumen bond strength (BBS) test, and the Vialit test are used. Also, the rolling ball test and the damping test are employed to evaluate the curing properties of the fog seal emulsions. In order to conduct all the tests in controled condition, all test procedures are performed in the environmental chamber. The CRS-2L and the SBS CRS-2P emulsions are used as a polymer-modified emulsion, and then unmodified emulsion, the CRS-2, is compared for the evaluation of chip seal performance. For the fog seal performance evaluation, two types of polymer-modified emulsions (FPME-1 and FPME-2) and one of unmodified emulsion, the CSS-1H, are employed. All the tests are performed at different curing times and temperatures. RESULTS AND CONCLUSIONS : Overall, PMEs show better curing and adhesive behavior than non-PMEs regardless of treatments types. Especially, the curing and adhesive behavior of PMEs is much better than non-PMEs before 120 minutes of curing time. Since all the test results indicate that after 120 minutes of curing time the curing adhesive behavior of emulsions, the early curing time, i.e., 120 minutes, plays an important role in the performance of chip seals and fog seals.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Proceedings of the KACD Conference
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• 2001.11a
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• pp.579-579
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• 2001

One of the most important factors for the clinical success of adhesive posterior restorations is marginal adaptation. This property is very closely related to mechanical properties and to the shrinkage behavior of composite materials. Most of modem composite materials are light-cured. This is why the first part of this lecture will be confined to our recent research on light curing, such as plasma polymerization, LED polymerization and the power of modem halogen lamps. In the second part of the lecture the shrinkage properties such as dimensional shrinkage and shrinkage forces of different light curing materials and during different curing procedures will be discussed. Finally, in the third part of the lecture, marginal adaptation before and after loading in different cavity classes and by using different restorative techniques and curing procedures will be presented. Data will also be given on wear resistance, abrasiveness against opposing cusps and postcuring of composite materials.(omitted)

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.33-41
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• 2000

Fiber reinforced metal laminates(FRMLs) were new type of hybrid materials. FRMLs consist of high strength metals(Al 5052-H34) and laminated fiber with structural adhesive bond. The effect of resin mixture ratios on the fatigue crack propagation behavior and mechanical properties of aramid fiber reinforced aluminum composites was investigated. The epoxy, diglycidylether of bisphenol A(DGEBA), was cured with methylene dianiline(MDA) with or without an accelerator(K-54). Eight kinds of resin mixture ratio were used for the experiment ; five kinds of FRMLs(1)(mixture of epoxy and curing agent) and three kinds of FRMLs(2)mixture of epoxy, curing agent and accelerator). The characteristic of fatigue crack propagation behavior and mechanical properties FRMLs(2) shows more effecting than that of FRMLs(1).

• Journal of Welding and Joining
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• v.31 no.5
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• pp.71-76
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• 2013

The effect of zirconate having - NH functional group on the T-peel and lap shear strength of $CaCO_3$ containing structural epoxy adhesive for car body assembly was investigated. Curing behavior of epoxy adhesive samples were investigated by differential scanning calorimeter (DSC) techniques. The addition of zirconate up to 7.5 phr did not affect the curing mechanism of epoxy adhesive. While the small amount of zirconate addition less than 1.1 phr increased the cross-linking density, the excess addition of zirconate resulted in the increase of uncross-linked impurity. From the increase of T-peel and lap shear strength and the change of fracture mode from the adhesive failure to the mixed one, it was considered that the small addition of zirconate was effective in improving the adhesion strength of epoxy adhesive to the adherend and inorganic filler surfaces. The formation of uncross-linked impurity with the excess addition of zirconate was considered to decrease the joint strength by decreasing the cohesive strength of the cured epoxy.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Polymer(Korea)
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• v.39 no.2
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• pp.281-286
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• 2015

UV-cured acrylic copolymer pressure sensitive adhesive (PSA) having different amounts of crosslinking agents were prepared and adhesion properties were investigated. 0.01 wt% of MMT clay was dispersed in 2-ethylhexyl acrylate (2-EHA)/acrylic acid (AA) monomer mixture containing 0, 0.05, 0.1 and 0.3 wt% 1,6-hexandiol diacrylate (HDDA) for crosslinking. It was investigated that the curing behavior and surface chemistry of PSAs were merely affected by the presence of MMT clays. On the other hand, adhesive properties were influenced by the MMT addition; a cohesive failure was restrained due to improved molecular elasticity even in uncrosslinked acrylic PSAs. However, it was also appeared that combination of 0.3 wt% crosslinking agent and MMT loading might result in the damage of adhesion properties of PSAs possibly due to the lack of chain flexibility. In our studies, it is suggested that the 2-EHA/AA PSAs incorporating 0.01 wt% of MMT and crosslinked with 0.05 wt% of HDDA exhibited the balanced adhesion properties without severe cohesive failure during strip.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.8
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• pp.149-154
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• 1999

FRMLs(Fiber Reinforced Metal Laminates) is a new type of hybrid materials. FRMLs consists of high strength metal and fiber which are laminated using a structural adhesive bond(epoxy resin). The effect of resin mixture ratios on the fatigue crack propagation behavior and mechanical property of Aramid fiber reinforced aluminum composites was investigated. The epoxy, diglycidylether of bisphenol A(DGEBA) was cured with methylene dianiline(MDA) with or without accelerator(K-54). Eight kinds of resin mixture ratio were tested for the experiment ; five kinds of FRMLs(1))epoxy & curing agent) and three kinds of FRMLs(2)(epoxy & curing agent & accelerator). FRMLs(2) have a more effective characteristics on the fatigue crack propagation behavior and mechanical property than FRMLs(1)