• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.2089-2098
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• 2015

With the continuous development in insulation of electrical equipment design, the reliability of the system has been enhanced. However, in the manufacturing process and during operation under continues stresses introduce local defects, such as voids between interfaces that can responsible to occurrence of partial discharge (PD), electric field distortion and accumulation of charges. These defects may lead to localize corrosion and material degradation of insulation system, and a serious threat to the equipment. A model of three layers of PI film with air gap is presented to understand the influence of interface and voids on exploitation conditions such as strong electrical field, PD activity and charge movement. The analytical analysis, and experimental results are good agreement and show that the lose contact between interfaces accumulate more residual charges and in consequences increase the electric field intensity and accelerates internal discharges. These residual charges are trapped charges, injected by the electrodes has often same polarity, so the electric field in cavities increases significantly and thus partial discharge inception voltage (PDIV) decreases. Contrary, number of PD discharge quantity increases due to interface. Interfacial polarization effect has opposite impact on electric field and PDIV as compare to void.

• Nuclear Engineering and Technology
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• v.45 no.3
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• pp.295-310
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• 2013

Industry- or regulatory-sponsored research activities on the resolution of Generic Safety Issue (GSI)-191 were reviewed, especially on the chemical effects. Potential chemical effects on the head loss across the debris-loaded sump strainer under a post-accident condition were experimentally evidenced by small-scale bench tests, integrated chemical effects test (ICET), and vertical loop head loss tests. Three main chemical precipitates were identified by WCAP-16530-NP: calcium phosphate, aluminum oxyhydroxide, and sodium aluminum silicate. The former two precipitates were also identified as major chemical precipitates by the ICETs. The assumption that all released calcium would form precipitates is reasonable. CalSil insulation needs to be minimized especially in a plant using trisodium phosphate buffer. The assumption that all released aluminum would form precipitates appears highly conservative because ICETs and other studies suggest substantial solubility of aluminum at high temperature and inhibition of aluminum corrosion by silicate or phosphate. The industry-proposed chemical surrogates are quite effective in increasing the head loss across the debris-loaded bed and more effective than the prototypical aluminum hydroxide precipitates generated by in-situ aluminum corrosion. There appears to be some unresolved potential issues related to GSI-191 chemical effects as identified in NUREG/CR-6988. The United States Nuclear Regulatory Commission, however, concluded that the implications of these issues are either not generically significant or are appropriately addressed, although several issues associated with downstream in-vessel effects remain.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.3
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• pp.223-229
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• 2015

Surface modification is a technology to form a new surface layer and overcome the intrinsic properties of the base material by applying thermal energy or stress onto the surface of the material. The purpose of this technique is to achieve anti-corrosion, beautiful appearance, wear resistance, insulation and conductance for base materials. Surface modification techniques may include plating, chemical conversion treatment, painting, lining and surface hardening. Among which, a surface modification process using electrolytes has been investigated for a long time in connection with research on its industrial application. The technology is highly favoured by various fields because it provides not only high productivity and cost reduction opportunities, but also application availability for components with complex geometry. In this study, an electrochemical experiment was performed on the surface of 5083-O Al alloy to determine an optimal electrolyte temperature, which produces surface with excellent corrosion resistance under marine environment than the initial surface. The experiment result, the modified surface presented a significantly lower corrosion current density with increasing electrolyte temperature, except for $5^{\circ}C$ of electrolyte temperature at which premature pores was created.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1609-1611
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• 2007

The owner of underground metallic structures (gas pipeline, oil pipeline, water pipeline, etc) has a burden of responsibility for the corrosion protection in order to prevent big accidents like gas explosion, soil pollution, leakage and so on. So far, Cathodic Protection(CP) technology have been implemented for protection of underground systems. The stray current from DC subway system in Korea has affected the cathodic protection (CP) system of the buried pipelines adjacent to the railroads. In this aspect, KERI has developed a various mitigation method, drainage system through steel bar under the rail, a stray current gathering mesh system, insulation method between yard and main line, distributed ICCP(Impressed Current Cathodic System), High speed response rectifier, restrictive drainage system, Boding ICCP system. In this paper, the mechanism of mitigation method of DC stray current for underground metallic structures is described.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1612-1614
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• 2007

The owner of underground metallic structures (gas pipeline, oil pipeline, water pipeline, etc) has a burden of responsibility for the corrosion protection in order to prevent big accidents like gas explosion, soil pollution, leakage and so on. So far, Cathodic Protection(CP) technology have been implemented for protection of underground systems. The stray current from DC subway system in Korea has affected the cathodic protection (CP) design of the buried pipelines adjacent to the railroads. In this aspect, KERI has developed a various mitigation method, drainage system through steel bar under the rail, a stray current gathering mesh system, insulation method between yard and main line, distributed ICCP(Impressed Current Cathodic System), High speed response rectifier, restrictive drainage system. We installed the mitigation system at the real field and test of its efficiency in Busan and Seoul, Korea. In this paper, the results of field test, especially, distributed ICCP system is described.

• Journal of Wind Energy
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• v.10 no.4
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• pp.20-27
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• 2019

High-speed shaft coupling in a wind power system transmits power and absorbs variations in length and spindle dislocation between the gearbox and generator. Furthermore, the coupling has an insulation function that prevents electrical corrosion caused by the flow of the generator's current into the gearbox and prevents overload resulting from sudden power failure from being transferred to the gearbox. Its design, functions, and part verification are described in the IEC61400 and GL Guidelines, which specify that the part must have a durability life of 20 years or longer under distance variation and axial misalignment between the gearbox and the generator. This study presents the design of a high-speed coupling through composite stiffness calculation, structural analysis, and comparative analysis of test and theory to identify the characteristics of high-speed coupling for a large-capacity 6 MW wind power generator. A prototype was fabricated by optimizing the manufacturing process for each part based on the design, and the reliability of the fabricated prototype was verified by evaluating the performance of the target quantitative evaluation items.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.11
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• pp.3260-3268
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• 2009

A test apparatus has been fabricated to simulate chemical effect on head loss through a strainer in a pressurized water reactor (PWR) containment water pool after a loss of coolant accident (LOCA). Tests were conducted under condition of same ratio of strainer surface area to water volume between the test appratus and the containment sump. A series of tests have been performed to investigate the effects of spray, existence of calcium-silicate with tri-sodium phosphate (TSP), and composition of materials. The results showed that head loss across the chemical bed with even a small amount of calcium-silicate insulation instantaneously increased as soon as TSP was added to the test solution. Also, the head loss across the test screen is strongly affected by spray duration and is increased rapidly at the early stage, because of high dissolution and precipitation of aluminum and zinc. After passivation of aluminum and zinc by corrosion, the head loss increase is much slowed down and is mainly induced by materials such as calcium, silicon, and magnesium leached from NUKONTM and concrete. Furthermore, it is newly found that the spay buffer agent, tri-sodium phosphate, to form protective coating on the aluminum surface and reduce aluminum leaching is not effective for a large amount of aluminum and a long spray.