• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제23권2호
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• pp.115-138
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• 2019

The dual singular function method [DSFM] is a solver for corner sigulaity problem. We already construct DSFM in previous reserch to solve the Stokes equations including one singulairity at each reentrant corner, but we find out a crucial incorrection in the proof of well-posedness and regularity of dual singular function. The goal of this paper is to prove accuracy and well-posdness of DSFM for Stokes equations including two singulairities at each corner. We also introduce new applicable algorithms to slove multi-singulrarity problems in a complicated domain.

• Structural Engineering and Mechanics
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• 제5권6호
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• pp.705-713
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• 1997

The residual thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate due to cooling from cure temperature down to room temperature were studied. The matrix material was assumed to be thermorheologically simple. The time-domain boundary element method was employed to investigate the nature of stresses on the interface. Numerical results show that very large stress gradients are present at the interface corner and this stress singularity might lead to local yielding or fiber-matrix debonding.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제13권4호
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• pp.281-292
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• 2009

The solution of the interface problem or Poisson problem with concave corner has singular perturbation at the interface corners or singular corners. The decoupled dual singular function method (DDSFM) which exploits the singular representations of the solutions was suggested in [3, 9] and estimated optimal accuracy in [10]. The convergence rates consist with theoretical results even for the problems with very strong singularity, with the efficiency depending on parameters used in the methods. Furthermore the errors in $L^2$ and $L^\infty$-spaces display some oscillation, in the cases with meshsize not small enough. In this paper, we present an answer to remove the oscillation via numerical experiments. We observe the effects of parameters in DDSFM, and show the consisting efficiency of the method over the strong singularity.

• 대한기계학회논문집A
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• 제20권1호
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• pp.135-145
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• 1996

Order of stress singularities at bonded Edge Corners with two or three dissimilar isotropic Materials is analyzed. The problem is formulated by Mellin transform and characteristic equation is obtained as a determinant of matrix considering boundary conditions. Roots of characterictic equation are determinde by numerical calculations with ward method, from which the order of stress sigularities is obtained. Applying the results to the electronic packaging, the order of stress singularities is obtained. Applying the results to the electronic packaging, the order of stress singularities at bounded edge corners is calculated as a various bouned edge angle with given material combinations. Comparing the results, the optimal material combinaitons of bounded edge corners and bouned edge angle to reduce stress singularity could be determined. It suggests that the results are used to the basic design of electronic packaging reducing the stress singularity.

• 한국전산구조공학회논문집
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• 제13권1호
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• pp.97-103
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• 2000

이 논문에서는, 반도체 칩과 리드프레임을 결합하는 과정에서 점탄성 접착제층에 발생하는 잔류응력 문제를 다루고 있다. 접착제층은 “열유동단순”거동을 한다고 가정하였다. 접착제층에서의 응력들은 경계요소법을 사용하여 조사하였다. 매우 큰 응력 구배가 계면 모서리에서 발생하는데, 그러한 응력들은 국부 항복을 일으키거나, 칩과 리드프레임의 박리를 야기시킬 수 있음을 보여주고 있다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.146-153
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• 2003

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

• 전산구조공학
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• 제9권4호
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• pp.181-187
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• 1996

이 논문에서는, 탄성 섬유와 점탄성 기지로 구성된 2차원의 단일방향 복합재료가 높은 제작온도로 부터 실온으로 냉각될때 섬유와 기지사이의 계면에서 발생하는 특이 열응력을 조사하고 있다. 계면을 따라 발생하는 잔류 열응력의 특성을 조사하는데 시간영역 경계요소법을 적용하였다. 수치해석 결과에 의하면, 계면응력들은 자유경계면 근처에 이르러 급속히 커지는데, 이러한 특이 잔류응력들은 자유경계면 가까이에서 국부 항복을 일으키거나 섬유와 기지의 결합분리를 야기시킬수 있다.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1996년도 춘계학술발표회논문집(3)
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• pp.305-310
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• 1996

This paper concerns the cladding residual stresses in a reactor vessel induced during cooling from the manufacturing temperature down to room temperature Finite element results show that very large stress gradients are present at the interface corner and such stress singularity might lead to local yielding or cladding-base metal debonding.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2003년도 가을 학술발표회 논문집
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• pp.383-388
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• 2003

This paper deals with the singular stresses developed in a polymer coating on concrete due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity dominates a very small region relative to layer thickness. Since the exceedingly large stresses at the interface corner cannot be borne by coating materials, local yielding or delamination can occur in the vicinity of free surface.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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• pp.27-33
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• 2002

The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.