• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.812-813
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• 2006

Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

• Journal of Powder Materials
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• v.11 no.5
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• pp.383-390
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• 2004

In order to investigate behavior of abnormal expansion of the iron-copper compacts, we compared the dilatometric curves of the compacts which mixed the copper powder to the iron powder with those of compacts which mixed the copper powder to the iron-copper alloy powder. The dilatometric curves were obtained below the sintering conditions, which heated up to 115$0^{\circ}C$ by a heating rate of 1$0^{\circ}C$/min, held for 60min at 115$0^{\circ}C$ and cooled down at a rate of 2$0^{\circ}C$/min to room temperature. The dilatometric curves of the compacts showed the different expansion behavior at temperatures above the copper melting point in spite of same chemical composition. All of the compacts of former case showed large expansion, but all of the compacts in latter case showed large contraction. The microstructures of sintered compacts also showed the different progress in alloying of the copper into the iron powder. Namely we could observe the segregation at alloy part of copper into iron powder in case of the sintered compacts, which mixed the copper powder to the iron powder, but could not observe the segregation in compacts which mixed the copper powder to the iron-copper alloy powder. But the penetration of liquid copper into the interstices between solid particles was occurred at both cases. Therefore, the showing of the different dimensional changes in the compacts in spite of same chemical composition is due to more the alloying of copper into iron powder than the penetration of liquid copper into the interstices between solid particles.

• Resources Recycling
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• v.20 no.6
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• pp.37-42
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• 2011

Copper chip scrape has been occurred by cutting of copper pipe. The feasibility of copper chip scrape into the copper powder by milling was studied. Two milling type such as rod milling and horizontal balling milling were applied in this research. Copper chip can not fragmented into powder by using rod milling. In contrast to rod milling, copper chip can be changed into powder by horizontal ball milling for above 36 hours. It was found that recycling of copper chip scraps into copper powder by horizontal ball milling is possible and powder fraction percent ($75{\sim}150{\mu}m$) of milled copper chip for 48 hours is 25.3%.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.1
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• pp.131-137
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• 1998

A composite copper coated powder was generated by pressure hydrogen stripping copper from Kelex 100 solvent extractant in the presence of silica powder. Within the limitation of solvent extraction under constant conditions, both loading level and stripping rate were reproducible. The stripping copper kinetics are reduced from a divalent state to a metallic state and then deposited on the surface of the silica powder. Copper nucleates heterogeneously on the seed particles. They are giving an agglomerated and non - uniform powder.

• Journal of Powder Materials
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• v.16 no.5
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• pp.351-357
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• 2009

A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO$_3$ leaching process. The first step consisted of replacing noble copper ions with external Fe$^{3+}$ ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 1$\sim$2$\mu$m in size.

• Journal of Powder Materials
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• v.19 no.6
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• pp.405-411
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• 2012

Recovery of copper powder from copper chloride solution used in $MoO_3$ leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average $1{\mu}m$ in size.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.58-67
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• 2002

In this study copper chloride(CuCl$_2$) solution was used as raw material to produce the fine copper oxide powder which has less than 1 $\mu\textrm{m}$ average particle size and has uniform particle size distribution by spray pyrolysis process. In the present study, the effects of reaction temperature, the injection speed of solution and air, the nozzle tip size and the concentration of raw material solution on the properties of produced powder were studied. The structure of the powder became much more compact with increasing the reaction temperature regardless of copper concentration of the raw material solution. The particle size of the powder increased accordingly with increasing the reaction temperature in case of 30 g/$\ell$ copper concentration of the solution. The particle size of the powder increased accordingly, and the surface structure of the powder became more porous with increasing the copper concentration of the raw material solution. When copper concentration in raw material solution was more than 100 g/$\ell$, all produced powder was CuCl regardless of reaction temperatures. When copper concentration in solution was below 30 g/$\ell$ and reaction temperature was higher than 90$0^{\circ}C$, CuO was the main phase. The surface of the powder tended to become porous with increasing the injection speed of solution. Particle size was increased and the surface of the powder showed severely disrupted state with increasing the nozzle tip size. The particle size was decreased and the particle size distribution was more uniform with increasing the air pressure through the nozzle.

• Membrane and Water Treatment
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• v.7 no.5
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• pp.403-416
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• 2016

The possibility of using carica papaya leaf powder for removal of copper from wastewater as a low cost adsorbent was explored. Different parameters that affect the adsorption process like initial concentration of metal ion, time of contact, adsorbent quantity and pH were evaluated and the outcome of the study was tested using adsorption isotherm models. A maximum of 90%-94.1% copper removal was possible from wastewater having low concentration of the metal using papaya leaf powder under optimum conditions by conducting experimental studies. The biosorption of copper ion was influenced by pH and outcome of experimental results indicate the optimum pH as 7.0 for maximum copper removal. Copper distribution between the solid and liquid phases in batch studies was described by isotherms like Langmuir adsorption and Freundlich models. The adsorption process was better represented by the Freundlich isotherm model. The maximum adsorption capacity of copper was measured to be 24.51 mg/g through the Langmuir model. Pseudo-second order rate equation was better suited for the adsorption process. A dynamic mode study was also conducted to analyse the ability of papaya leaf powder to remove copper (II) ions from aqueous solution and the breakthrough curve was described by an S profile. Present study revealed that papaya leaf powder can be used for the removal of copper from the wastewater and low cost water treatment techniques can be developed using this adsorbent.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1207-1208
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• 2006

We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.511-512
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• 2006

Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.