Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

  • Song, Shu-Xiang (Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing) ;
  • Zhou, Zhang-Jian (Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing) ;
  • Du, Juan (Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing) ;
  • Zhong, Zhi-Hong (Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing) ;
  • Ge, Chang-Chun (Laboratory of Special Ceramics and Powder Metallurgy, University of Science and Technology Beijing)
  • Published : 2006.09.24
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Abstract

Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

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