Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 2006.09b
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- Pages.1207-1208
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- 2006
Development of the Copper Core Balls Electroplated with the Solder of Sn-Ag-Cu
- Imae, Shinya (New Products dep. of Fukuda Foil & Powder Co.,Ltd.) ;
- Sugitani, Yuji (New Products dep. of Fukuda Foil & Powder Co.,Ltd.) ;
- Nishida, Motonori (New Products dep. of Fukuda Foil & Powder Co.,Ltd.) ;
- kajita, Osamu (New Products dep. of Fukuda Foil & Powder Co.,Ltd.) ;
- Takeuchi, Takao (R&D dept. of Daiwa Fine Chemicals Co.,Ltd.)
- Published : 2006.09.24
Abstract
We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.
Keywords
- copper core ball electroplated the solder of with Sn-Ag-Cu;
- UDS(Uniform-Droplet Spray)method joint strength;
- BGA(ball-grid array);
- CSP(chip-scale packaging)