• Korean Chemical Engineering Research
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• 제46권6호
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• pp.1069-1074
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• 2008

구리 나노입자의 표면에 화학흡착한 octanethiol, decanethiol 및 dodecanethiol의 3D SAMs를 연구하였고, dodecanethiol의 투입량 변화에 따른 구리 나노입자의 산화 안정성을 고찰하였다. 제조 공정은 산소로부터 보호하기 위해 질소 분위기에서 수행하였고, 합성된 입자는 원심분리를 통하여 획득하였다. 구리 전구체는 Copper(II) nitrate, 환원제는 sodium borohydride를 사용하였으며, 반응은 단일상에서 진행하였다. 나노 크기의 구리입자는 TEM 분석을 통하여 확인하였고, 그 크기는 약 3~6 nm였다. FT-IR, XPS와 열중량분석(TGA) 결과 alkanethiol의 thiol기가 구리 표면에 화학흡착 한다는 것과 alkyl기의 사슬이 길수록 alkanethiol의 흡착양이 증가한다는 것을 확인하였고, XRD 패턴으로부터 구리 나노입자의 거대격자회절(superlattice diffraction)을 관측할 수 있었다. 그리고 dodecanethiol의 투입양이 구리의 투입양보다 적을 경우 구리는 $Cu_2O$의 형태로 산화되었으며, 구리보다 1.25배 많이 투입할 경우 더욱 조밀한 SAMs를 형성하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• 조명전기설비학회논문지
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• 제12권2호
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• pp.85-90
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• 1998

본 논문에서는 AC 전압 하에서 자유 도전성 금속이물 혼입에 의한 SF6 가스로 압축된 GIS의 절연특성에 관하여 연구하였다. GIS 내에서 자유 도전성 금속이물이 혼입되면 절연파괴 전압을 낮추는 결정적인 역할을 할 수 있으므로, 금속이물의 재질과 크기에 따른 부상전계 및 절연파괴전압을 측정하였다. 구리, 철, 알루미늄의 선형 금속이물에서의 부상전계 계산값과 측정값을 비교, 분석하였다. 압축된 $SF_6$ 가스로 절연된 동축원통전극간에 금속이물의 혼입될 경우의 절연파괴전압은 금속이물의 없을 때보다 낮게 나타났으며, 금속이물의 재질과 크기에 상당히 의존하였다. 따라서 자유도전성 금속이물은 GIS의 절연파괴 특성에 매우 중요한 요소로 작용함을 알 수 있었다.

• 자원리싸이클링
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• 제3권3호
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• pp.7-11
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• 1994

$\alpha$-Etchent 부식액과 순수동액을 수소환원시킴으로 아래와 같은 결과를 얻었다. (1) 수소압 및 교반속도가 증가함에 따라 각각 300psi, 500rpm까지는 동의 회수율은 증가하다가 그 이상에서는 오히려 감소하였으나, 반응온도에는 거의 영향을 받지 않았다. 이때 동의 회수율은 순수동용액 및 $\alpha$-Etchent 용액에서 최대 각각 약 90% 및 60%이었다. 또한 모든 실험에 있어 순수동용액이 $\alpha$-Etchent 부식액에서 보다 약 30~40% 동의 회수율이 증가하였다. (2) 반응시간이 증가하면 약 30분까지는 동의 회수율이 증가하지만 그 이상에서는 거의 변화가 없었다. 이때 반응초기에는(30분까지) 침상형의 동분말이었지만 그 이상에서는 포도송이 모양의 noudle 형태로 성장되었고, 분말의 크기는 약 $2~3\mu\textrm{m}$이었다.

• 자원리싸이클링
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• 제27권1호
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• pp.55-63
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• 2018

열처리 조건에 따른 폐 인쇄회로기판의 물성 변화에 대해 조사하였다. 열처리는 $200^{\circ}C$부터 $325^{\circ}C$까지 공기 및 질소분위기에서 시행하였다. 열중량 분석 결과 인쇄회로기판은 두 단계로 열분해되었으며, 공기 분위기와 질소 분위기 공히 $300^{\circ}C$ 전후에서 층분리로 인해 인쇄회로기판의 두께가 11~28% 팽창되었다. 기계적 강도는 열처리 유 무에 따라 338.4 MPa에서 20.3~40.2 MPa까지 감소하였다. 열처리한 인쇄회로기판을 파쇄 후 체분리하여 입도에 따른 밀도 분포 및 단체분리도를 측정하였다. 밀도측정 결과, 비금속 입자와 구리 입자가 각각 다른 입도구간에 집중되었다. 구리의 단체분리도는 열처리를 함으로써 $1,400{\sim}2,000{\mu}m$ 구간에서 9.3%에서 100%로 향상되었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 E
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• pp.1711-1713
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• 1998

This paper describes the insulation characteristics of GIS by the free conducting particles under alternating voltage. The particles of the GIS can cause decrease in breakdown voltages. Various materials and sizes of free conducting particles were used to study the lift-off and fall-down characteristics. The measured lift-off voltage for copper particle agreed with the calculated one.

• 한국기계가공학회지
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• 제16권2호
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• pp.149-154
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• 2017

Numerous studies of the dynamic behavior of powders have been performed by Discrete Element Method (DEM). The behavior of powders can be analyzed using the DEM assuming that the powder is composed of spherical particles. Moreover, the assumption of spherical particle reduces the computing time significantly. However, the biggest problem with this assumption is the real shape of the particles. Some types of particles, such as calcium carbonate and colloidal copper, are needle shaped. Thus, analysis based on spherical particles can produce errors because of the incorrect assumption. In this research, we developed a new model to simulate needle-shaped particles using the DEM. In the model, a series of particles are connected and regarded as a rod. There is no relative motion among the particles. Thus, the behavior of the rod is rigid motion. To validate the developed model, we carried out the drop-and-bounce test with different initial angles. The results showed negligible error of less than 2%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• 한국군사과학기술학회지
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• 제21권5호
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• pp.591-598
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• 2018

The reaction characteristics of aluminum-copper(II) oxide composites initiated by the electrostatic discharge were studied as changing the aluminum particle size. Three different sizes of aluminum particles with nano-size copper(II)-oxide particle were used in the study. These composites were manufactured by two methods i.e. a shock-gel method and a self-assembly method. The larger aluminum particle size was, the less sensitive and less violent these composites were based on the electrostatic test. On the analysis of high speed camera about ignition appearances and burning time, the burning speed was faster when aluminum particle size was smaller.

• 한국표면공학회지
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• 제49권3호
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• pp.265-273
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• 2016

The effects of surface modification by nitric acid on the pre-treatment of electroless copper plating were investigated. Copper was electroless-plated on the nitric acid treated graphite activated by a two-step pre-treatment process (sensitization + activation). The chemical state and relative quantities of the various surface species were determined by X-ray photoelectron spectroscopy (XPS) after nitric acid modification or pre-treatment. The acid treatment increased the surface roughness of the graphite due to deep and fine pores and introduced the oxygen-containing functional groups (-COOH and O-C=O) on the surface of graphite. In the pre-treatment step, the high roughness and many functional groups on the nitric acid treated graphite promoted the adsorption of Sn and Pd ions, leading to the uniform adsorption of catalyst ($Pd^0$) for Cu deposition. In the early stage of electroless plating, a lot of tiny copper particles were formed on the whole surface of acid treated graphite and then homogeneous copper film with low variation in thickness was formed after 30 min.