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http://dx.doi.org/10.7844/kirr.2018.27.1.55

Physical Property Changes of Wasted Printed Circuit Board by Heat Treatment  

Kim, Boram (Department of Earth Resources and Environmental Engineering, Hanyang University)
Park, Seungsoo (Department of Earth Resources and Environmental Engineering, Hanyang University)
Kim, Byeongwoo (Department of Earth Resources and Environmental Engineering, Hanyang University)
Park, Jaikoo (Department of Earth Resources and Environmental Engineering, Hanyang University)
Publication Information
Resources Recycling / v.27, no.1, 2018 , pp. 55-63 More about this Journal
Abstract
Physical property changes of printed circuit board (PCB) according to heat treatment conditions were investigated. The heat treatment was carried out in air and nitrogen atmosphere at temperature range from $200^{\circ}C$ to $325^{\circ}C$. Thermogravimetric analysis showed that the PCB was pyrolyzed in two steps. The thickness of PCB expanded by 11~28% at about $300^{\circ}C$ in both air and nitrogen atmosphere as layer disintegration occurred. Mechanical strength of PCB decreased from 338.4 MPa to 20.3~40.2 MPa due to the delamination caused by the heat treatment. The heated printed circuit boards were crushed and sieved for analysis of density distribution and liberation degree of copper according to particle size. As a result of the density distribution measurement, non metallic particles and copper particles were concentrated into different size range, respectively. The liberation degree of copper was improved from 9.3% to 100% at size range of $1,400{\sim}2,000{\mu}m$ by heat treatment.
Keywords
Printed circuit board; Heat treatment; Recovery of copper; Preprocess; Liberation;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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