• 한국분말재료학회지
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• 제15권3호
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• pp.227-233
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• 2008

Dynamic plastic deformation behavior of copper particles occurred during the cold spray processing was numerically analyzed using the finite element method. The study was to investigate the impact as well as the heat transfer phenomena, happened due to collision of the copper particle of $20{\mu}m$ in diameter with various initial velocities of $300{\sim}600m/s$ into the copper matrix. Effective strain, temperature and their distribution were investigated for adiabatic strain and the accompanying adiabatic shear localization at the particle/substrate interface.

• 한국분말재료학회지
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• 제5권4호
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• pp.329-333
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• 1998

Copper-10 wt. % tungsten alloyed powder was obtained by co-reduction of mixed tungsten-trioxide and copper oxide powders at 973 K for 7.2 Ks. In the alloy obtained by pressure-assisted sintering of this co-reduced powder, ultra fine tungsten particles (about 100nm) were dispersed uniformly in the copper matrix. At room temperature, the hardness of this alloy was Hv151 and the electrical conductivity was 85% IACS. After annealing at 1173 K for 3.6 Ks, the hardness and electrical conductivity were Hv147 and 84% IACS, respectively, and were same as before annealing. It was confirmed that the hardness and electrical conductivity of this alloy were hardly influenced by annealing condition since the microstructure of this alloy is highly stabilized.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.39-42
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• 2004

Carbon nanofiber/Cu composite powder has been fabricated by electroless plating process. Microstructural evolution of the composite powder after heat treatment under vacuum, hydrogen and air environment was investigated. A dispersed carbon nanofiber coated by copper was produced at the as-plated condition. Carbon nanofiber is coated uniformly and densely with the plate shaped copper particles. The copper plates on the carbon nanofiber aggregate during the thermal exposure at elevated temperature in vacuum and hydrogen in order to reduce surface energy. The thermal exposure of the composite powder in air at $400^{\circ}C$ for 3 hours leads to the spherodization of the composite powder owing to oxidation of copper.

• 한국표면공학회지
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• 제17권1호
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• pp.1-6
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• 1984

The fluidized bed electrode reactor(FBER) with conducting particles has been made use of the removal of metals from dilute electroplating rinse water. The electrolysis was carried out under the conditions of diaphragm current density with 2~28A/$dm^2$ and bed expansion with 20~50%. Recirculating batch operations have been shown that the metal concentration dropped exponentially and may be taken down to 10 ppm. And then, the current efficiency at a concentration of 10 ppm copper was 37% under the conditions of 30% bed expansion and 6 A/$dm^2$, and at concentrated electrolyte (2000ppm copper) was over 80% in the range of 8~28A/$dm^2$ and 20~50% bed expansion. One of the technical possibilities of fluidized bed electrolysis is the separation of copper and nickel from a mixed solution of copper and nickel.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1382-1385
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• 2006

We have studied ink-jet printing method for patterning of conductive line on flexible plastic substrates. Synthesized copper nano-particles of ${\sim}40\;nm$ were used for the conductive ink and the printed patterns exhibit a smooth line whose line width is about $100\;{\mu}m$.

• Corrosion Science and Technology
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• 제16권5호
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• pp.265-272
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• 2017

Inhibition of pitting corrosion of the copper sprinkler tubes by removing dissolved oxygen in water with sodium sulfite was studied on the wet sprinkler systems operated in 258 household sites. First, air in the sprinkler tubing was removed by vacuum pumping. The tube was then filled with sodium sulfite dissolved in water. Sodium sulfite was very effective in maintaining a very low dissolved oxygen concentration in water in the sprinkler tube for the observation period of six months. Water leakage from the copper sprinkler tube was reduced significantly by using sodium sulfite. Both pitting corrosion process and pitting corrosion inhibition mechanism were investigated by examining microscopical and structural aspects of corrosion pits formed in failed copper sprinkler tube. Pitting corrosion was caused by pressurized air as well as sediments such as sand particles in copper tubes through oxygen concentration cells. It was confirmed microscopically that growth of corrosion pits was stopped by reducing dissolved oxygen concentration to a very level by using sodium sulfite.

• 한국재료학회지
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• 제20권10호
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

• 한국재료학회지
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• 제28권9호
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• pp.516-521
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• 2018

Copper oxide thin films are deposited using an ultrasonic-assisted spray pyrolysis deposition (SPD) system. To investigate the effect of substrate temperature and incorporation of a chelating agent on the growth of copper oxide thin films, the structural and optical properites of the copper oxide thin films are analyzed by X-ray diffraction (XRD), field-emssion scanning electron microscopy (FE-SEM), and UV-Vis spectrophotometry. At a temperature of less than $350^{\circ}C$, three-dimensional structures consisting of cube-shaped $Cu_2O$ are formed, while spherical small particles of the CuO phase are formed at a temperature higher than $400^{\circ}C$ due to a Volmer-Weber growth mode on the silicon substrate. As a chelating agent was added to the source solutions, two-dimensional $Cu_2O$ thin films are preferentially deposited at a temperature less than $300^{\circ}C$, and the CuO thin film is formed even at a temperature less than $350^{\circ}C$. Therefore the structure and crystalline phase of the copper oxide is shown to be controllable.

• 한국세라믹학회지
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• 제50권6호
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• pp.518-522
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• 2013

This study investigatesthe coloration mechanism by identifying the factor that affects thered coloration of copper red glazesin traditional Korean ceramics. The characteristics of the reduction-fired copper red glaze's sections are analyzed using an optical microscope, Raman spectroscopy, scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDX). The sections observed using an optical microscope are divided into domains of surface, red-bubble, and red band. According to the Raman micro spectroscopy analysis results, the major characteristic peak is identified as silicate in all three domains, and the intensity of $Cu_2O$ increases toward the red band. In addition, it is confirmed that the most abundant CuO exists in the glaze bubbles. Moreover, CuO and $Cu_2O$ exist as fine particles in a dispersed state in the surface domain. Thus, Cu combined with oxygen is distributed evenly throughout the copper red glaze, and $Cu_2O$ is more concentrated toward the interface between body and glaze. It is also confirmed that CuO is concentrated around the bubbles. Therefore, it is concluded that the red coloration of the copper red glaze is revealed not only through metallic Cu but also through $Cu_2O$ and CuO.

• 한국재료학회지
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• 제17권5호
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• pp.283-288
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• 2007

This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.