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http://dx.doi.org/10.3740/MRSK.2007.17.5.283

Effect of Kind and Thickness of Seed Metal on the Surface Morphology of Copper Foil  

Woo, Tae-Gyu (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
Park, Il-Song (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
Seol, Kyeong-Won (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
Publication Information
Korean Journal of Materials Research / v.17, no.5, 2007 , pp. 283-288 More about this Journal
Abstract
This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.
Keywords
Electroplating; Platinum; Palladium; Pt-Pd alloy; Surface morphology;
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