• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.7
• /
• pp.575-579
• /
• 2010

The technologies of Ni/Cu plating contact is attributed to the reduced series resistance caused by a better contact conductivity of Ni with Si and the subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading was combined with the lower resistance of a metal silicide contact and an improved conductivity of the plated deposit. This improves the FF (fill factor) as the series resistance is reduced. This is very much requried in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A Selective emitter structure with highly dopeds regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing In this paper the formation of a selective emitter, and the nickel silicide seed layer at the front side metallization of silicon cells is considered. After generating the nickel seed layer the contacts were thickened by Cu LIP (light induced plating) and by the formation of a plated Ni/Cu two step metallization on front contacts. In fabricating a Ni/Cu plating metallization cell with a selective emitter structure it has been shown that the cell efficiency can be increased by at least 0.2%.

• Applied Chemistry for Engineering
• /
• v.23 no.3
• /
• pp.313-319
• /
• 2012

In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.

• Korean Chemical Engineering Research
• /
• v.44 no.2
• /
• pp.160-165
• /
• 2006

A Pd-Cu-Ni alloyed hydrogen membrane has fabricated on porous nickel support formed by nickel powder. Porous nickel support made by sintering shows a strong resistance to hydrogen embrittlement and thermal fatigue. Plasma surface modification treatment is introduced as pre-treatment process instead of conventional HCl wet activation. Nickel was electroplated to a thickness of $2{\mu}m$ in order in to fill micropores at the nickel support surface. Palladium and copper were deposited at thicknesses of $4{\mu}m$ and $0.5{\mu}m$, respectively, on the nickel coated support by DC sputtering process. Subsequently, copper reflow at $700^{\circ}C$ was performed for an hour in $H_2$ ambient. And, as a result PdCu-Ni composite membrane has a pinhole-free and extremely dense microstructure, having a good adhesion to the porous nickel support and infinite hydrogen selectivity in $H_2/N_2$ mixtures.

• Journal of Korean Society of Environmental Engineers
• /
• v.29 no.12
• /
• pp.1381-1389
• /
• 2007

Wastewater discharged by industrial activities of metal finishing and electroplating units is often contaminated by a variety of toxic or otherwise harmful substances which have a negative effects on the water environment. The treatment method of heavy metal-cyanide complexes wastewater by alkaline chlorination have already well-known($1^{st}$ Oxidation: pH 10, reaction time 30 min, ORP 350 mV, $2^{nd}$ Oxidation: ORP 650 mV). In this case, the efficiency for the removal of ferro/ferri cyanide by this general alkaline chlorination is very high as 99%. But the permissible limit of Korean waste-water discharge couldn't be satisfied. The initial concentration of cyanide was 374 mg/L(the Korean permissible limit of cyanide is 1.0 mg/L max.). So a particular focus was given to the treatment of heavy metal-cyanide complexes wastewater by $Zn^{+2}/Fe^{+2}$ ion and coprecipitation after alkaline chlorination. And we could meet the Korean permissible limit of cyanide(the final concentration of cyanide: 0.30 mg/L) by $Zn^{+2}/Fe^{+2}$ ion and coprecipitation(reaction time: 30 min, pH: 8.0, rpm: 240). The removal of Chromium ion by reduction(pH: 2.0 max, ORP: 250 mV) and the precipitation of metal hydroxide(pH: 9.5) is treated as 99% of removal efficiency. The removal of Copper and Nickel ion has been treated by $Na_2S$ coagulation-flocculation as 99% min of the efficiency(pH: $9.09\sim10.0$, dosage of $Na_2S:0.5\sim3.0$ mol). It is important to note that the removal of ferro/ferri cyanide of heavy metal-cyanide complexes wastewater should be employed by $Zn^{+2}/Fe^{+2}$ ion and coprecipitation as well as the alkaline chlorination for the Korean permissible limit of waste-water discharge.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.36 no.3
• /
• pp.259-268
• /
• 2012

This study measured the natural-convection heat transfer of two vertically staggered cylinders with varying vertical pitch-to-diameter ($P_v$/D) and horizontal pitch-to-diameter ($P_h$/D) ratios. The measured heat-transfer rates for the lower cylinder agreed well with the existing heat-transfer correlations for a single cylinder. At the smallest $P_v$/D, the rising plume from the lower cylinder provides the upper cylinder with a preheated flow, and the heat-transfer rates of the upper cylinder decrease, but increase very sensitively with $P_h$/D. However, at the largest $P_v$/D, the velocity effect dominates, and the heat-transfer rates of the upper cylinder are larger than that of a single cylinder, and decrease less sensitively with $P_h$/D. Even if $P_h$/D is increased, the heat-transfer rate of the upper cylinder is higher than that of the lower cylinder because of the chimney and side flow effects. This work expanded the flow ranges to turbulent flows. The cupric acid-copper sulfate ($H_2SO_4-CuSO_4$) electroplating system was adopted for the measurements of the mass-transfer rates instead of the heat-transfer experiments based on the analogy concept. The measurements were made by varying $P_v$/D (1.02-5) and $P_h$/D (0-2) in both laminar and turbulent flows. The Rayleigh number ranged from $1.5{\times}10^8$ to $2.5{\times}10^{10}$, and the Prandtl number was 2,014.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.35 no.1
• /
• pp.33-42
• /
• 2011

In this study, we investigated the natural convection on the outer surface of a vertical pipe by performing mass transfer experiments using fluids with high Pr number using the concept of analogy between heat and mass transfer. A cupric acid-copper sulfate electroplating system was adopted as the mass transfer system. Tests were performed for $Ra_H$ numbers from $1.4{\times}10^9$ to $4{\times}10^{13}$, Pr numbers from 2,094 to 4,173, and diameters from 0.005 m to 0.035 m. The test results for laminar flow conditions were in good agreement with the correlations reported by King, Jakob and Linke, McAdam, and Bottemanne, and those for turbulent conditions with the correlations presented by Fouad for a vertical plate and also proved the dependence on Pr numbers. The obtained correlations were $Nu_H=0.55Ra^{0.25}_H$ for laminar and $Nu_H=0.12Ra^{0.28}_HPr^{0.1}$ for turbulent. The transition between laminar and turbulent occurs at $Ra_H$ of about $10^{12}$.

• Journal of Energy Engineering
• /
• v.21 no.1
• /
• pp.18-25
• /
• 2012

This work investigated the influence of the chimney dimensions(exit and entrance length, and diameter) on the heat transfer of a vertical cylinder in a duct. The measured mass transfer rates for the natural convection of vertical cylinder in a duct were presented for Prandlt number 2,094, Rayleigh number in the range of $4.55{\times}10^9$, $5.79{\times}10^{10}$, and $1.69{\times}10^{11}$. Experiments were performed using a copper sulfate electroplating system to simulate heat transfer based upon the analogy concept. The diameter of the duct was varied from 0.06 m to 0.14 m, and the heights from 0.30 m to 1.10 m. Nusselt numbers measured at open channel condition agreed well with the existing laminar heat transfer correlations for vertical plate developed by Le Fevre. The increase of the exit length enhanced the heat transfer up to a certain duct height but further increase does not affects the heat transfer. The heat transfer decreased with increasing the entrance length up to a certain duct height and was constant at further increase. The Nusselt number decreased with increasing the diameter of duct, until Nusselt number becomes similar to that at open channel beyond a certain diameter.

• Korean Journal of Materials Research
• /
• v.9 no.3
• /
• pp.288-294
• /
• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.