• Journal of Animal Science and Technology
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• v.63 no.6
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• pp.1386-1396
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• 2021

Copper is an essential mineral for pigs, thus it is used as a feed additive in the forms of copper sulfate. Therefore, this study aimed at characterizing the fecal microbiota shifts in pigs as fed by different forms of copper supplementation. 40 growing pigs aged 73 ± 1 days with an average weight of 30.22 ± 1.92kg were randomly divided into 5 groups. The control group (CON) fed with basal diet, while treatment groups were fed a basal diet supplemented with 100 ppm/kg of copper sulfate (CuSO₄), Cu-glycine complex (CuGly), Cu-amino acid complex (CuAA), and Cu-hydroxy(4methylthio)butanoate chelate complex (CuHMB) for 28 days of trial, respectively. The data presented the comparison between inorganic and organic copper supplementation through gut microbiota in growing pigs. Alpha and Beta diversity anaylsis resulted in copper supplementation did shifted gut microbioal community structure. At the phylum level, Firmicutes and Bacteroidetes were the most abundant phyla at all times regardless of treatment. At the genus level, the relative abundances of Prevotella, Lactobacillus, Megasphaera, and SMB53 of the CuGly and CuHMB groups were significantly higher than those of copper sulfate and basal diet groups. Overall, this study may provide the potential role of organic copper replacing inorganic copper, resulting in increased beneficial bacteria in the pig gut.

• Journal of the Korean Wood Science and Technology
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• v.30 no.2
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• pp.151-157
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• 2002

The removing copper from CCA, CCFZ treated wood were tested with Tyromyces palustris. The shacking culture, solid culture, and stationary culture methods were tested to removal of copper in CCA, CCFZ treated wood. The steam pressure method and oxalic acid method were tested as pretreatment. To investigate of copper removal mechanism, the oxalic acid that produced by T. palustris and combination with copper was examined on stationary culture that contained CCA and CCFZ treated wood chips. Oxalic acid increased copper removing rate of T. palustris as pretreatment. Stationary culture had most removal effectiveness among the culturing methods. The removal rate of copper on bioreactor was 61% on 7 days. Copper-oxalate was detected on liquid culture, which show the oxalate from liquid of culture combined with copper from treated wood. It would be related to the removal of copper from treated wood by T. palustris.

• The Journal of the Convergence on Culture Technology
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• v.9 no.6
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• pp.855-859
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• 2023

Copper oxide (CuO) nanoparticles were successfully synthesized using a precursor in which industrial starch was impregnated with an aqueous solution of copper (II) nitrate trihydrate. The microstructure of the precursor impregnated with an aqueous solution of copper nitrate trihydrate was confirmed with a scanning electron microscope (SEM), and the particle size and the crystal structure of the copper oxide particles produced as the temperature of the heat treatment of the precursor increased was analyzed by X-ray diffraction (XRD) and the scanning electron microscope (SEM). As a result of the analysis, it was confirmed that the temperature at which the organic matter of the precursor is completely thermally decomposed is 450-490℃, and that the size and crystallinity of the copper oxide particles increased as the heat treatment temperature increased. The size of the copper oxide particles obtained through heat treatment at 500-800℃ during 1 hour was 100nm~2㎛. It was confirmed that the copper oxide crystalline phase is formed at a heat treatment temperature of 400℃, and only the copper oxide single phase existed up to 800℃. And it was also confirmed that the size of particles produced increased as the calcination temperature increased.

• Applied Chemistry for Engineering
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• v.34 no.5
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• pp.479-487
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• 2023

Copper is cost-effective and abundantly available as a biocidal coating agent for a wide range of material surfaces. Natural oxidation does not compromise the efficacy of copper, allowing it to maintain antimicrobial activity under prolonged exposure conditions. Furthermore, copper compounds exhibit a broad spectrum of antimicrobial activity against pathogenic yeast, both enveloped and non-enveloped types of viruses, as well as gram-negative and gram-positive bacteria. Contact killing of copper-coated surfaces causes the denaturation of proteins and damage to the cell membrane, leading to the release of essential components such as nucleotides and cytoplasm. Additionally, redox-active copper generates reactive oxygen species (ROS), which cause permanent cell damage through enzyme deactivation and DNA destruction. Owing to its robust stability, copper has been utilized in diverse forms, such as nanoparticles, ions, composites, and alloys, resulting in the creation of various coating methods. This mini-review describes representative coating processes involving copper ions and copper oxides on various material surfaces, highlighting the antibacterial and antiviral properties associated with different oxidation states of copper.

• Analytical Science and Technology
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• v.37 no.1
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• pp.63-78
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• 2024

The continuous increasing of the global demand of copper and nickel metals raises the interest in developing alternative technologies to produce them from copper sulfide ore. Also, in line with Egypt's vision 2030 for achieving the sustainable socioeconomic development which aims at developing alternative and eco-friendly technologies for processing the Egyptian ores to produce these strategic products instead of its importing. These metals enhance the advanced electrical and electronic industries. The current work aims at investigating the recovery of copper and nickel from Abu Swayeil copper ore using pug leaching technique by sulfuric acid. The factors affecting the pug leaching process including the sulfuric acid concentration, leaching time and temperature have been investigated. The copper ore sample was characterized chemically using X-ray fluorescence (XRF) and scanning electron microscope (SEM-EDX). A response surface methodology develops a quadratic model that expects the nickel and copper leaching effectiveness as a function of three controlling factors involved in the procedure of leaching was also investigated. The obtained results showed that the maximum dissolution efficiency of Ni and Cu are 99.06 % and 95.30%, respectively which was obtained at the following conditions: 15 % H₂SO₄ acid concentration for 6 hr. at 250 ℃. The dissolution kinetics of nickel and copper that were examined according to heterogeneous model, indicated that the dissolution rates were controlled by surface chemical process during the pug leaching. The activation energy of copper and nickel dissolution were 26.79 kJ.mol^-1 and 38.078 kJ.mol^-1 respectively; and the surface chemical was proposed as the leaching rate-controlling step.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.558-565
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• 1994

The horizontal continuous casting process with the heated mold was applied to obtain the unidirectionally solidified rods($4{\sim}8mm$ dia.) of pure copper with good surface quality. The results could be summarized as follows. 1. The unidirectional solidification of pure copper rods with good surface(mirror surface) quality could be obtained by placing the S/L interface inside the heated mold cavity even though the cast copper rods were covered with thin copper oxide layer. 2. The casting speed for 4mm dia. rods with mirror surfaces was affected significantly by the mold-cooler distance rather than the cooling flow rate when other casting conditions were fixed. 3. The casting speed was the main factor affecting the oxidation of copper during the continuous casting and the thickness of copper oxide layer decreased almost linearly as the casting speed increased.

• Journal of the Korean Applied Science and Technology
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• v.26 no.1
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• pp.69-73
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• 2009

Copper alloy metal fiber was incorporated into the conventional water-soluble metal working fluids to increase the antimicrobial activity. Fluid treated by copper alloy metal fiber is shown that bacteria is disappeared whereas that untreated metal fiber is increased bacteria as increasing the life time. When the electrochemical potential of Cu/Zn ion is -268mV, radicals with molecular oxygen are easily made. Especially, hydroperoxide radical shows strong toxicity to the strains, leading to the conformational change of plasma membrane. As a result antimicrobial activity of copper alloy metal fiber in metal working fluid is superior to that of copper fiber.

• Journal of Environmental Impact Assessment
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• v.17 no.2
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• pp.143-151
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• 2008

As the NOAFL of copper based on liver toxicity in the human body is set and the TDI of copper is lower, it is necessary to strengthen the drinking water standard of copper according to toxic effects and the TDI of copper in humans. It is difficult to calculate the accurate drinking water standard because of the part of uncertainty for chronic effects of acute human with Wilson's disease and baby in the current studies. In order to improve the drinking water standard of copper considering of liver toxicity, it is desired to set the drinking water standard with concerning of the revising tendency in the foreign countries such as US, EC and WHO.

• Journal of Radiopharmaceuticals and Molecular Probes
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• v.5 no.2
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• pp.129-134
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• 2019

Over a few decades, copper radioisotopes and their chelation chemistry for radiopharmaceuticals have played crucial role in the radiopharmaceutical science area. A variety of chelators have been required for their stable targeting ability in physiological conditions. For radiolabeling with copper-64 into biomolecules, thermodynamic stability, kinetic inertness, pH stability, and redox stability should be considered. In this regard, many researchers have attempted to develop the chelators that can bind with copper more tightly, rapidly and stably for copper radiolabeling. This review discusses the chemistry of copper, its suitable chelators and characteristics, while elucidating the evaluations of each chelator for radiolabeling.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.86-86
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• 2003

Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.