• 제목/요약/키워드: contamination detection

검색결과 441건 처리시간 0.027초

이미지 인식 기반의 컵 오염 여부 측정 시스템의 설계 및 구현 (Design and Implementation of Dangerous of Image Recognition based Cup Contamination Measurement System)

  • 이태준;채희석;이상원;김재민;정회경
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2022년도 추계학술대회
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    • pp.213-215
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    • 2022
  • 최근 이미지를 처리하는 딥러닝 기술이 화재 감지나 자율주행, 불량품 검출 등에서 다양하게 활용되고 있다. 특히, 제품이 오염되었는지 아닌지를 파악하기 위해 기존 센서 데이터에서 넘어온 오염물질을 통해 파악할 수 있지만, 제품의 균열이나 오염물질 자체를 이미지로 인식하는 기술도 다양한 분야에서 활발히 연구되고 있다. 본 논문에서는 오염되지 않은 정상적인 컵과 오염된 컵을 이미지를 통해 분류하는 시스템을 설계하고 이를 구현하였다. 이미지는 오픈 이미지와 촬영한 이미지를 사용하였고, 3D 객체 인식을 위한 Google Objectron을 활용해 컵 이미지의 상단 부분을 추출하여 이미지를 분석하였다. 본 연구를 통해 위생 분야에서 필요한 제품의 오염도를 이미지 기반으로 추출할 수 있는 연구에 다각도로 활용할 것으로 사료된다.

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도심하천유역의 PCBs 농도 분포 (Concentration Distribution of Polychlorinated Biphenyls(PCBs) in Urban Watershed)

  • 김현승;김일규
    • 상하수도학회지
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    • 제26권6호
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    • pp.757-766
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    • 2012
  • In this study, we have examined concentration distribution and patterns of PCBs in waters, sediments and soils in an agricultural area of South Korea to investigate the relationship between PCBs sources and concentration levels. The concentration of PCBs in water samples were ranged from lower values below detection limit to 8.25 ug/L and the concentration of PCBs in sediment samples were ranged from lower values below detection limit to 76.67 ug/Kg. The concentration of PCBs in soil samples were ranged from lower values below detection limit to 23.51 ug/Kg. These contamination levels were far below the guideline values suggested for environmental quality assessment. The homologue patterns in samples varied from sample to sample, but isomer patterns were very similar with each other. PCB-138 and PCB-153 were predominant congeners in the soil and sediment, which were similar to the results obtained from previous studies. With these results, the assessment of potential sources of PCBs contamination in the sediments of the Nakdong river basin was performed. The principal components were extracted by Principal Component Analysis(PCA). As the result of PCA, it could be expected that PCBs in samples of this study were more affected by PCB products than combustion processes and mostly affected by already-known sources. The PCBs in the soil and sediment samples were related with commercial PCB products.

이송 중 액체오염 검출센서 개발에 관한 연구 (Study on the Sensor Development for Liquid Contamination during Delivery)

  • 정이하;김병한;홍주표
    • 반도체디스플레이기술학회지
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    • 제15권2호
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    • pp.70-73
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    • 2016
  • Previously proposed contamination detecting sensor was revisited for the investigation of the liquid tendency. Experiments revealed different output voltages for several kinds of liquid input, but showed same values for various flow rates of each liquid. The transmittance of the liquid was measured, and it is well correlated with the voltages. Linearity in values and the compensation of the sensor to sensor deviation were tried to obtain. And, long term test was performed as attached at the manufacturing equipment in the field.

지역적 이진 특징과 적응 뉴로-퍼지 기반의 솔라 웨이퍼 표면 불량 검출 (Local Binary Feature and Adaptive Neuro-Fuzzy based Defect Detection in Solar Wafer Surface)

  • 고진석;임재열
    • 반도체디스플레이기술학회지
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    • 제12권2호
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    • pp.57-61
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    • 2013
  • This paper presents adaptive neuro-fuzzy inference based defect detection method for various defect types, such as micro-crack, fingerprint and contamination, in heterogeneously textured surface of polycrystalline solar wafers. Polycrystalline solar wafer consists of various crystals so the surface of solar wafer shows heterogeneously textures. Because of this property the visual inspection of defects is very difficult. In the proposed method, we use local binary feature and fuzzy reasoning for defect detection. Experimental results show that our proposed method achieves a detection rate of 80%~100%, a missing rate of 0%~20% and an over detection (overkill) rate of 9%~21%.

플라즈마 식각에 의하여 실리콘 표면에 유기된 불순물 오염의 분석 및 제거 (Analysis and Reduction of Impurity Contamination Induced by Plasma Etching on Si Surface)

  • 조선희;이원종
    • 한국전기전자재료학회논문지
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    • 제19권12호
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    • pp.1078-1084
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    • 2006
  • Impurity contamination induced by $CF_4\;and\;HBr/Cl_2/O_2$ plasma etching on Si surface was examined by using surface spectroscopes. XPS(x-ray photoelectron spectroscopy) surface analysis showed that F of 0.4 at % exists in the surface layer in the form of Si-F bonding but Br and Cl are below the detection limit $(0.1{\sim}1.0%)$ of the spectroscope. Static-SIMS(secondary ion mass spectrometry) surface analysis showed that the etched Si surface was contaminated with etching gas elements such as H, F, Cl and Br, and they existed to the depth of about $20{\sim}40nm$. The etched Si surface was treated with three different methods that were HF dip, thermal oxidation followed by HF dip and oxygen-plasma oxidation followed by HF dip. They showed an effect in reducing the impurity contamination and the oxygen-plasma oxidation followed by HF dipping method appears to be a little bit more effective.

A Highly Sensitive Determination of Bulk Cu and Ni in Heavily Boron-doped Silicon Wafers

  • Lee, Sung-Wook;Lee, Sang-Hak;Kim, Young-Hoon;Kim, Ja-Young;Hwang, Don-Ha;Lee, Bo-Young
    • Bulletin of the Korean Chemical Society
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    • 제32권7호
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    • pp.2227-2232
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    • 2011
  • The new metrology, Advanced Poly-silicon Ultra-Trace Profiling (APUTP), was developed for measuring bulk Cu and Ni in heavily boron-doped silicon wafers. A Ni recovery yield of 98.8% and a Cu recovery yield of 96.0% were achieved by optimizing the vapor phase etching and the wafer surface scanning conditions, following capture of Cu and Ni by the poly-silicon layer. A lower limit of detection (LOD) than previous techniques could be achieved using the mixture vapor etching method. This method can be used to indicate the amount of Cu and Ni resulting from bulk contamination in heavily boron-doped silicon wafers during wafer manufacturing. It was found that a higher degree of bulk Ni contamination arose during alkaline etching of heavily boron-doped silicon wafers compared with lightly boron-doped silicon wafers. In addition, it was proven that bulk Cu contamination was easily introduced in the heavily boron-doped silicon wafer by polishing the wafer with a slurry containing Cu in the presence of amine additives.

표면방사선 오염도 측정용 자동 스미어장치의 개발 (Development of Automatic Smear Equipment for Measuring Surface Radioactivity Contamination)

  • 탁한호;강신출
    • 한국산업정보학회논문지
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    • 제16권4호
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    • pp.37-44
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    • 2011
  • 본 논문은 원자력시설내의 방사성 표면오염을 측정평가하기 위한 표변오염도 시료채취용 자동화 시료채취기 개발에 있다. 시료채취를 위한 간접법은 사람에 의한 수동적인 시료 채취방법으로서 시료를 채취하는 사람에 따라 문지르는 횟수 강도 및 면적이 다르다. 이로 인하여 표면오염도 측정치의 정확도가 저하되고 시료 채취시마다 측정치의 오차가 많이 발생한다. 개발된 장치에 의한 방법은 기존방법에 의한 표면오염도의 측정치보다 smear paper의 방사성 시료가 균일하게 채취됨을 확인하였으며, 향후 표면오염도의 평가시 측정자료의 일관성을 확보하게 되었다.

Detection Limit of a NaI(Tl) Survey Meter to Measure 131I Accumulation in Thyroid Glands of Children after a Nuclear Power Plant Accident

  • Takahiro Kitajima;Michiaki Kai
    • Journal of Radiation Protection and Research
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    • 제48권3호
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    • pp.131-143
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    • 2023
  • Background: This study examined the detection limit of thyroid screening monitoring conducted at the time of the Fukushima Daiichi Nuclear Power Plant (FDNPP) accident in 2011 using a Monte Carlo simulation. Materials and Methods: We calculated the detection limit of a NaI(Tl) survey meter to measure 131I accumulation in the thyroid gland of children. Mathematical phantoms of 1- and 5-year-old children were developed in the simulation of the Particle and Heavy Ion Transport code System code. Contamination of the body surface with eight radionuclides found after the FDNPP accident was assumed to have been deposited on the neck and shoulder area. Results and Discussion: The detection limit was calculated as a function of ambient dose rate. In the case of 40 Bq/cm2 contamination on the body surface of the neck, the present simulations showed that residual thyroid radioactivity corresponding to thyroid dose of 100 mSv can be detected within 21 days after intake at the ambient dose rate of 0.2 µSv/hr and within 11 days in the case of 2.0 µSv/hr. When a time constant of 10 seconds was used at the dose rate of 0.2 µSv/hr, the estimated survey meter output error was 5%. Evaluation of the effect of individual differences in the location of the thyroid gland confirmed that the measured value would decrease by approximately 6% for a height difference of ±1 cm and increase by approximately 65% for a depth of 1 cm. Conclusion: In the event of a nuclear disaster, simple measurements carried out using a NaI(Tl) scintillation survey meter remain effective for assessing 131I intake. However, it should be noted that the presence of short-half-life radioactive materials on the body surface affects the detection limit.

Current advances in detection of abnormal egg: a review

  • Jun-Hwi, So;Sung Yong, Joe;Seon Ho, Hwang;Soon Jung, Hong;Seung Hyun, Lee
    • Journal of Animal Science and Technology
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    • 제64권5호
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    • pp.813-829
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    • 2022
  • Internal and external defects of eggs should be detected to prevent cross-contamination of intact eggs by abnormal eggs during storage. Emerging detection technologies for abnormal eggs were introduced as an alternative to human inspection. The advanced technologies could rapidly detect abnormal eggs. Abnormal egg detection technologies using acoustic response, machine vision, and spectroscopy have been commercialized in the poultry industry. Non-destructive egg quality assessment methods meanwhile could preserve the value of eggs and improve detection efficiency. In order to improve detection efficiency, it is essential to select a proper algorithm for classifying the types of abnormal eggs. This review deals with the performance of the detection technologies for various types of abnormal eggs in recently published resources. In addition, the discriminant methods and detection algorithms of abnormal eggs reported in the published literature were investigated. Although the majority of the studies were conducted on a laboratory scale, the developed detection technologies for internal and external defects in eggs were technically feasible to obtain the excellent detection accuracy. To apply the developed detection technologies to the poultry industry, it is necessary to achieve the detection rates required from the industry.