This research uses coolhunting to predict the future trend of e-Commerce industry. Coolhunting is a method to take Cool Trends which are the future trend through social network analysis for discovering the trendsetter and its collective intelligence. Coolhunting is generally carried out by social network analysis while this research uses NodeXL of social network analysis tools. We designed industrial network research model for relation among e-Commerce corporation, product, the types of customer service and customer service employee to discover the Cool Trends of e-Commerce industry. According to the result of this research, e-Commerce industrial network was being changed from chaos to collective intelligence form. As a analysis result for network influences, we found that Cool Trends of e-Commerce industry invigorate social commerce industry through the collective intelligence focusing intelligence VIP, Excellence, grade of Administrating for women customers(trendsetter) and it promotes semantic consumption from customers and purchasing power will be concentrated on cosmetic, beauty, perfume product categories in social commerce. We propose the strategic direction for e-Commerce corporation and hope that domestic e-Commerce corporation continues to grow and high-quality services are provided for customers.
Lee, Sang Baek;Hung, Trinhquang;Jo, Jin Oh;Jung, Jun Bum;Im, Tae Heon;Mok, Young Sun
Applied Chemistry for Engineering
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v.25
no.2
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pp.174-180
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2014
A plasma hydrophobic coating on commercial fish feed was conducted to prolong the floating time of feed, thereby enhancing the feed consumption rate and reducing the contamination of water in fish farms. The hydrophobic coating on the fish feed was prepared using an atmospheric-pressure dielectric barrier discharge (DBD) plasma with hexamethyldisiloxane (HMDSO), toluene and n-hexane as the precursors. The effect of the parameters such as input power, precursor type and coating time on the coating performance were examined. The physicochemical properties of the coating layer were analyzed using a Fourier transform infrared (FTIR) spectrometer and a contact angle (CA) analyzer. The water CA increased after the coating preparation, indicating that the surface changed from hydrophilic to hydrophobic. The FTIR characterization revealed that the hydrophobic layer was comprised of functional groups such as $CH_3$, Si-O-Si and Si-C. As a result of the hydrophobic coating, the floating time of the fish feed increased from several seconds to 3 minutes, which suggested that the plasma coating method could be a viable means for practical applications. Compared to the water CA measured as soon as the coating layer was prepared, the 6-day aged sample exhibited a substantial CA increase, confirming the aging effect on the improvement of the hydrophobicity.
PURPOSES : The use of environmentally friendly construction methods has been recently encouraged to reduce fuel consumption and the effects of global warming. For this purpose, the roller compacted concrete pavement (RCCP) construction method has been developed. RCCP is more environmentally friendly and economically efficient than general concrete by reducing the amount of CO2 generated through the application of a smaller amount of cement. RCCP has a number of advantages such as an easy construction method, low cost, high structural hydration performance, and aggregate interlocking. However, mix design standards and construction guidelines of RCCP are required for domestic application. In addition, a study on aggregate selection, which has an effect on the characteristics of RCCP, is necessary owing to a limited number of researches. Thus, the aggregate effect on the performance of RCCP in securing the required strength and workability was evaluated in consideration of domestic construction. METHODS : Sand and coarse aggregates of both 19mm and 13mm in maximum size were used in this study. Four types of aggregate gradations (s/a = 30%, 58%, and 70% for the sand and coarse aggregate of 19mm in maximum size, and s/a = 50% for a combination of the three types of aggregates) were set up to investigate the effects of the PCA band on the RCC characteristics. The conditions of s/a = 30% and 70% were evaluated to check the gradation effect outside of the recommended band. The conditions of s/a = 58% and 50% were used because they are the optimum combination of the two and three types of aggregates, respectively. RCCP gradation band was suggested gradation with a proper construction method of RCCP by synthetically comparing and analyzing the correlation of optimum water content, maximum dry density, and strength of requirements through its consistency and compaction test. RESULTS : The lower and upper limit lines are insufficient to secure a relatively strong development and workability compared to an aggregate gradation in the RCCP gradation band region. On the other hand, the line in the RCCP gradation band and the 0.45 power curve in the RCCP gradation band region were satisfactory, ensuring the required strength and workability. CONCLUSIONS : The suitable aggregate gradation on RCCP process should meet the RCCP gradation band area; however, fine particles passing through a #60 sieve do not need to be within the recommended gradation band because the influence of this region on such fine particles is small.
In order to overcome these disadvantages, the halogen light source, which was previously used as a vehicle fog light, has increased power consumption and a short lifetime, and thus, an automobile light source is gradually being replaced with an LED. However, when the vehicle LED fog light is turned on, there is a disadvantage in reducing the life of the fog lamp due to the high heat generated from the LED. The heat generated by the LED inside the fog lamp is mainly emitted by the heatsink, but most of the remaining heat is released to the outside through convection. When cooling efficiency decreases due to convection, thermal energy generates heat to lenses, reflectors, and bezels, which are the main parts of lamps, or generates high temperatures in LED, thereby shortening the life of LED fog lights. In this study, we tried to improve the heat dissipation performance by convection in addition to the heat dissipation method by heat sink, and to determine the installation location of vents that can discharge the internal air or intake the external air of LED fog lamp for vehicle. Thermal fluid analysis was performed to ensure that the optimal data were reflected in the design. The average velocity of air increased in the order of Case3 and Case2 compared to Case1, which is the existing prototype, and the increase rate of Case3 was relatively higher than that of other cases. This is because the vents installed above and below the fog lamps induce the convective phenomena generated according to the temperature difference, and the heat is efficiently discharged with the increase of the air speed.
The location-based service is emerging again to the public attention. The location recognition environment up-to-now has been studied with its focus only on a person, an object or a moving object. However, this study proposes a location recognition model that serves to recognize and track, in real time, multiple passengers in a moving vehicle. Identifying the locations of passengers can be classified into two classes: one is to use the high price terminal with GPS function, and the other is to use the economic price compact terminal without GPS function. Our model enables the simple compact terminal to provide effective location recognition under the on-boarding situation by transmitting messages through an interface device and sensor networks for a vehicle equipped with GPS. This technology reduces transmission traffic after detecting the condition of a vehicle (being parked or running), because it does not require transmission/receiving of information on the locations of passengers who are confined in a vehicle when the vehicle is running. Also it extends battery life by saving power consumption of the compact terminal. Hence, we carried out experiments to verify its serviceability by materializing the efficient tracking system for passengers with the detection algorithm of a stopping vehicle proposed in this study. Moreover, about 200 experiments using the system designed with this technology proved successful recognition on on-boarding and alighting of passengers with the maximum transmission distance of 12 km. In addition to this, the running recognition tests showed the test with the detection algorithm of a stopping vehicle has reduced transmission traffic by 41.6% compared to the algorithm without our model.
Journal of the Korea Academia-Industrial cooperation Society
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v.16
no.8
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pp.5541-5549
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2015
This paper introduces a safer and more power efficient heater by using induction heating, to apply to the semiconductor wafer fabrication exhaust gas cleaning system. The exhaust gas cleaning system is currently made with filament heater that generates an endothermic reaction of N2 gas for the removal of moisture. Induction theory, through the bases of theoretical optimization and electronic implementation, is applied in the design of the induction heater specifically for the semiconductor wafer exhaust system. The new induction heating design provides a solution to the issues with the current energy inefficient, unreliable, and unsafe design. A robust and calibrated design of the induction heater is used to optimize the energy consumption. Optimization is based on the calibrated ZVS induction circuit design specified by the resonant frequency of the exhaust pipe. The fail-safe energy limiter embedded in the system uses a voltage regulator through the feedback of the MOSFET control, which allows the system performance to operate within the specification of the N2 Heater unit. A specification and performance comparison from current conventional filament heater is made with the calibrated induction heater design for numerical analysis and the proof of a better design.
Kim, Yu-Jeong;Lee, Jin-Hyeon;Park, Gi-Mun;Yu, Bong-Yeong
Proceedings of the Korean Institute of Surface Engineering Conference
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2018.06a
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pp.140-140
/
2018
The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.
The Holter monitoring system is a widely used noninvasive diagnostic tool for ambulatory patient who may be at risk from latent life-threatening cardiac abnormalities. In this paper, we design a high performance intelligent holter monitoring system which is characterized by the small-sized and the low-power consumption. The system hardware consists of one-chip microcontroller(68HC11E9), ECG preprocessing circuit, and flash memory card. ECG preprocessing circuit is made of ECG preamplifier with gain of 250, 500 and 1000, the bandpass filter with bandwidth of 0.05-100Hz, the auto-balancing circuit and the saturation-calibrating circuit to eliminate baseline wandering, ECG signal sampled at 240 samples/sec is converted to the digital signal. We use a linear recursive filter and preprocessing algorithm to detect the ECG parameters which are QRS complex, and Q-R-T points, ST-level, HR, QT interval. The long-term acquired ECG signals and diagnostic parameters are compressed by the MFan(Modified Fan) and the delta modulation method. To easily interface with the PC based analyzer program which is operated in DOS and Windows, the compressed data, that are compatible to FFS(flash file system) format, are stored at the flash memory card with SBF(symmetric block format).
Kim, Sang-Hun;Hong, Sang-Geun;Lee, Han-Yeol;Park, Won-Ki;Lee, Wang-Yong;Lee, Sung-Chul;Jang, Young-Chan
Journal of the Korea Institute of Information and Communication Engineering
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v.16
no.9
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pp.1847-1855
/
2012
A 1V 1.6-GS/s 6-bit flash analog-to-digital converter (ADC) with a clock calibration circuit is proposed. A single track/hold circuit with a bootstrapped analog switch is used as an input stage with a supply voltage of 1V for the high speed operation. Two preamplifier-arrays and each comparator composed of two-stage are implemented for the reduction of analog noises and high speed operation. The clock calibration circuit in the proposed flash ADC improves the dynamic performance of the entire flash ADC by optimizing the duty cycle and phase of the clock. It adjusts the reset and evaluation time of the clock for the comparator by controlling the duty cycle of the clock. The proposed 1.6-GS/s 6-bit flash ADC is fabricated in a 1V 90nm 1-poly 9-metal CMOS process. The measured SNDR is 32.8 dB for a 800 MHz analog input signal. The measured DNL and INL are +0.38/-0.37 LSB, +0.64/-0.64 LSB, respectively. The power consumption and chip area are $800{\times}500{\mu}m2$ and 193.02mW.
A micro-gas sensor with heater and sensing electrode on the same plane was fabricated on phosphosilicate glass(PSG, 800nm)/$Si_3N_4$ (150nm) dielectric membrane. PSG film was provided by atmospheric pressure chemical vapor deposition(APCVD), and $Si_3N_4$ film by low pressure chemical vapor deposition (LPCVD). Total area of the fabricated device was $3.78{\times}3.78mm^2$. The area of diaphragm was $1.5{\times}1.5mm^2$, and that of the sensing layer was $0.24{\times}0.24mm^2$. Finite-element simulation was employed to estimate temperature distribution for a square-shaped diaphragm. The power consumption of Pt heater was about 85mW at $350^{\circ}C$. Tin thin films were deposited on the silicon substrate by thermal evaporation at room temperature and $232^{\circ}C$, and tin oxide films($SnO_2$) were prepared by thermal oxidation of the metallic tin films at $650^{\circ}C$ for 3 hours in oxygen ambient. The film analyses were carried out by SEM and XRD techniques. Effects of humidity and ambient temperature on the resistance of the sensing layer were found to be negligible. The fabricated micro-gas sensor exhibited high sensitivity to butane gas.
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