• Journal of Welding and Joining
• /
• v.5 no.3
• /
• pp.38-45
• /
• 1987

An investigation was conducted to find out the factors influencing on the impact toughness of austenitic-and duplex stainless steel weld metal. Various welding process with commerically available consumables was adopted to get weld doposited metal. The oxygen content of each weld metal was very sensitiive to welding process, involving flux composition, shielding gas and structural features. The results of this study show tat the content of oxygen as an oxide inclusion significantly affects impact toughness, and .delta.-ferrite distribution is also correlated with resultant toughness value.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.33 no.3
• /
• pp.280-283
• /
• 2023

Objectives: The purpose of this study was to examine the change in exposure concentration in the cleaning process after installing a local exhaust system. Methods: Dichloromethane measurement was conducted according to the KOSHA Guide (A-19-2019). Results: After the local exhaust device was installed, a total of three measurements were conducted, including temporary work environment measurements, and all of the measurements did not exceed the DCM exposure standard, but were more than 50% of the DCM Time Weighted Average((8-TWA) Conclusions: It is thought that the local ventilation system of a small business needs not only support for the initial installation cost, but also educational support for maintaining the performance of the local ventilation system and support for consumables (adsorbents, filters, etc.) that incur periodic costs.

• Journal of Advanced Marine Engineering and Technology
• /
• v.30 no.1
• /
• pp.81-87
• /
• 2006

In marine air pollution control, SCR (Selective Catalytic Reduction) is reconized as the most effect method to control NOx, but on the other hand. seawater scrubber applying the basic characteristic that is naturally alkaline (pH typically around 8.1) is viewed as an economical SOx removal system at present. Especially, seawater scrubber would not be necessary to follow any of the various land based flue gas desulfurization methods. i.e. wet, dry or alkali scrubbing. However, these methods are not readily adaptable to marine conditions due to the quantifies of consumables required i.e. lime or limestone, the means of operation and the commercial availability. This research is undertaken to develop a new method as the main target of eliminating all exhaust emissions, particularly vessel, because of easy access to seawater and apt to apply a wet scrubber system. First, using the acidic seawater by seawater electrolysis, nitric monoxide(NO) is adequately oxidized to nitric dioxide $(NO_2)$by ClOx-in the acidic seawater, the electrolyzed alkaline seawater by electrolysis which contains mainly NaOH together with alkali metal ions $(i.e\;Na^{+}\;K^{+},\;Mg_{2}\;^{+},\;Ca_{2}\;^{+})$, is used as the absorption medium of NOx, the SOx are absorbed by relatively high solubility compared to other components of exhaust pollutants. The results found that the NOx and SOx removals could be achieved nearly Perfect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.380-381
• /
• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Journal of Welding and Joining
• /
• v.8 no.4
• /
• pp.35-45
• /
• 1990

Casting are widely used nodays as complicated and diversified forming materials due to its superior castability. However the welding of cast iron has not been accompaniced satisfactory resulting in an microstructure change happened in the heat affected zone (HAZ), especially the graphite are formed and shaped consecutively in the area and it has great impact on the crack occuring and growth together with martensite forming in this area. It case of gray cast iron welding, it is required for pre-heat treatment or specific welding consumables to restrain forming the martensite in the HAZ. In this study, by applying the plasma surface overlaid welding. Fe-Mn-Al steel powder has been used for improvement of anti-crackability in the HAZ and much attention has been paid to establish the overlaid welding method for gray cast iron so that optimum welding conditions may prevent the cracking. With our experiments, we have found that to prevent defects which may occur in the HAZ, the overlaid welding technique for gray cast iron has been developed.

• Journal of the Korea Safety Management & Science
• /
• v.16 no.3
• /
• pp.55-62
• /
• 2014

During five years (Year 2009~2013), Total victims of 72 %(81,560 people) and those 50.6 %(1,258 people) of death accident occurs in small scale construction site which operate 2 million USD less construction budget. Especially, falling death accident account for 785 people, in the share of 33.2 %(261 people) death disaster takes due to defect of original cause materials. The major safety issues in small scale work place take place while scaffold installation, disassembling, work-plate improper installation or non-professional skills of workers. Furthermore, labor subcontract systems make small construction site shortage of resources. Those workers regard work-plate as unnecessary and consumables supplies. Because of that most of workers use unsafe workplace in most construction site. Therefore, in order to prevent falling accident occurring in small scale work site, government should organize related regulations such as "Work site safety construction method" and then expands education support, financial aid, and sourcing safety supplies for work plate which offer broad variety experiences. Also, introduce certificate solutions for various work plates to improve safety function such as anchoring type method and anti sliding function.

• Tribology and Lubricants
• /
• v.34 no.3
• /
• pp.115-122
• /
• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.3
• /
• pp.203-207
• /
• 2008

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.55 no.3
• /
• pp.116-121
• /
• 2006

Most high-k materials are well known not to be etched easily, Some problems such as low etch rate poor sidewall angle, plasma damage, and process complexity were emerged from the high-density DRAM fabrication. Chemical mechanical polishing (CMP) by a damascene process was proposed to pattern this high-k material was polished with some commercial silica slurry as a function of pH variation. Sufficient removal rate with adequate selectivity to realize the pattern mask of tera-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible. The planarization was also achieved for the subsequent multi-level processes. Our new CMP approach will provide a guideline for effective patterning of high-k material by CMP technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.356-357
• /
• 2005

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials at their surfaces. Especially, polishing pad is considered as one of the most important consumables because of its properties. Subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure pad. Microstructure pad is designed to have uniform structure on its surface and fabricated by micro-molding technology. And then STI CMP performances such as oxide dishing and nitride corner rounding are evaluated.