Chemical Mechanical Polishing Characteristics of BTO Thin Film for Vertical Sidewall Patterning of High-Density Memory Capacitor
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Ko, Pil-Ju
(조선대학교 전기공학과)
Park, Sung-Woo (대불대학교 전기전자공학과) Lee, Kang-Yeon (조선대학교 전기공학과) Lee, Woo-Sun (조선대학교 전기공학과) Seo, Yong-Jin (대불대학교) |
1 | I. Kim, K. Murella, and J. Schlueter, 'A detailed look at oxide CMP pad-to-pad consistency', Proceedings of the 2nd International CMP-MIC Conference, p. 335, 1997 |
2 | P. Vitanov, A. Harizanova, T. Ivannova, D. Velkov, Zd. Raytcheva, 'Deposition, structure evolution and dielecrtrc properties of BaTiO3 and BaxSrl-xTiO3 thin films prepared by the sol-gel method. ', Vacuum, vol 69, issues 1-3, pp 371-377, December, 2002 DOI ScienceOn |
3 | Y. Igarashi, K. Tani, M. Kasai, K. Ashikaga, 'Submicron Ferroelectric Capacitors Fabricated by Chemical Mechanical Polishing for High-Density Ferroelectric Memories', T. Tto, Jpn, J. Appl. phys. 39, p 1083, 2000 DOI |
4 |
Yong-Jin Seo and Woo-Sun Lee, 'Chemical mechanical polishing of |
5 | Yong-Jin Seo, Woo-Sun Lee, Jin-Seong Park and Sang-Yong Kim, 'Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry', Japanese Journal of Applied Physics, Vol. 42, No. 10, p. 6396, 2003 DOI |
6 | Y. Morand, Microelectron. Eng. 50 (2000) 391 DOI ScienceOn |
7 | Y. Xu, G. Huang, H.Long, Mater. Lett. 57 (2003) 3570 DOI ScienceOn |
8 | C. S. Hwang, S. O. Park, C. S. Kang, H. J. Cho, H. K. Kang, S. T. Ahn, M. Y. Lee, J. Appl. Phys. 34 (1995) 5178 DOI |
9 | J. M. Steigerwald, S. P. Murarka, and R. J. Gutman, 'Chemical Mechanical Planarization of Microelectronic Materials', John Wiley & Sons, p. 40, 1997 |
10 | M. R. Oliver, 'Chemical-Mechanical Planarization of Semiconductor Materials', Springer-Verlag, p. 239, 2004 |
11 |
Weidan Li, Dong Wook Shin, Minoru Tomozawa, Shyam p.Murarka, 'The effect of the polishing pad treatments on the chemical-mechanical polishing of |
12 | Yong-Jin Seo, Sang-Yong Kim, Yeon-Ok Choi, Yong-Taek Oh and Woo-Sun Lee, 'Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density', Materials Letters, Vol. 58, Issue 15, p. 2091, 2004 DOI ScienceOn |
13 | Woo-Sun Lee, Sang-Youg Kim, Youg-Jin Seo, Jong-Kook Lee, 'An Optimization of Tungsten Plug Chemical Mechanical Polishing (CMP) using Different Consumables', Journal of Materials Science Materials in Electronics, Vol. 12, No.1, p. 63, 2001 DOI ScienceOn |
14 | G. B. Basim, J. J. Adler, U. Mahajan, R. K. Singh, and B. M. Moudgil, 'Effect of particle size of chemical mechanical polishing with minimal defects', J. Electrochem. Soc., Vol. 147, Iss. 9, p. 3523, 2000 DOI ScienceOn |
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