• 제목/요약/키워드: complexing agent

검색결과 96건 처리시간 0.022초

금속알콕사이드와 Diethanolamine 착체를 이용한 $PbTiO_3$ 박막 제조 (Preparation of $PbTiO_3$ Thin Films using Metal Alkoxide and Diethanolamine Complexing Agent)

  • 김승현;한현규;오영제;김창은
    • 한국세라믹학회지
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    • 제31권5호
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    • pp.499-504
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    • 1994
  • PbTiO3 thin films were prepared by sol-gel spin coating method using metal alkoxide and diethanolamine (DEA). The precipitation of the PbTiO3 sol occurred at pH 7.3 with HNO3 addition, regardless of the amount of DEA. The gelation time of the PbTiO3 sol was reduced with increasing amount of HNO3 and/or water. When the PbTiO3 films prepared by 0.2 molar coating solution were annealed at $650^{\circ}C$ for 30 min, dense and single phase perovskite films were obtained. Dielectric constant and loss tangent of the film were 239 and 0.01 at 1 kHz, respectively.

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황산크롬(III) 착화합물 수용액으로부터의 크롬전착 (Electrodeposition of Chromium from Chromiun(III) Sulfate Complexes in Aqueous Solutions)

  • 고석수;송진태
    • 한국표면공학회지
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    • 제21권4호
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    • pp.149-159
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    • 1988
  • Electrodeposition of chromium from low concentration chromjum (III) sulfate complexess in aqueous using sodium formate-glycine mixtures as a complexing agent was studied. In the bath formation, it is found that the optimum again temperature and time for equilibration of the electrolytes are nrcessary for 24 hrs at 45$^{\circ}C$and the optimum elecrical charge for low current electrolysis which might be produced Cr(II) ions in the electrolytes is necessary for minum 2Ah/$\ell$. The optmun concentration off standard electrolyte for main composition is 0.05M chromium(III) sulfate, 0.2M sodium formate-0.2M glycine, and I mMNaSCN as a catalysea, respectivwly. The standard electrolyte is shows good covering, good throwing power, and 6% of current efficiency (Cr(III)basis). The oppearance of electrodeposits shows att active bright chromium. The SEM morphology of the chromjum coating is observed as smooth surfaces and dispersed micro prcro pores. X-ray diffraction analysis shows a bcc structure which the perferred orintation of the chromium electrodeposits is strongin(200)plane.

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황산크륨(III) 착화합물 스용액으로부터의 크롬전착반응의 전기화학적 거동 (Electrochemical Behaviors of Chromium Electrodeposition from Chromium(III) Sulfate complexes Aqueous Solutions)

  • 고석수;송진태
    • 한국표면공학회지
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    • 제21권4호
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    • pp.160-167
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    • 1988
  • Electrochemical behaviors od chromium electrodeposition from 0.05M chromium (III) sulface complexes in aqueous solutions using sodium formate-glycine mixtures as a complexing agent were studied. In the cathodic current-potential cures, it is found that the intial limiting current of Cr(III) is proportional to square root of scan rate and activiation energy from Arrhenius plot is s obtained 3.05Kcal/mol. From this results, the reaction is considered, Cr3++e longrightarrow Cr2+, which is controlled diffusion of Cr (III). It is also found that the chromium is deposited when the potential reaches to hydrogen evolution potential. Effects of NaSCN as a catalyser in the electrolyte were investigated NCS- anion seems to react strongly by specific absorption at the inner HelmholtZ layer, so that, it is considered to suppress the electrodeposition reaction reaction for chromjum, and also it is considered multipe-bridge such as Cr(III)-NCS---M(M;cathode).

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NiW 기능성 합금도금을 위한 전해 (Electrolysis for NiW Functional Alloy Plating)

  • 정구진;이철경
    • 한국표면공학회지
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    • 제44권1호
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    • pp.1-6
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    • 2011
  • A NiW functional alloy plating was investigated as variables of metal ion concentration, complexing agent, temperature, pH and applied current density. Even if numerous studies on reaction mechanism of NiW induced codeposition were carried out during couples of decade, it has not been acceptable reaction mechanism. This study was focused on the effect of the plating variables on the alloy composition in the NiW alloy plating. Applied current density could control mainly the alloy composition rather than other plating variables. It has also been confirmed that the functional alloy plating such as layered or gradient plating was possible by controlling applied current density.

무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화 (Electroless Ni-P layer Characteristics in accordance with the plating process conditions)

  • 이홍기;전준미;박해덕
    • 한국표면공학회지
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    • 제36권3호
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    • pp.263-271
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    • 2003
  • Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

Organic Precipitate Flotation of Trace Metallic Elements with Ammonium Pyrrolidinedithiocarbamate (II). Application of Solvent Sublation for Determination of Trace Cd, Co, Cu and Ni in Water Samples

  • 김영상;정용준;최희선
    • Bulletin of the Korean Chemical Society
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    • 제19권1호
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    • pp.50-56
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    • 1998
  • A solvent sublation was studied for the determination of trace Cd, Co, Cu and Ni in water samples. Ammonium pyrrolidine dithiocarbamate (APDC) was used as a complexing agent. Experimental conditions such as pH of solution, amounts of APDC, the type and amount of surfactant, the type of solvent, etc. were optimized for the effective sublation of analytes. After metal-PDC complexes were formed in sample solutions of pH 2.5, the precipitate-type complexes were floated in a flotation cell with an aid of sodium lauryl sulfate as a surfactant and by bubbling with nitrogen gas. The precipitates were dissolved and separated into the surface layer of methyl iso-butyl ketone (MIBK). The analytes preconcentrated were determined by a graphite furnace atomic absorption spectrophotometry (GF-AAS). Extractability of each element was 88% for Cd(Ⅱ), 86% for Co(Ⅱ), 95% for Cu(Ⅱ) and 76% for Ni(Ⅱ), respectively. And this procedure was applied to the analysis of real samples. From the recoveries of more than 92%, it was concluded that this method could be simple and applicable for the determination of trace elements in various water samples of a large volume.

호스트-게스트의 입체선택적 착물형성에 의한 메틸아닐리늄 이온 혼합물의 전기화학적 분석 (Electrochemical Determinations of Methylanilinium Ion Mixtures by the Stereoselective Complexations of Host-Guest)

  • 정종화;장덕진;이부영;서무룡;김재상;이심성
    • 분석과학
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    • 제5권3호
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    • pp.239-247
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    • 1992
  • 메틸기가 한 개 또는 두 개 치환된 10가지 메틸아닐리늄 이온과 18-크라운-6와의 착물 형성 및 선택성을 메탄올에서 적하수은 전극에 의해 조사하였다. 메틸아닐리늄 이온과 18-크라운-6와의 착물의 안정도 상수는 메틸기의 위치와 개수에 따른 입체장애 효과에 의해 큰 차이를 나타내었다. 또한 반파전위의 차가 매우 작아 일반적인 방법으로는 분석이 불가능한 메틸아닐리늄 이성질체 혼합물 등에 보조 착화제로 18-크라운-6를 첨가하여 입체장애에 의한 착물반응의 선택성을 이용하여 분석을 시도하였다. 그 결과 18-크라운-6와 두 게스트 이온의 안정도 상수의 차, ${\Delta}log\;K$가 대략 0.7~1.3인 경우 이성분 혼합물의 확인이 정성적으로 가능하였으며, 1.6 이상인 경우에는 정량적인 개별분석도 가능하였다. 이는 18-크라운-6가 아닐리늄의 메틸치환기의 위치에 따라 입체장애의 정도를 선별적으로 인식하여 큰 착물형성 선택성을 나타낸 결과로 각 환원파의 음전위 이동 정도가 크게 달라지기 때문이다.

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The Reduction of Np(VI) by Acetohydroxamic Acid in Nitric Acid Solution

  • Chung, Dong-Yong;Lee, Eil-Hee
    • Bulletin of the Korean Chemical Society
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    • 제26권11호
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    • pp.1692-1694
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    • 2005
  • Spent nuclear fuel is reprocessed commercially by the chemical process to recover U and Pu. Recently, new salt-free reagents to separate plutonium and neptunium from uranium suitable for use in a single cycle flowsheet have been developed. Acetohydroxamic acid $(CH_3CONHOH)$ has been taken much interest in as a complexing agent capable of selective stripping of tetravalent actinides from U(VI) when actinides are present in the solvent stream of the advanced PUREX process. Additionally acetohydroxamic acid will rapidly reduce Np(VI) to inextractable Np(V) thus allowing the separation of Np from U. In this study, the rate equation for the reduction of Np(VI) to Np(V) in nitric acid aqueous solution has been determined as: $-[NpO_2^{2+}]$/dt = $k[NpO_2^{2+}]$[AHA] with k = 191.2 ${\pm}$ 11.2 $M^{-1}s^{-1}$ at 25 ${\pm}$ 0.5 ${^{\circ}C}$ and $[HNO_3]$ = 1.0 M. Comparison with other reductants available in the literature, acetohydroxamic acid is a strong one for $NpO_2^{2+}$.

Cu CMP에서의 연마 균일성에 관한 기계적 해석 (Mechanical Analysis on Uniformity in Copper Chemical Mechanical Planarization)

  • 이현섭;박범영;정해도;김형재
    • 한국전기전자재료학회논문지
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    • 제20권1호
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    • pp.74-79
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    • 2007
  • Most studies on copper Chemical Mechanical Planarization (CMP) have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to various factors related to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate and mechanically analyze the roles of slurry components in the formation of the uniformity in Cu CMP. In this paper, Cu CMP was performed using citric acid($C_{6}H_{8}O_{7}$), hydrogen peroxide($H_{2}O_{2}$), colloidal silica, and benzotriazole($BTA,\;C_{6}H_{4}N_{3}H$) as a complexing agent, an oxidizer, an abrasive, and a corrosion inhibitor, respectively. All the results of this study showed that within-wafer non-uniformity(WIWNU) of Cu CMP could be controlled by the contents of slurry components.