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Electroless Ni-P layer Characteristics in accordance with the plating process conditions  

Lee Hong-Kee (Korea Institute Of Industrial Technology)
Jeon Jun-Mi (Korea Institute Of Industrial Technology)
Park Hae-Duck (Hae Song P&C)
Publication Information
Journal of the Korean institute of surface engineering / v.36, no.3, 2003 , pp. 263-271 More about this Journal
Abstract
Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.
Keywords
Electroless Ni-P; Hypophosphite; Plating conditions; Metal turnover;
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Times Cited By KSCI : 1  (Citation Analysis)
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