• Journal of Electrochemical Science and Technology
• /
• v.9 no.4
• /
• pp.308-319
• /
• 2018

Single step electrodeposition of $Cu_2ZnSnS_4$ (CZTS) for solar cell applications was studied using an aqueous thiocyanate based electrolyte. The sodium thiocyanate complexing agent was found to decrease the difference in the deposition potential of the elements. X-ray diffraction analysis of the samples indicates the formation of kesterite phase CZTS. UV-vis studies reveal the band gap of the deposits to be in the range of 1.2 - 1.5 eV. The thickness of the deposit was found to decrease with increase in pH of the electrolyte. Nearly stoichiometric composition was obtained for CZTS films coated at pH 2 and 2.5. I-V characterization of the film with indium tin oxide (ITO) substrate in the presence and the absence of light source indicate that the resistance decrease significantly in the presence of light indicating suitability of the deposits for solar cell applications. Results of electrochemical impedance spectroscopic studies reveal that the cathodic process for sulfur reduction is the slowest among all the elements.

• Journal of the Korean institute of surface engineering
• /
• v.22 no.2
• /
• pp.101-108
• /
• 1989

Effects of Na+ ion on zeta potential of SiC and Al2O3 particles suspended in nikel sufate and nickel chloride solutions were investigated. various complexing agents for Ni2+ ion were added to electroless Ni composite bath and the effects of the complexing agents on zeta potential and codeposition of the particles from the baths were studied. It was confirmed that Na+ ion was absorbed on the particles bringing about the positive surface charge and thus they promoted the entrapment of the particles into the nickel deposit. On the basis of these results it was possible to deposit SiCc particle in nickel chloride electrolyte containing complex agent such as trisodium citrate+sodium succinate.

• 한국가스학회:학술대회논문집
• /
• 2002.05a
• /
• pp.127-132
• /
• 2002

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.11a
• /
• pp.196-197
• /
• 2015

ZnSe의 전기화학적 거동은 각각 다른 pH를 갖는 전해질에서의 linear sweep voltammogram 분석에 의해 체계적으로 고찰되었다. 제어된 조성을 갖는 칼코지나이드 ZnSe 박막이 complexing agent의 역할을 하는 citrate를 포함한 알카리 용액에서 전해 증착되었다. 다른 pH의 전해질에서 증착된 ZnSe 박막의 형상을 분석하고, 추가적으로 다른 pH의 전해질 및 어닐링 온도 변화에 따른 ZnSe 박막의 XRD분석이 이루어졌다.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.2
• /
• pp.100-108
• /
• 1996

The internal stress of acidic electroless nickel deposits on zincated aluminum was determined by spiral contractometer. Several plating conditions such as inhibitor and complexing agent concentrations and pH affecting the internal stress were studied. The resulting intrinsic stress contribution to the total stress was discussed in terms of phosphorous content of the deposit, solution pH, and surface morphology. However, the most important was found to be thermal stress for the total stress of Al substrate, because of high thermal expansion coefficient of the aluminum substrate.

• YAKHAK HOEJI
• /
• v.16 no.4
• /
• pp.155-161
• /
• 1972

The hydrolysis of phenobarbital is decelerated in alkaline solution by betacyclodextrin. The betacyclodextrin inhibits the degradation of phenobarbital up to 1.5 fold in the system containing 1% betacyclodextrin. The degradation mechanism in systems containing betacyclodextrin is the same that in system without complexing agent, although the rate constants are different. The pH dependence of the hydrolysis rate deceleration is compared with the ionization percent of betacyclodextrin. The results indicate that a direct relationship does not exist between the ionization of betacyclodextrin. It seems reasonable therefore that the phenobarbital undergoes a stable complex with betacyclodextrin and complex formation would provide a better shield for the phenobarbital from hydroxyl ion attack.

• Transactions on Electrical and Electronic Materials
• /
• v.4 no.2
• /
• pp.1-4
• /
• 2003

The purpose of this study was to investigate the characteristics of slurry including phosphoric acid for chemical-mechanical planarization of copper and tantalum nitride. In general, the slurry for copper CMP consists of alumina or colloidal silica as an abrasive, organic acid as a complexing agent, an oxidizing agent, a film forming agent, a pH control agent and additives. Hydrogen peroxide (H$_2$O$_2$) is the material that is used as an oxidizing agent in copper CMP. But, the hydrogen peroxide needs some stabilizers to prevent decomposition. We evaluated phosphoric acid (H$_3$PO$_4$) as a stabilizer of the hydrogen peroxide as well as an accelerator of the tantalum nitride CMP process. We also estimated dispersion stability and zeta potential of the abrasive with the contents of phosphoric acid. An acceleration of the tantalum nitride CMP was verified through the electrochemical test. This approach may be useful for the development of the 2$\^$nd/ step copper CMP slurry and hydrogen peroxide stability.

• Bulletin of the Korean Chemical Society
• /
• v.26 no.5
• /
• pp.781-785
• /
• 2005

A fast and reliable method for the selective separation and preconcentration of $Cu^{2+}$ ions using homogeneous liquid-liquid extraction was developed. A new $\alpha$-dioxime derivative (2H-1,4-benzothioazine-2,3(4H)dionedioxime, Dioxime I) was synthesized and investigated as a suitable selective complexing ligand for $Cu^{2+}$ ions. Zonyl FSA (FSA) was applied as a phase-separator agent under the slightly acidic pH conditions. Under the optimal experimental conditions ([FSA] = 3.2% w/v, [THF] = 19.5% v/v, [Dioxime I] = 1.9 ${\times}\;10^{-3}$ M, and pH = 4.7), 10 ${\mu}g\;of\;Cu^{2+}$ in 5.2 mL aqueous phase could be extracted quantitatively into 80 $\mu$L of the sedimented phase. The maximum concentration factor was 65-fold. The limit of detection of the proposed method was 0.005 ng $mL^{-1}$. The reproducibility of the proposed method, on the 10 replicate measurements, was 1.3%. The influence of the pH, type and volume of the water-miscible organic solvent, concentration of FSA, concentration of the complexing ligand and the effect of different diverse ions on the extraction and determination of $Cu^{2+}$ ions were investigated. The proposed method was applied to the extraction and determination of $Cu^{2+}$ ion in different synthetic and natural water samples.

• Journal of the Korean institute of surface engineering
• /
• v.19 no.2
• /
• pp.31-43
• /
• 1986

The properties of the electroless nickel deposit mainly depends on the pH of the bath, the plating temperature, and the molar ratio of nickel to hypophosphite but they are also affected by its formulation and concentration of complexing and buffering agents. According to changeing the concentration of triethanolamine and boric acid, phosphorous contents, microsturcture, crystalline, hardness and wear resistance of deposits obtained from ammoniacal alkaline bath were investigated by EPMA, differential thermal analyser, X-ray diffractometer and wear tester. The results are as follows; (1) Increasing concentration of triethanolamine in the bath, the deposits is slightly inclined to increase its phosphorous content(3.7% P). (2) In the as-plated state, the deposits are not crystallized state but they are thermally unstable phase, and they are crystallized with precipitating $Ni_3P$ at 400$^{\circ}C$. (3) The deposit containing 2.3% P has higher hardness value in the as plated and heat treated state at below 300$^{\circ}C$ than those of 3.7% phosphorous deposit (1090Hk). But in the case of heat treating at 400$^{\circ}C$, the former has lower hardness value (1000Hk) than the latter and has remarkably Ni(III) orientation by heat treatment. (4) The 3.7% phosphorous deposit heat treated at 400$^{\circ}C$ has better wear resistance than hard chromium plating.

• Corrosion Science and Technology
• /
• v.13 no.3
• /
• pp.107-111
• /
• 2014

Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.