• Macromolecular Research
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• v.16 no.6
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• pp.503-509
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• 2008

A series of colorless polyimide (PI) nanocomposite films were synthesized from 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFDB) with various organoclay contents by solution intercalation polymerization to poly(amic acid)s, followed by thermal imidization. The variation with the organoclay content of the thermomechanical properties, morphology, and optical transparency of the hybrids was examined at organoclay loadings ranging from 0 to 1.0 wt%. The hybrid films showed high optical transparency and almost no color, with cut-off wavelengths ranging from 352 and 356 nm and very low $b^*$ values of 1.19-1.77. The hybrid PI films showed good thermal properties with a glass transition temperature of $280-287^{\circ}C$. Most films did not show any significant thermal decomposition below $490^{\circ}C$. The addition of only a small amount of organoclay was sufficient to improve the tensile properties of the PI films with maximum enhancement being observed at 0.25 wt% organoclay. Moreover, these PI hybrids also had low coefficients of thermal expansion (CTE).

• Polymer(Korea)
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• v.34 no.5
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• pp.480-484
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• 2010

A series of poly(amic acid)s(PAAs) was prepared by reacting 4,4'-(4,4'-isopropylidenediphenoxy) bis(phthalic anhydride)(BPADA) as the anhydride monomer and 2,2'-bis(trifluoromethyl) benzidine (TFB), bis(3-aminophenyl)sulfone (APS), 4,4'-methylenebis-(2-methylcyclohexylamine) (MMCA), or bis[4-(3-aminophenoxy) phenyl] sulfone (BAPS) as the amine monomer with 5 mol% melamine in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the PAAs at various heat treatment temperatures. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA), and their optical transparency were measured by spectrophotometry. The coefficient of thermal expansion (CTE) and yellow index (YI) values of all samples were in the range of $48.53-64.24ppm/^{\circ}C$ and < 3.0, respectively.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.266-270
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• 2012

A series of polyimide was prepared by reacting 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) as the anhydride monomer and 2,2'-bis(trifluoromethyl)benzidine (TFB), 2,2'-bis(3-aminophenyl)hexafluoropropane (BAFP), 2,2'-bis(3- amino- 4-methylphenyl) hexafluoropropane (BAMF), bis(3-aminophenyl)sulfone (APS), p-xylyenediamine (p-XDA), or m-xylyenediamine (m-XDA) as the amine monomer in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the poly(amic acid)s (PAAs) solution at various heat treatment temperatures. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) and the mechanical properties were investigated using universal tensile machine (UTM), Their optical transparencies were also investigated using ultraviolet-visible (UV-vis.) spectrophotometry and colorimetry. The yellow index (YI) and coefficient of thermal expansion (CTE) values of all PIs were in the range 0.98~2.76 and 25.73~55.23 $ppm/^{\circ}C$, respectively.

• Polymer(Korea)
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• v.34 no.6
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• pp.495-500
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• 2010

Crosslinked PI films were synthesized from 4,4'-(hexafluoro isopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy) phenyl] sulfone(BAPS) with various ratios of the reactive monomer cis-4-cyclohexene-1,2-dicarboxylic anhydride(CDBA). We prepared crosslinked poly(amic acid) (PAA) using a 0.1 wt% Grubbs catalyst as a crosslinking agent. The crosslinked PAA was heat-treated at different temperatures to give PI films. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry(DSC), thermogravimetric analysis(TGA), thermo-mechanical analysis(TMA), and universal tensile machine(UTM), and their optical transparencies were investigated using UV-vis. spectrophotometry. The thermomechanical properties of the PI films improved with increasing CDBA content. However, the optical transparency of the PI films decreased slightly with increasing CDBA content.

• Polymer(Korea)
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• v.34 no.5
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• pp.391-397
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• 2010

Poly(amic acid)(PAA) was prepared by reaction of bicyclo(2,2,2)oct-7-ene-2,3,5,6-tetracarboxylicdianhydride(BTDA) containing double bond for crosslinking and bis[4-(3-aminophenoxy) phenyl] sulfone(BAPS) in N,N-dimethylacetamide(DMAc). The cast film of PAA was heat-treated at different temperatures to create polyimide(PI) films. With increasing thermal crosslinking temperatures from 250 to $350^{\circ}C$, the thermo-mechanical properties, degree of crosslinking, and optical transparency of the cross-linked PI were investigated. The maximum enhancement in the thermo-mechanical properties was observed at a heat treatment condition of $350^{\circ}C$. However, the optical transparency was found to be optimal for $250^{\circ}C$ heat treatment. The degree of crosslinking in NMR was determined to be 85% to 93% with increasing annealing temperature conditions from 250 to $350^{\circ}C$.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.633-636
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• 2008

A series novel films of polyimide (PI) and co-polyimide (Co-PI) containing fluorine with colorless, flexible properties was prepared by a two-step process from various commercial aromatic monomers such as 4,4'-(Hexafluoro iso propylidene) diphthalic anhydride (6FDA), 2,2'-Bis(Trifluoromethyl) benzidine (TFDB), 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (AH6FP) and Bis(4-(3-aminophenoxy)phenyl)sulfone (BAS). Furthermore, these obtained transparent and flexible Co-PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) around of $500^{\circ}C$ and the glass transition temperature ($T_g$) in the range of $275-350^{\circ}C$.

• Polymer(Korea)
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• v.32 no.3
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• pp.256-262
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• 2008

Copolyimides containing pendant trifluoromethyl ($CF_3$) groups were synthesized from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy)phenyl]sulfone (BAPS) with various concentrations of 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane(BAPP) to poly(amic acid)(PAA), followed by thermal imidization. These copolyimides were readily soluble in N,N'-dimethylacetamide (DMAc) and could be solution-cast into a flexible and tough film. The thermomechanical properties, morphology and an optical transparency of the copolyimide films were determined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), wide angle X-ray diffraction (XRD), scanning electron microscopy (SEM), universal tensile machine (UTM), and a UV-Vis spectrometer. The cast copolyimide films exhibited high optical transparency with a cut-off wavelength (${\lambda}_0$) of $275{\sim}319\;nm$ in UV-vis absorption and a low yellow index(YI) value of $3.65{\sim}10.37$. The thermo-mechanical properties of copolyimide films were enhanced linearly with increasing a BAPP content. In contrast, the optical transparency of the copolyimide films was found to get worse with increasing a BAPP content.

• Polymer(Korea)
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• v.39 no.2
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• pp.275-280
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• 2015

Two series of copolyimides (Co-PIs) were prepared by reacting 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 1,2,4,5-benzentetra carboxylic dianhydride (pyromellitic dianhydride) (PMDA), as dianhydrides based on 4,4'-biphthalic anhydride (BPA) and 2,2'-bis(trifluoromethyl)benzidine (TFB) by using thermal- and chemical imidizations. Co-PIs films with different dianhydride monomer compositions were compared in terms of their thermal properties and optical transparencies. The addition of PMDA was more effective than the addition of 6FDA for improving the thermal properties. Meanwhile, 6FDA is more effective in optical transparencies.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1430-1432
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• 2009

The effect of different annealing methods on the sheet resistance of indium tin oxide (ITO) on polyimide (PI) substrate has been investigated. As electro-annealing induced the predominant growth of crystallites of ITO thin films along (400) plane, the sheet resistance of ITO films that were electro-annealed for 2 mA at $180^{\circ}C$ considerably decreased from 50 to 28 ${\Omega}/cm^2$.

• Polymer(Korea)
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• v.38 no.4
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• pp.510-517
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• 2014

A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.